Jan Kostelnik

Jan Kostelnik

Dr.-Ing.

About

49
Publications
11,276
Reads
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218
Citations
Introduction
Additional affiliations
February 1992 - present
Independent Researcher
Independent Researcher
Position
  • Head of Department

Publications

Publications (49)
Chapter
This chapter provides an overview of the technology of embedding chips into laminates. The motivation, an overview of technological approaches and the challenges will be outlined. One of the technologies will be described in more detail through a case of an application. Finally a technological outlook is given in consideration of the innovations th...
Article
Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solu...
Article
Die Neue Leiterplatte TWINflex ein umweltgerechtes Leiterplattenkonzept.
Presentation
Full-text available
77. Arbeitskreis SAET in Kooperation mit dem FED -Der Norden grüßt Dresden, 08.12.2021 TEBKO Technologie-und Beratungs-Dienst Kostelnik
Preprint
MFB - 3D - Multi-Functional-Board with printed 3D Structures and Functions.
Cover Page
Das Löten gehört nach wie vor zu den am häufigsten verwendeten Verbindungstechnologien. Nun hat man vor vielen Jahren begonnen, Blei aus der Elektronik zu verbannen. Ist es jetzt dort ganz verschwunden? Nein. Ist das ein Dilemma? Vielleicht. Bisher war das Recycling in der Elektronik eher ein ungeliebtes bzw. kritisch zu bewertendes Thema. Viele ke...
Article
Full-text available
3D Electronics - new solutions for medical applications. 3D Elektronik - neue Lösungen für die Medizintechnik.
Conference Paper
Absence from work caused by overloading the musculoskeletal system lowers the life quality of the worker and gains unnecessary costs for both the employer and the health system. Classical (rigid link) body-worn exoskeletons can help to reduce critical loading but show many disadvantages, preventing exoskeletons from extensive use in industrial envi...
Article
The Authors has been working on the development of stretchable and formable circuits-also known as stretchable and conformable electronics-for several years. In 2016, a technology for the production of stretchable electronic systems based on conventional processes of printed circuit board manufacturing was completed. Since 2018 this technology is a...
Article
Kostelnik and Schreivogel has been working on the development of stretchable and formable circuits – also known as stretchable and conformable electronics – for several years. In 2016, a technology for the production of stretchable electronic systems based on conventional processes of printed circuit board manufacturing was completed. Since 2018 th...
Preprint
Absence from work due to overloading of the musculoskeletal system causes high costs and lower quality of life of manual workers. Classical (rigid link) body-worn exoskeletons can help to reduce critical loading but show many disadvantages, preventing exoskeletons from extensive use in industrial environments. Within the development, we elaborated...
Conference Paper
Networks of distributed interactive micro-implants could enhance the treatment of otoneurological conditions such as tinnitus or restore impaired complex physiological/ motor functions such as gastrointestinal motility or grasping. For this, an electrical stimulation of neural and muscular tissue is a key prerequisite. Challenges in the development...
Conference Paper
Full-text available
Technische Unterstützungssysteme, wie softorthetische Assistenzroboter oder Exoskelette, bilden eine zusätzliche Ebene in der Interaktion zwischen Mensch und Umwelt. Die Kenntnis über den Zustand von physikalischen Größen in dieser Ebene ermöglicht den Einsatz von aktiven, geregelten Unterstützungsmechanismen. Im Kontext körpernaher Unterstützungss...
Article
Full-text available
It is obvious that this smart electronics can also be used in other applications such as robotics as SmartRobotic. a second skin/second smart skin. To be stretchable like a skin and be able to adapt to different shapes: Stretchable and Conformable - two of the new terms for smart electronics - Smart Skins.
Conference Paper
Full-text available
Flexible and Stretchable PCBs for Smart Electronics. The TWINflex Concept. "From Visions To Products - MID and Beyond" -Talk/Paper, Stuttgart
Conference Paper
Full-text available
Stretchable electronic Systems enable new degrees of mechanical freedom in electronics and provide a new level for developers, product designers and artists . The stretchability of the novel printed circuit boards can be realized by use of Polyurethane as a stretchable base material in combination with meander shaped copper conducting paths between...
Article
Flexible circuit carriers with integrated ultra-thin silicon chips are the basis for a new generation of electronic systems. Highly complex silicon chips can now be manufactured very thin, with a thickness of a few micrometers and embedded in thin plastic films using the ECT-μVia (Embedded Component Technology) process. Other functions such as ante...
Conference Paper
In diesem Beitrag wird eine, unter Usability-Aspekten entwickelte, intelligente Orthesen-Weste zur Erhöhung der Ergonomie am Arbeitsplatz vorgestellt, insbesondere bei körperlich belastenden Tätigkeiten in Industrie/Gewerbe oder Pflege. Es werden alle relevanten Aspekte der Entwicklung, beginnend mit Usability- und Nutzeranforderungen, über die kon...
Conference Paper
Full-text available
Abstract Ultra-thin silicon chips embedded inside flexible foils are envisioned to be the basis for an innovative generation of electronic systems. Highly complex silicon chips can be manufactured very thinly, mainly with a thickness of just a few microns and can be embedded in thin plastic films by the ECT-µVia process (Embedded Component Technolo...
Conference Paper
Hybrid System in Foil (HySiF) technology has the potential to combine compact high-performance circuit integration on thin, flexible silicon chips with thin-film large-area components jointly on a polymer foil substrate. In this manuscript, such a HySiF technology demonstrator known as "Smart Skin" is presented. It contains bending stress sensors a...
Data
Application Note: Stretchable Electronics
Poster
Full-text available
Application Note: Stretchable Electronics / TWINflex-Stretch
Book
Printed technologies / electronics for sensors: Subproject: Integration of printed sensor structures The PRONTO - DRUSYM project dealt comprehensively with the systemic integration of printed sensor structures on components made of metals and thermoplastics from different application areas such as automotive or wafer test cards. Functional materi...
