(a)–(h) Step-by-step overview of the fabrication process of the Ant-DA module.

Source publication

3D section view of the proposed Ant-DA module in terms of the (a) front...

Structural representation of the prepared MPI film.

Sequential fabrication processes of the proposed MPI film.

Graphical representation of the simulated antenna of the proposed design.

(a)–(h) Step-by-step overview of the fabrication process of the Ant-DA...

Chip-embedded antenna-in-package module using modified polyimide (MPI) low-loss materials for millimeter-wave application

Article

Full-text available

May 2023

Jaewoo Song
Se-Hoon Park
Hyun-jin Nam
Muhammad Naqi

In advanced millimeter-wave packaging technology, signal loss is considered the main problem, which can be resolved using low-loss circuits for minimizing transmission losses. Herein, the radio frequency integrated circuit (RF-IC), an active element, and the antenna are assembled in one package form to realize such a low-loss circuit by utilizing t...