Jason John Keleher

Jason John Keleher
Lewis University · Chemistry Department

PhD Chemistry (Clarkson University)

About

49
Publications
3,070
Reads
How we measure 'reads'
A 'read' is counted each time someone views a publication summary (such as the title, abstract, and list of authors), clicks on a figure, or views or downloads the full-text. Learn more
342
Citations
Additional affiliations
August 2014 - August 2018
Lewis University
Position
  • Chair
July 2009 - July 2014
Lewis University
Position
  • Professor (Assistant)
January 2005 - June 2009
Cabot Microelectronics
Position
  • Researcher
Education
August 1994 - May 2004
Clarkson University
Field of study
  • Chemistry

Publications

Publications (49)
Article
Full-text available
Due to the continued miniaturization of semiconductor devices, slurry formulations utilized in the chemical mechanical planarization (CMP) process have become increasingly complex to meet stringent manufacturing specifications. Traditionally, in shallow trench isolation (STI), CMP, a contact cleaning method involving a poly(vinyl alcohol) (PVA) bru...
Article
As integrated circuit and logic device feature sizes approach the 3-nm node, limiting induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning) is of utmost importance. The CMP process can cause various defects, and they can be classified as mechanical (i.e., scratching), chemical (i.e., corrosion...
Article
Wide band gap (WBG) materials (i.e. Silicon Carbide (SiC)) are rapidly emerging in the semiconductor arena because of their properties (i.e. high capacitance, thermal stability, and wear resistance), which allow these substrates to be used as insulating wafers and transistors in integrated circuits (IC). During CMP, removable defects (i.e. particle...
Article
As features on integrated circuits (IC) continue to shrink, the implementation of chemical mechanical planarization (CMP) is a critical processing step to reduce surface topography in an effort to continue to extend Moore’s law. Specifically, Cu CMP utilizes complex slurry formulations containing an abrasive nanoparticle (SiO 2 ) and additives (i.e...
Article
Incorporating biomimetic polymers to develop a conducting nanocomposite material is a viable solution to address the problematic charge-transfer limitations that are common to carbon-based electrodes. Additionally, the variability associated with reported power density performance is due to the wide variety of carbon electrode functionalization tec...
Article
The Chemical Mechanical Planarization (CMP) process can cause various defects, and they can be classified as mechanical (i.e., scratching), chemical (i.e., corrosion), or physiochemical (i.e., adsorbed contaminants) according to the mechanism of formation. Traditionally, a contact cleaning method involving a poly-vinyl alcohol (PVA) brush is used t...
Poster
Full-text available
Hydrogels have gained significant attention as biomimetic scaffolds that incorporate organic or inorganic additives to produce nanocomposites matrices with tunable properties for applications ranging from advanced wound management to conductive materials for microbial fuel cells. Previous work has touched on the biomimetic and thermally stable algi...
Poster
Full-text available
Preliminary results for project progression in conductive applications of bio-nanocomposites
Cover Page
Full-text available
Our ACS Applied Bio Materials article titled "Harnessing Fe(III)–Carboxylate Photochemistry for Radical-Initiated Polymerization in Hydrogels" is featured on the July 2021 issue (Volume 4, Issue 7).
Article
Full-text available
As technology continues to expand beyond that predicted by Moore’s Law the need to alter chemical mechanical planarization (CMP) processes to meet consumer demands is critical. To achieve higher oxide material removal rates (MRR), slurry formulations have become more complex by implementing rate enhancing additives to increase the slurry’s chemical...
Poster
Full-text available
The growing use of hydraulic fracking has resulted in an exponential increase in ground water pollution resulting from the deposition of heavy metals into underground aquifers. Currently, no standardized processes exist to remediate these issues; therefore, utilizing biomass-based materials to sorb heavy metals from hard water is a viable option fo...
Article
Due to the emergence of sub-7 nm technologies, next generation CMP slurry formulations have continued to increase in additive (nanoparticle and chemistry) complexity to meet stringent device specifications. Therefore, it is essential to probe the molecular level interactions at the nanoparticle/slurry chemistry/substrate interface and in turn corre...
Article
We have shown how different micellar (SDBS) vs. polyelectrolytic (PSSA) supramolecular assemblies in post-CMP cleaning solutions differ in their tribological performance when used in a novel PVA scrubber for 300-mm silicon dioxide wafer cleaning. Significant differences in real-time shear force and coefficient of friction data from the wafer-soluti...
