Haruki Okumura

Haruki Okumura
Japan Research Lab. · board of directors

PhD

About

13
Publications
497
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157
Citations

Publications

Publications (13)
Article
Full-text available
Adhesion is one of the most important technologies for modern technology. However, it is not easy to elucidate the adhesion mechanism because of the multiplicity of influencing factors and also the difficulties in analyzing the interface. Therefore, it is important to set purpose and hypothesis in analysis of adhesion. The analysis is for verifying...
Article
Modern techniques including coating, semiconductor deposition and others are dominated by adhesive technology. However, it is not easy to elucidate the adhesion mechanism because of the multiplicity of influencing factors and also the difficulties in analyzing the interface. The present paper explains the adhesive factors and surface analysis and d...
Article
We investigated that the structural changes in the depth direction of the bottom layer for multi layer process and the effects on improving the resistance against the dry etching process by H2 plasma curing. Diamond like amorphous carbon structure that included sp2 and sp3 carbon cluster was generated near the surface by H2 plasma treatment. The di...
Article
In the device manufacture after 45nm node utilization of a high precision carbon hard mask (C-HM) process is an important issue. We examined additional H2 plasma hardening treatment to the bottom organic layer in a conventional multi-layer resist process. Improved results in LWR caused by etching, which is called "wiggling", were obtained. Chemical...
Article
The gradient shaving preparation was recently introduced as a new pretreatment technique for depth profiling. We can obtain a chemically undamaged slope with a length of several hundred micrometers by shaving linearly for a thickness ranging from a few nanometers to a few hundred nanometers. To analyze the chemical structure in organic compounds we...
Article
The structural changes in the depth direction of ArF model resist with the VUV curing and/or the dry etching process were investigated by the combined use of a gradient shaving preparation and micro-FTIR line scanned measurements. The effect on the improvement in the resistance against the dry etching process by the VUV curing was also clarified. I...
Article
The depth profile of the chemical changes in polycarbonate after photochemical degradation was investigated by infrared reflection spectroscopy with gradient shaving preparation. In addition, a spectral simulation technique to interpret the infrared ATR spectra with multiple angles of incidence was applied. The polycarbonate plates were photo-irrad...
Article
The structural change in the depth direction of a polyimide (UPILEX-S) film treated in alkaline solution, which was a representative surface treatment used to form a seed layer for plating and to improve the adhesive strength, was analyzed by means of micro Fourier transform infrared attenuated total reflection (FTIR-ATR) line analysis with gradien...
Article
In order to make the enhancement of dry etching durability of methacrylate-based ArF resists induced by VUV curing consistent with low film shrinkage, i.e., less CD deviation, characteristics of several methacrylate-based polymers were studied. It was found that the film shrinkage mainly depended on the side chain structures and polymers containing...
Article
Structural distribution at different depths in a novolac photoresist after boron ion implantation was analysed using infrared spectroscopy with gradient shaving preparations and spectral simulation techniques. The generation of graphite-like structures and B–O and/or B–C bonding was observed only near the surface at approximately ∼0.1 µm for a samp...
Article
Full-text available
In this work we propose a standard practice covering temperature calibration of a Si substrate, ranging from 400 to 1000 °C, for temperature programmed desorption (TPD) analysis. The practice consists of heating silicon calibration materials at a controlled rate in a TPD instrument, measuring characteristic desorption peak temperatures, and quadrat...
Article
Generalized two-dimensional (2D) correlation spectroscopy is applied to thermal desorption spectroscopy (TDS) to investigate the thermal degradation process of poly vinyl chloride (PVC)/dioctyl phthalate (DOP) mixture in ultra high vacuum. The 2D TDS approach clearly reveals that the desorption process of DOP and PVC degradation have multi stages....
Article
A depth profiling method is proposed and an application to a study for cellulose/poly (vinyl alcohol) (PVA) blend films by angular-dependent ESCA is presented. The depth profiling method consists of a two-step fitting of a depth profile function in addition to an employment of a flatlayer model proposed by Pijolat et al., which reduces significantl...

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