Kevin Distelhurst

• MS Electrical Engineering
• Engineer at GlobalFoundries Inc.

III-V power electronic devices are a growing industry as electric vehicles (EVs), power-demanding servers, and other high-power electronics become more prominent. The design of these devices can alter a failure analysis lab’s process flow typically used on traditional silicon-based logic devices. One such obstacle is backside fault isolation (FI) t...

Analog components are still an important aspect of our society's electronic portfolio. They play a role in the emerging and expanding 5G electronic industry, for instance. The NPN bipolar junction transistor (BJT) is the foundation of many analog circuits and has continually evolved to meet more demanding specifications [1], [2]. Certain embodiment...

Advanced packages such as 2.5D will continue to grow in demand as performance increases are needed in various applications. Failure analysis must adapt to the changes in the interfaces, materials and structures being developed and now utilized. Traditional techniques and tools used for selectively removing materials to isolate and analyze defects n...

The limitations of Moore’s Law have led to alternatives in semiconductor packages that provide more functionality. Stacking multiple chips in 2.5D and 3D configurations has become a common solution. During the development of these technologies, test chains of chip to chip micro bumps and thru silicon via’s (TSV’s) at various regions within the stac...

Magnetic Field Imaging (MFI) and Thermal Laser Stimulation (TLS) failure analysis (FA) techniques (e.g. OBIRCH, XIVA, ect.) both have advantages and disadvantages. The obstacles encountered from these techniques may hinder further fault isolation (FI), lengthen turn-around-time and/or detract from actionable results. MFI using a Giant Magneto Resis...

An electrically open defect on a laminate may not always be found timely or successfully due to the lack of fault isolation techniques for this type of defect. This is partly due to needing high frequency techniques to isolate the location of the open. Magnetic field imaging (MFI) using a Superconducting Quantum Interference Device (SQUID) is a tec...

Many articles and books have been written that discuss and study the techniques of lean thinking and methodologies. The applications of these methodologies have included such industries as manufacturing, health care, and information technology. Application to analytical laboratories has been rare or non-existent due to the inability to apply lean m...