Article
Understanding the chemical and mechanical components of supramolecular cleaning chemistries for post-STI CMP cleaning is paramount in reducing defectivity for the continued miniaturization of advanced technologies. Therefore, macroscopic cleaning performance metrics can be correlated to critical non-covalent interactions probed at the molecular sca...
Article
Supramolecular nanocomposite materials have emerged as a leading interdisciplinary research area that exploits synergistic relationships at the nanoscale to enhance properties (mechanical and chemical) of next-generation biopolymeric materials. Hydrogels synthesized from natural biopolymers have emerged due to their intrinsic properties such as non...
Chapter
A competition was designed, involving local high schools from varying socioeconomic backgrounds to tackle an open-ended problem related to water desalination and purification. The teams were presented with the following scenario: Your team has been Shipwrecked on an abandoned island where the only drinkable water was contaminated from the wreck and...
Article
Full-text available
Decoupling the key interfacial mechanisms (chemical and mechanical) present during Cu CMP is critical to the development of slurry/pad consumable sets to reduce defectivity at advanced technology nodes. Understanding the Prestonian relationship, or lack thereof, can give rise to correlations between film density as a result of passivation film kine...
Conference Paper
With the rapid miniaturization of advanced technologies, limiting device defects has become of utmost importance in maintaining high performing integrated circuits. Shallow trench isolation (STI) chemical mechanical planarization (CMP) uses a synergistic balance of ceria (CeO2) nanoparticles and functional chemistry to modulate surface adsorption i...
Article
Full-text available
Due to the emergence of sub-10 nm technologies, next generation slurries have continued to increase in complexity to meet stringent device performance demands. Prior to the chemical mechanical planarization (CMP) process, point-of-use filtration (POU) is implemented in order to limit particle aggregates and ultimately decrease surface defects. This...
Article
The synthesis and characterization of a biomimetic composite material composed of cellulose acetate embedded with a copper‐based metal‐organic framework, MOF‐199 (HKUST‐1), is reported and has been investigated for use as an adsorbent material in water remediation. Incorporation of MOF‐199 into cellulose acetate enhances the stability of the metal‐...
Poster
Fabrication of integrated circuits (IC) in the sub-micron regime utilizes shallow trench isolation (STI) to separate active circuits with a dielectric material, tetraethyl orthosilicate (TEOS). CMP is used to remove the excess TEOS layer to achieve planarity and expose the underlying structure without inducing defects. In an ideal system, the remov...
Poster
Electrical isolation within a desired circuit requires shallow trench isolation (STI) to separate active regions with tetraethyl orthosilicate (TEOS) filled trenches. STI chemical mechanical planarization (CMP) is used to facilitate bulk oxide removal by selectively targeting TEOS overburden with colloidal suspensions (slurries) containing ceria (C...
Article
Clean and drinkable water is a critical necessity for all human and economic developments; unfortunately, millions of people do not have access to potable water, resulting in the death of over two million children every year. Over the past decade, emphasis has been placed on the synthesis and design of photocatalytic nanocomposites to enhance the c...
Article
Full-text available
The development of novel wound management materials must address several challenges to be most efficacious. Successful wound management should include the ability to adhere to wound surfaces, absorb wound exudates, and enhance bactericidal effectiveness. Few current biomaterials address all of these characteristics and in addition often have poor s...
Article
Full-text available
In 2004, pilots reported 46 laser illumination events to the Federal Aviation Administration (FAA), with the number increasing to approximately 3,600 in 2011. Since that time, the number of reported laser incidents has ranged from 3,500 to 4,000. Previous studies indicate the potential for flight crewmember distraction from bright laser light being...
Conference Paper
Recent dramatic price volatility and assurance of supply concerns with cerium oxide have left many users of this material in an uncertain and vulnerable position. Since few viable alternatives to ceria for precision glass polishing exist, and much of the supply is very concentrated geographically, technology which conserves ceria, improves absolute...
Article
Full-text available