Article
Full-text available
Editorial Wearable Electronic – Smart Textile 4.0 {Kostelnik} Dieses Jahr scheint in der Tat ein gewisser Durchbruch für die tragbare Elektronik oder neudeutsch auch Wearable Electronic zu sein. Alle namenhaften Anbieter für Konsum- und Trend-Produkte bieten etwas aus dem Bereich der sogenannten tragbaren Elektronik an. Prominenteste Beispiele sind...
Conference Paper
Printed magnetic field sensors based on toroidal core coils containing ferrite cores were investigated. The coil windings were printed with the Aerosol Jet® process using silver or copper inks. The printed structures were subjected to electroless copper plating in order to increase their conductivity. The ferrite core was placed on PCB based substr...
Article
Full-text available
This paper describes the concept of integrating a temperature measurement system into a firefighter glove. The presented module design for textile integration of a complete wireless temperature measurement system with feedback is using a combination of flexible and stiff circuit parts for suitable textile implementation and the sensor design itself...
Patent
Full-text available
The subject matter of the invention relates to a method of producing a coil integrated in a substrate, using the following steps: creating the cavity in a substrate, said cavity having an open end which interrupts a surface of the substrate, introducing a paste containing ferromagnetic particles into the cavity so as to produce a coil core, closing...
Article
Full-text available
Active and passive electronic components are increasingly integrated within the printed circuit board itself. We are now on the threshold of a further development in which the PCB becomes more than a mere support for components. The printed circuit board is evolving to become ever more the central supporting element in solving construction problems...
Article
Full-text available
Аббревиатура KRAFAS означает оптимальный по затратам радиолокационный датчик для активных систем поддержки водителей. Цель этого проекта, финансируемого правительством ФРГ, — разработка радара расстояния, который был бы более продуктивным и надежным, но в то же время требовал бы значительно меньше затрат, чем уже имеющиеся системы. Сократить затрат...
Conference Paper
Systemintegration in der Mikroelektronik: Embedding-Technologien und ihre Wertschöpfungskette bei elektronischen Baugruppen
Conference Paper
Radar sensors are already employed in production model vehicles e.g. for adaptive cruise control (ACC) systems. Further development of driver assistance systems has also led to the use of radar sensors in active safety systems (active brake assistance, collision warning, emergency braking, etc). However, the costs of manufacturing such radar-based...
Conference Paper
Full-text available
The concept and experimental results to manufacture electrical-optical circuit boards (EOCB) with buried optical waveguides using thin-glass sheets (display glass) are presented. An ion-exchange process was developed to manufacture the graded index waveguides in thin-glass sheets. Besides of their excellent optical properties no mechanical structur...
Patent
Full-text available
In a method for producing an electronic subassembly, at least one electronic component is fixed in place an an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The e...
Article
Full-text available
The following paper presents research on the manufacture of circuit boards with buried optical waveguides using thin-glass sheets (display glass), which represents a further development of earlier research on buried optical waveguide substrates using polymer. An ion-exchange process was developed to manufacture the waveguides in thin-glass sheets,...
Article
Full-text available
Due to ever-faster processor clock speeds, there is a rising need for increased bandwidth to transfer large amounts of data, noise-free, within computer and telecommunications systems. A related requirement is the demand for high bit-rate, short-haul links. Here, optical transmission paths are a viable alternative to high-frequency electrical inter...
Conference Paper
The need for high data rate interconnects within computing and telecommunication equipment is continuously rising. As the performance of electrical interconnects is physically limited through the skin effect, optical interconnects can be used to overcome this problem. Within this paper some results achieved in the frame of the German research and d...
Article
A new-generation interconnect for optical backplane systems based on printed circuits board is presented for transmitting data via integrated multimode polymer optical waveguides both on electro-optical transmitter/receiver processing boards and on optical backplane board. Different developments concerning this system such as optical waveguide tech...
Conference Paper
1. These zur Entwicklung elektronischer Geräte und Baugruppen Das System der Generation X: ist charakterisiert durch einen Standard-“Kern“ (definierter Aufbau und definierte Schnittstellen) welcher durch Programmierung (Software) und äußere Details (optische, taktile, akustische) kundenspezifisch, an die jeweiligen individuellen Bedürfnisse angepa...
Conference Paper
Full-text available
TWINflex – An Environmental Friendly Printed Circuit Board Solution
Article
In the future, even printed circuit boards will have to be environmentally friendly and capable of recycling, properties which they are far from possessing today. In a research project, new wiring sytems are now being developed which are not only environmentally friendly and recyclable but also exhibit certain other advantages.
Article
WISSENSCHAFTLICHE ZEITSCHRIFT-TECHNISCHEN UNIVERSITAT DRESDEN
Article
, Metalloberfläche 48 (4), 260-264, 1994.
Preprint
Full-text available
Preprint - Recycleable PCB Printed Circuit Bord - Recyclinggerechte Leiterplatte - TWINflex - 1993 TU Dresden, Jan Kostelnik
Article
Aufgrund der wachsenden Taktfrequenz von Prozessoren steigt der Bedarf an Bandbreite zur störungsfreien Übertragung großer Datenmengen innerhalb von Rechner¬- und Telekommunikationssystemen stetig an. Für die damit verbundene Forderung nach hoch bitratigen Kurzstreckenverbindungen stellen optische Übertragungsstrecken eine sinnvolle Alternative zu...

Questions

Question (1)
Question
What are the advantages of low temperature solders, such as SnBi, SnBiAg?

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