Justin Nduhura Munga

• Professor
• (Associate) at University of Kinshasa

In a context of globalization where economic transactions are consumed at a very high pace, being able to rapidly move from a place to another is key in our society. This is especially true in developing countries where technology is not very developed. People need face-to-face meeting to conclude deals or consume activities. However, the reality t...

Ce livre présente sept raisons d’échec des projets informatiques dans le monde industriel. Ces raisons sont décrites et soutenues par des exemples concrets au travers des expériences vécues dans des entreprises nationales et internationales. L’accent est mis sur les causes qui peuvent sembler évidentes mais qui en réalité ne le sont pas. Chaque exe...

Dans cet ouvrage, nous avons travaillé sur le problème de la mise œuvre des plans de contrôle dynamique au sein d'un environnement semi-conducteur multi-produits. Nous nous sommes focalisés sur le compromis entre le rendement et le temps de cycle, la réduction du nombre de contrôles sans valeur ajoutée, et l'optimisation de l'utilisation de la capa...

In a globally competitive environment, sustaining high yield with a minimum number of quality controls is key for manufacturing plants to remain competitive. In modern semiconductor manufacturing facilities, with the moves to ever smaller geometries and the variety among products to be run concurrently, designing efficient control plans is becoming...

This paper presents a novel indicator called PIC (Permanent Index per Context) and it uses to support industrial implementation of dynamic control plans in semiconductor manufacturing. This indicator is based on a counter that helps handling a very large amount of data and compute several types of risk indicators with little CPU. The PIC has first...

This paper reviews sampling techniques for inspection in semiconductor manufacturing. We discuss the strengths and weaknesses of techniques developed in the last last 20 years for excursion monitoring (when a process or machine falls out of specifications) and control. Sampling techniques are classified into three main groups: static, adaptive, and...

In a worldwide environment, sustaining high yield with a minimum number of quality controls is key for manufacturing plants to remain competitive. In high-mix semiconductor plants, where more than 200 products are concurrently run, the complexity of designing efficient control plans comes from the larger amount of data and number of production para...

Dans cette thèse, nous avons travaillé sur le problème de la mise œuvre des plans de contrôle dynamique au sein d'un environnement semiconducteur multi-produits. Nous nous sommes focalisés sur le compromis entre le rendement et le temps de cycle, la réduction du nombre de contrôles sans valeur ajoutée, et l'optimisation de l'utilisation de la capac...

Optimisation des contrôles durant la fabrication des semiconducteurs

In order to optimize the number of controls in semiconductor manufacturing, a Permanent Index per Context (IPC) has been developed to evaluate in real-time the risk on production tools. Depending on the context which can be defined at tool level, chamber level or recipe level, the IPC allows a very large amount of data to be managed and helps to co...

In order to minimize yield losses due to excursions, when a process or a tool shifts out of specifications, an algorithm is proposed to reduce the scope of analysis and provide in real time the number of lots potentially impacted. The algorithm is based on a Permanent Index per Context (IPC). The IPC allows a very large amount of data to be managed...

Worldwide competition, the move to ever smaller geometries in manufacturing processes, and the increasing of complexity in High-Mix semiconductor plants led to the introduction of numerous controls at different manufacturing stages. However, with the costs associated to metrology, i.e. non added value operations, it becomes increasingly important a...

Optimisation des contrôles dans une unité de fabrication des semi-conducteurs

The paper introduces a novel approach to minimize the number of controls in the Defectivity area