In this study, the authors propose a procedure to enhance pure Ni-Al powders through graphene oxide dispersion in water for plasma spraying. The enhanced powders were utilized to coat A36 steel via plasma spraying. Next, the powders and the coatings were characterized by energy-dispersive X-ray spectroscopy, X-ray diffraction analysis, micro-Raman spectroscopy, and field emission scanning electron microscopy. Given the capability of the generated X-ray to characterize near surfaces to a depth of a few micrometers, the performed X-ray microanalyses convey that the carbon species incorporated within the powders through the graphene oxide dispersion can act as nanofillers reducing the number of holes/pores in the plasma-sprayed coatings. Potentiodynamic polarization testing and electrochemical impedance spectroscopy were used to investigate the corrosion behavior of the samples at two intervals: after 1 h and after 30 days of exposure to a 3.5% NaCl solution. According to the results of the corrosion testing, the enhanced coatings can display about 2.35 times lower corrosion current density compared to pure Ni-Al coatings, with the corrosion potentials of the enhanced coatings being higher than that of pure Ni-Al coatings (i.e., improved corrosion resistance). This improvement in corrosion resistance is also evident when the enhanced coatings are compared to the A36 substrate after 30 days of exposure to the solution. It appears that the incorporated carbon nanofillers, by reducing deep holes and pores that communicate with the surface of the substrate, ultimately determine the highest corrosion resistance. Thus, the outcome offers enhanced Ni-Al coatings possessing superior anticorrosion properties that typical plasma-sprayed Ni-Al bond coats may not exhibit.

Magnetron sputtering is a very versatile technique extensively employed for the deposition/growth of thin films. However, the deposition of desirable magnetic films is one of the challenges confronting magnetron sputtering owing to the shunting of magnetic flux by magnetic targets in conventional magnetron sputtering equipment. This flux shunting culminates in lower plasma density, non-uniform plasma confinement, and uneven erosion of magnetic targets, adversely affecting the growing films’ thickness uniformity and chemical homogeneity—the latter can be particularly serious in magnetron co-sputtering. In this article, it is discussed that these issues can be avoided by cylindrical sputtering. As for planar sputtering, formerly offered technical solutions including the utilization of thin foils as magnetic targets, the deployment of gapped targets somewhat allowing the magnetic flux of the magnetron assembly, the employment of a target heating system increasing a magnetic target’s temperature greater than or equal to its Curie temperature, facing target sputtering, magnetron sputtering assisted by coupled plasma inductively generated in an internal coil, and the generation of plasma remotely from magnetic targets (i.e., high target utilization sputtering) are scrutinized with their advantages/disadvantages being further examined. Finally, it is discussed that not only can auxiliary grid deployment mitigate/remove the issues of planar magnetron sputtering by modifying spatial plasma density distribution near the target but also it can solely shoulder the responsibility of ionization enhancement and plasma confinement for deposition of magnetic films.

This study provides the results of the first attempt to deposit thin films by reactive grid-assisted co-sputtering with the deployment of small grounded grids having two varying apertures for enabling the transfer of particles. The diameter of all the grids utilized was 50 mm, and their apertures' diameters were changed from 5 mm to 15 mm. Furthermore, the ratios of the grid area to the chamber wall area were lower than 0.0161, preventing the formation of ion-rich sheaths and their adverse impact upon discharge and plasma stability. Accordingly, Ti1Cr1-xN films (0.88 < x < 0.97) with low chromium contents were deposited on soda-lime glass substrates by using pure nitrogen as the sputtering gas. The grazing incidence X-ray diffraction patterns of the films, the average thicknesses of which were lower than 50 nm, showed no sign of crystallinity in the films. Ranging from 3.26 to 3.79 eV, the optical bandgap of the films changed by altering the apertures’ size; chromium content, internal stress, and quantum confinement effect appeared to be the main contributing factors. The photoluminescence intensities appertaining to trap state emissions reflected a decreasing trend by increasing the chromium content, which can be ascribed to the capability of the chromium particles included in the surface, structure, and grain boundaries of the films to prevent photoinduced electron-hole pairs from recombination. It was found that not only is the grid-assisted co-sputtering method an effective tool whereby the doping range of conventional co-sputtering methods can be significantly extended but also it can cover a spectrum of surface morphologies. However, in comparison with the conventional co-sputtering method, the utilization of the grids with fairly small apertures can limit the thickness uniformity of the films; this effect may be attenuated by changing the geometry and design of grids.

Having been deposited on 304 stainless steel (SS304) substrates by RF reactive co-sputtering, 1 μm-thick Ti-Cr-N films were annealed at 400 °C and 700 °C. Accordingly, nitride phases of TiN and CrN, and as a result of the lost capability as an oxygen diffusion barrier, oxide phases of Fe₂O₃, Cr₂O₃, and TiO₂ formed after the annealing process at 700 °C. For short-term immersion (1 h), the corrosion testing illustrated that the film annealed at 400 °C shows greater corrosion resistance than the other films and SS304. For long-term immersion (30 days), all the films demonstrated greater corrosion resistance than SS304, with the as-deposited film delivering the best performance. It was found that protective passivation layer formation, porosity closures, and surface characteristics such as pits, trenches, grooves, cracks, and protuberances govern the corrosion behavior differences. The surface micrographs imply that pitting corrosion and superficial filiform corrosion are among the underlying mechanisms affecting the surfaces. Finally, given the concerns about the capability of SS304 to release toxic elements such as chromium, it was determined that not only can Ti-Cr-N films increase the corrosion resistance of SS304 but also they can reduce the release of chromium by almost 67% in the long-term exposure.

In this paper, the incorporation of auxiliary grids/electrodes into the design of the sputtering method is scrutinized by studying the impact of factors such as grid size, grid position, grid bias voltage, electrode sheath design, substrate bias voltage, reactive gas partial pressure, and magnetic trap configuration on the discharge condition and thin-film growth. In this regard, utilizing the updated Berg model for reactive sputtering, the authors obtained a formulation for the reactive grid-assisted sputtering. By the newly-developed formulation, the sputtering rate and the reactive gas partial pressure were simulated as a function of the reactive gas flow rate for various grid-to-target distances, argon partial pressures (0.67, 1.6, and 3.6 Pa), and discharge current densities (0.01, 0.015, and 0.02 A/cm2). According to the computation results, with a grid being utilized, the width of the hysteresis loops can be modified in a broader range by changing either the grid-to-target distance, the argon partial pressure, or the discharge current, resulting in better control over the deposition process. Moreover, the novel configuration of anode-spot-assisted sputtering was proposed to significantly ionize sputtered/neutral atoms near the substrate and to simultaneously deposit sputtered species and products produced as the direct result of introducing dust into the dense plasma. Finally, diverse configurations of the grid-assisted co-sputtering method were introduced for two prime purposes: deposition of composite films in any desired ratios of constituents without significantly changing the other co-sputtering parameters, and favorable alternation of a hysteresis loop for one of the guns at shared gas flow rates.