There is interest from environmental organizations and regulating agencies to eliminate lead and reduce pollutants emitted into the atmosphere from general aviation aircraft using 100LL aviation gasoline (Avgas). 100SF (Swift Fuel) is under development by Swift Enterprises as a lead free general aviation alternative fuel product. The purpose of thi...
Article
Forensic scientists use several presumptive tests to detect latent blood stains at crime scenes; one of the most recognizable being the luminol reagent. Luminol, under basic conditions, reacts with an oxidizing species which, with the help of a transition metal catalyst facilitates a luminescent response. The typical oxidizing species used in the l...
Conference Paper
Previous work has shown that the behavior of filters with respect to their use in removing large particles from CMP slurries depends greatly upon the nature of the slurry and the nature of the filter. This work highlighted a significant interaction between abrasive particles and polypropylene, which constitutes most filters used in CMP slurry filtr...
Article
We examine the effects of the nonionic triblock copolymer surfactant Pluronic P103 on three surfaces of different wettability relevant to chemical mechanical planarization (CMP). Two of the surfaces are low-k organosilicate glass (OSG) films, Coral and Black Diamond; the third is a silica surface. Atomic force microscopy (AFM) force curves were use...
Article
Complexing agents in Cu chemical mechanical planarization slurries promote dissolution of the copper surface. We explored the effect of two chelating compounds, ammonium oxalate and oxalic acid, with and without hydrogen peroxide, on the dissolution and surface morphology of a Cu(111) surface at neutral pH. Without hydrogen peroxide, static etch ra...
Article
As device dimensions shrink to the sub-65 nm regime, a greater demand is placed upon the barrier polishing process. Therefore the ability to modulate the barrier chemical mechanical planarization performance window by process and formulation synergy can provide tunability at advanced technology nodes to meet stringent electrical, topography, and de...
Article
We examined the effect of the structure of corrosion inhibitors benzotriazole (BTA) and 1,2,4-triazole (TAZ) on the Cu removal rate during chemical mechanical planarization. Removal rates were higher for solutions containing TAZ than solutions containing BTA. Corrosion inhibitor films were characterized using atomic force microscopy, cyclic voltamm...
Chapter
Introduction Oxidizers Chelating Agents Surfactants [56,57] Abrasive Particles Particle Surface Modification Soft Particles Case Study: Organic Particles as Abrasives in Cu CMP Conclusions Questions References
Article
Chemical Mechanical Planarization (CMP) has become the key planarization technology for the fabrication of ultra large-scale integration (ULSI) silicon devices that contain sub-quarter micron metal and dielectric lines. The rapid integration of copper as the interconnect material into IC production has placed a high demand on Cu CMP slurry developm...
Article
Key issues in CMP today include reduction of surface defectivity and enhancement of planarization efficiency. More specifically, the polished surface should be free of defects such as scratches, pits, corrosion spots, trench copper loss, and residue particles. For copper/low k CMP, one of the most promising strategies to accomplishing these goals i...
Article
Colloidal silver has been known to have unique antimicrobial activity that may be useful in the construction of antibacterial materials (self-cleaning materials) to aid in the fight against bacteria-related infections. In this study, silver-coated TiO2 (Ag/TiO2) particles prepared through the photo-reduction of Ag+ were investigated as an antibacte...
Article
Nanosize diamond particles have been used as abrasives for the development of a first-step slurry for dual damascene copper CMP process. The extreme hardness of the diamond particles yields high material removal rate even at low solid abrasive content. A balanced oxidation-complexation chemistry results in excellent quality of the polished surfaces...
Article
Hydroxyl radicals play an important role in the planarization of copper films using hydrogen peroxide‐based slurries during microelectronic device fabrication. The generation of hydroxyl radicals (*OH) from hydrogen peroxide in the presence of several amino acids and ions was monitored using p‐nitrosodimethylaniline as the *OH trapping agent. Whi...
Article
This laboratory exercise will expose upper-level undergraduate students to the aspect of chemistry known as Chemical Mechanical Planarization (CMP). CMP is used for the fabrication of computer chips and memory devices. Students investigate a representative slurry that is used for copper-based advanced integrated-circuit processes. More specifically...

Network

Cited By

Projects

Project (1)
Archived project
Modifying material surfaces to achieve desired surface properties such as hydrophobicity and pH using natural polysaccharides with the use of light.