Dishit Paresh Parekh

Dishit Paresh Parekh
IBM Research · AI Hardware Center

PhD in Chemical Engineering

About

24
Publications
7,099
Reads
How we measure 'reads'
A 'read' is counted each time someone views a publication summary (such as the title, abstract, and list of authors), clicks on a figure, or views or downloads the full-text. Learn more
946
Citations
Citations since 2017
21 Research Items
936 Citations
2017201820192020202120222023050100150200
2017201820192020202120222023050100150200
2017201820192020202120222023050100150200
2017201820192020202120222023050100150200
Introduction
• Actively pursuing process and materials research in the area of heterogeneous integration technology for next-gen semiconductor devices at IBM Research. • As a PhD graduate from the Department of Chemical and Biomolecular Engineering at NC State University, my research project focused on the materials and process technology development for fabrication of flexible and stretchable printed electronics and its applications in the field of biosensing and energy harvesting. • Here is a glimpse of my research work: https://www.youtube.com/watch?v=MK65esnRgsc
Additional affiliations
August 2014 - December 2014
North Carolina State University
Position
  • Research Assistant
Description
  • I TAed a Chemical Engineering course called Thermodynamics II (CHE 316) where I held office hours and helped students in reviewing the course contents taught by the instructor.
January 2014 - May 2014
North Carolina State University
Position
  • Research Assistant
Description
  • I TAed a Chemical Engineering course called Chemical Process Principles (CHE 205) where I took problem sessions for the class and helped students in reviewing the course contents taught by the instructor.
October 2010 - December 2010
Institute of Chemical Technology, Mumbai
Position
  • Research Assistant
Description
  • During this period, I worked in the field of Extraction and Stripping of heavy earth metals with an emphasis on using theory and mathematical modeling with simulations to the underlying physical phenomenon and experimental results.
Education
August 2013 - August 2018
North Carolina State University
Field of study
  • Chemical and Biomolecular Engineering
August 2009 - May 2013
Institute of Chemical Technology, Mumbai
Field of study
  • Chemical Engineering
August 2007 - May 2009
South Indian Education Society (SIES)
Field of study
  • Science

Publications

Publications (24)
Article
This work establishes that static contact angles for gallium-based liquid metals have no utility despite the continued and common use of such angles in the literature. In the presence of oxygen, these metals rapidly form a thin (∼1-3 nm) surface oxide "skin" that adheres to many surfaces and mechanically impedes its flow. This property is problemat...
Article
This paper demonstrates and characterizes a simple ink for nanopatterning of solid metallic structures under ambient conditions by taking advantage of the low melting point of gallium and its affinity to form intermetallics with other metals. Bare copper micro- and nanoparticles readily mix with liquid gallium near room temperature to form a paste...
Article
Full-text available
Herein, elastomeric fibers that have shape memory properties due to the presence of a gallium core that can undergo phase transition from solid to liquid in response to mild heating are described. The gallium is injected into the core of a hollow fiber formed by melt processing. This approach provides a straightforward method to create shape memory...
Article
Gallium and its alloys react with oxygen to form a native oxide that encapsulates the liquid metal with a solid 'skin'. The viscoelasticity of this skin is leveraged in applications such as soft electronics, 3D printing and components for microfluidic devices. In these applications, rheological characterization of the oxide skin is paramount for un...
Article
Gallium‐based metal alloys have high electrical conductivity in the liquid state at room temperature. These liquid metal conductors inspire unique electronic applications such as reconfigurable circuits and stretchable components with extremely high strain tolerance. Previously, liquid metals have been successfully patterned via direct‐writing, yie...
Conference Paper
Full-text available
The principal challenge in developing a new thermal interface material (TIM) is to co-design its micro-attributes (e.g. filler type, packing fraction, size distribution) that simultaneously ensure high effective thermal conductivity (keff), low elastic modulus (Eeff) and low viscosity (ηeff). Today there exists little physical insight into size dis...
Article
Full-text available
Tough, biological materials (e.g., collagen or titin) protect tissues from irreversible damage caused by external loads. Mimicking these protective properties is important in packaging and in emerging applications such as durable electronic skins and soft robotics. This paper reports the formation of tough, metamaterial-like core-shell fibers that...
Article
Flexible and stretchable electronics are poised to enable many unique applications that cannot be realized with traditional, rigid devices. One of the most promising options for low-cost stretchable transistors are printed carbon nanotubes (CNTs). However, a major limiting factor in stretchable CNT devices is the lack of a stable and versatile cont...
Article
This paper describes the fabrication and characterization of a microstrip patch array and a 3D coaxial feed network embedded within a 3D printed part. Internal cavities within the acrylic structure are filled with a gallium-based liquid metal alloy using a vacuum-driven process to form conducting elements. In this way, four rectangular patch elemen...
Patent
Flexible thermoelectric generators and methods of manufacturing are disclosed. In one embodiment, a flexible thermoelectric generator includes a plurality of pillars, a first and a second plurality of flexible interconnects, and a flexible material. The plurality of pillars having a first side and a second side. The first plurality of flexible inte...
Article
Traditional hollow metallic waveguide manufacturing techniques are readily capable of producing components with high-precision geometric tolerances, yet generally lack the ability to customize individual parts on demand or to deliver finished components with low lead times. This paper proposes a Rapid-Prototyping (RP) method for relatively low-loss...
Article
This paper describes a facile method to fabricate complex three-dimensional (3D) antennas by vacuum filling gallium-based liquid metals into 3D printed cavities at room temperature. To create the cavities, a commercial printer co-prints a sacrificial wax-like material with an acrylic resin. Dissolving the printed wax in oil creates cavities as smal...
Article
Interest in wearable electronics for continuous, long-term health and performance monitoring is rapidly increasing. The reduction in power levels consumed by sensors and electronic circuits accompanied by the advances in energy harvesting methods allows for the realization of self-powered monitoring systems that do not have to rely on batteries. Fo...
Article
Full-text available
3D printing of polymers is accomplished easily with thermoplastics as the extruded hot melt solidifies rapidly during the printing process. Printing with liquid polymer precursors is more challenging due to their longer curing times. One curable liquid polymer of specific interest is polydimethylsiloxane (PDMS). This study demonstrates a new effici...
Article
This paper demonstrates a simple method to fabricate 3D microchannels and microvasculature at room temperature by direct-writing liquid metal as a sacrificial template. The formation of a surface oxide skin on the low-viscosity liquid metal stabilizes the shape of the printed metal for planar and out-of-plane structures. The printed structures can...
Conference Paper
3-D printing is an emerging technology that has been used primarily on small scales for rapid prototyping, but which could also herald a wider movement towards decentralized, highly customizable manufacturing. Polymers are the most common materials to be 3-D printed today, but there is great demand for a way to easily print metals. Existing techniq...

Questions

Question (1)
Question
I am researching to make a list of all the possible challenges associated with 3D printing of electronics and why they haven't been in the mainstream as a manufacturing tool using direct-write technologies.

Network

Cited By