Ding-Jun Huang

National Taiwan University | NTU · Department of Mechanical Engineering

The increase in the number of transistors in electronic circuits has increased the power density of electronic devices, which leads to the formation of hotspots on the microchips of the electronic devices. Hotspots deteriorate the lifespan and reliability of electronic devices. With the advantages of high thermal conductivity (κ), low cost, and fea...

In this paper, wettability gradient pattern is applied to condensation heat transfer on a copper tube surface. For this application, the vital issue is how to fabricate gradient patterns on a curve tube surface to accelerate the droplet collection efficiently. For this purpose, novel fabrication processes are developed to form wettability gradient...

In this study, a screen-printing technique is utilized to fabricate a wettability-gradient surface on a copper substrate. The pattern definitions on the copper surface were freely fabricated to define the regions with different wettabilities, for which the printing definition technique was developed as an alternative to the existing costly photolit...

Copper is one of the most widely used materials in condensation heat transfer. Recently there has been great interest in improving the condensation heat transfer efficiency through copper surface modification. In this study, we describe the fabrication processes of how copper surfaces were modified to be superhydrophilic (CA ≤ 10°) and superhydroph...