Discussion
Started 23rd Mar, 2022

Free Thermal Simulation Modeling software ?

Is there any Simulation software in free of cost either for heat spreader/absorber application studies?

Most recent answer

29th Mar, 2022
Mathu Sridharpanday
K. S. Rangasamy College of Technology
Dear Prof.Bart Jourquin
Thanks for reaching me out. This application is purely a semiconductor fan-out backside wafer deposition to spread and reduce heat from 200 deg. We try to deposit MoS2 nanosheets as heat spreader (5 um) over Si wafer. Following deposition, SiO2 as thermal interface material (2 um) over MoS2. again, MoS2 deposition ( 5 um) will be carrying out over SiO2 layer. The coating sequence will be Si wafer (520 um)/MoS2 (5um)/SiO2 (2um)/MoS2 (5um) without finn or heat sink. We would like to analyse heat that produce from front side of Si wafer and at backside try to abosord those heat and spread throughout the depositing layer down to room temperature.

All replies (4)

24th Mar, 2022
Bart Jourquin
Université Catholique de Louvain - UCLouvain
Could you specify the type of application to study ?
You'll find lot of commercial softwae, but also some open-source alternatives such as https://github.com/oemof/tespy
24th Mar, 2022
Mohammed el amin Bourouis
Abou Bakr Belkaid University of Tlemcen
LS-DYNA is an advanced general-purpose multiphysics simulation software package developed by the former Livermore Software Technology Corporation (LSTC), which was acquired by Ansys in 2019.While the package continues to contain more and more possibilities for the calculation of many complex, real world problems, its origins and core-competency lie in highly nonlinear transient dynamic finite element analysis (FEA) using explicit time integration. LS-DYNA is used by the automobile, aerospace, construction and civil engineering, military, manufacturing, and bioengineering industries.
29th Mar, 2022
Mathu Sridharpanday
K. S. Rangasamy College of Technology
Dear Prof.Bart Jourquin
Thanks for reaching me out. This application is purely a semiconductor fan-out backside wafer deposition to spread and reduce heat from 200 deg. We try to deposit MoS2 nanosheets as heat spreader (5 um) over Si wafer. Following deposition, SiO2 as thermal interface material (2 um) over MoS2. again, MoS2 deposition ( 5 um) will be carrying out over SiO2 layer. The coating sequence will be Si wafer (520 um)/MoS2 (5um)/SiO2 (2um)/MoS2 (5um) without finn or heat sink. We would like to analyse heat that produce from front side of Si wafer and at backside try to abosord those heat and spread throughout the depositing layer down to room temperature.

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