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Publications (7)
The effect that the presence of low-frequency ultrasound has on the deposition rate of an electroless Cu plating process for the metallisation of a Pd activated dielectric material has been preliminarily studied. Continuous ultrasound during electroless Cu plating had little effect on the deposition rate compared with the standard process under mec...
Electroless plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics and packaging industry. Electronic manufacture now requires processes and materials that can meet the demands for miniaturization and reliability since holes and via diameters in both printed cir...
Electroless copper plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics industry. Electroless processes are characterised by high temperature operation and although the effect of ultrasound on electroless plating has been studied for many years, its use as an...
Purpose
– The purpose of this paper is to develop an optimised sonochemical surface modification process which could be operated at low temperature and which uses non‐hazardous chemistry with short treatment times. A range of sonochemical parameters such as ultrasonic intensity/power and process temperature were investigated.
Design/methodology/ap...
The electronics industry has always had a requirement for the surface modification, adhesion promotion and cleaning of a vast array of di-electric substrates and with the emergence of printed electronics the choice of substrate will increase still further as, theoretically, anything that can be printed could become an electronic device. The surface...
This 3 year IeMRC funded project is now nearing completion. The research has demonstrated that sonochemical surface modification can be achieved using less hazardous chemistry than traditional methodology. In particular sonochemical modification can be achieved in water. Through an investigation of parameters that influence the process the effectiv...
The electronics industry has always had a requirement for the surface modification, adhesion promotion and cleaning of a vast array of dielectric substrates.
Achieving good adhesion between these substrates and the conductive tracks is perhaps the most critical stage of the manufacturing process since if the adhesion is poor the device will simply...