Bahaa Abbas

Swansea University | SWAN · Department of Materials Engineering

Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and subsequently sintering in order to establish their...

Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and subsequently sintering in order to establish their...

Copper potentially provides a cost-effective replacement for silver in printed electronic circuitry with diverse applications in healthcare, solar energy, IOT devices and automotive applications. The primary challenge facing copper is that it readily oxidizes to its non-conductive state during the sintering process. Photonic sintering offers a mean...

A widely deployed cellular network, supported by direct connections, can offer a promising solution that supports new services with strict requirements on access availability, reliability, and end-to-end (E2E) latency. The communications between vehicles can be made using different radio interfaces: One for cellular communication (i.e., cellular co...

Thermochemical storage provides a volumetric and cost-efficient means of collecting energy from solar/waste heat in order to utilize it for space heating in another location. Equally important to the storage density, the dynamic thermal response dictates the power available which is critical to meet the varied demands of a practical space heating a...

Copper inks potentially provide a cost effective replacement to silver for printed electronic circuits. In glass based applications such as PV or smart glass, it can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine th...

The effect that the presence of low-frequency ultrasound has on the deposition rate of an electroless Cu plating process for the metallisation of a Pd activated dielectric material has been preliminarily studied. Continuous ultrasound during electroless Cu plating had little effect on the deposition rate compared with the standard process under mec...

Electroless Copper plating is a critical process in printed circuit board (PCB) manufacture where it is employed to make the through holes and vias of a PCB conductive for subsequent electroplating. The most important pre-treatment step before Electroless Copper plating is the catalyst solution where palladium is deposited on the surface of the sub...

Electroless plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics and packaging industry. Electronic manufacture now requires processes and materials that can meet the demands for miniaturization and reliability since holes and via diameters in both printed cir...

Electroless copper plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics industry. Electroless processes are characterised by high temperature operation and although the effect of ultrasound on electroless plating has been studied for many years, its use as an...

The main aims of this project were to:-• Use ultrasound to enhance the plating rate of an electroless copper process at low temperatures • Replace formaldehyde by using another reducing agent, which is more environmentally beneficial to the industry. The effects of ultrasound on the electroless copper plating of epoxy substrates using different fre...