a) Self‐assembly at the atomic scale reveals mechanically active molecular structures. (Adapted with permission.23 Copyright 2016, American Association for the Advancement of Science.) b) Molecular polypeptides after chemical self‐assembly are reshaped and self‐assembled into proteins traversing complex energy landscapes toward an energy minimum. (Adapted with permission.20 Copyright 2012, American Association for the Advancement of Science.) After many iterations of self‐assembly, proteins are formed into macromeres and finally into biological structures such as the bacteriophage T4. (Adapted with permission.22 Copyright 2018, Elsevier B.V.) Similarly, c) Artificial self‐assembled architectures are formed from block copolymers at nanoscale (1 ‐ Adapted with permission.24 Copyright 2017, Wiley‐VCH Verlag GmbH & Co. KGaA), polygonal (2 ‐ Adapted with permission.25 Copyright 2010, Wiley‐VCH Verlag GmbH & Co. KGaA), and tubular architectures (3 ‐ Adapted with permission.26 Copyright 2008, Wiley‐VCH Verlag GmbH & Co. KGaA) created by reshaping of the initially planar structures. Even more complex origami‐like (4 ‐ Adapted with permission.27 Copyright 2014, Wiley‐VCH Verlag GmbH & Co. KGaA; 5 ‐ Adapted with permission.28 Copyright 2017, American Chemical Society) self‐assembling structures can be fabricated using planar thin film technologies and novel materials by reshaping them into the final 3D architectures.

a) Self‐assembly at the atomic scale reveals mechanically active molecular structures. (Adapted with permission.23 Copyright 2016, American Association for the Advancement of Science.) b) Molecular polypeptides after chemical self‐assembly are reshaped and self‐assembled into proteins traversing complex energy landscapes toward an energy minimum. (Adapted with permission.20 Copyright 2012, American Association for the Advancement of Science.) After many iterations of self‐assembly, proteins are formed into macromeres and finally into biological structures such as the bacteriophage T4. (Adapted with permission.22 Copyright 2018, Elsevier B.V.) Similarly, c) Artificial self‐assembled architectures are formed from block copolymers at nanoscale (1 ‐ Adapted with permission.24 Copyright 2017, Wiley‐VCH Verlag GmbH & Co. KGaA), polygonal (2 ‐ Adapted with permission.25 Copyright 2010, Wiley‐VCH Verlag GmbH & Co. KGaA), and tubular architectures (3 ‐ Adapted with permission.26 Copyright 2008, Wiley‐VCH Verlag GmbH & Co. KGaA) created by reshaping of the initially planar structures. Even more complex origami‐like (4 ‐ Adapted with permission.27 Copyright 2014, Wiley‐VCH Verlag GmbH & Co. KGaA; 5 ‐ Adapted with permission.28 Copyright 2017, American Chemical Society) self‐assembling structures can be fabricated using planar thin film technologies and novel materials by reshaping them into the final 3D architectures.

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Electronic devices and their components are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring the state‐of‐the‐art manufacturing and materials to do so. An emerging class of materials and fabrication techniques inspired by self‐assembling biological systems shows promise as an altern...

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... The fabrication strategy relies on a shapeable polymer stack, which has been reported previously (32,33). This material system is processed as a planar structure comprising ultrathin polymer layers and integrated electronic components and then self-assembles into microscopically thin "Swiss-roll" tubes. ...
... In order to gain further insights into the self-rolling mechanism of inorganic-organic hybrid films, our future studies concentrate on the influence of geometrical parameters, such as thickness and lateral dimensions of the film fragments, on their strain-induced self-folding into microscrolls. In view of potential applications as a free-standing electrode for water-splitting electrocatalysis, coiled structures with mesoscale channels may enable efficient transport of gaseous products while simultaneously offering a compact arrangement with increased stiffness as compared to flat films [45]. Perspectively, this facile concept based on highly reproducible deposition conditions under electrochemical control may also be transferable into a wider range of material systems with diverse intrinsic and curvature-dependent [46] functional properties. ...
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... However, the manufacturing of transverse microsized MCPOs (µMCPOs) faces a number of technological challenges associated with the realization of small-scale electromagnetic coils capable of generating sufficiently strong magnetic fields in a small, confined volume of a few 1000 µm 3 . Recently developed self-assembling micro-origami technologies [18][19][20] offer means to realize microscale cylindrical architectures with integrated electronic functionalities such as wafer-scale integrated microscale capacitors 21 , sensors 18,22,23 , electromagnetic coils [24][25][26] , and microsystems 27 . Self-assembled micro-coils have been shown suitable for generating strong magnetic field in a small volume, as required in nuclear magnetic and electron spin resonance (NMR and ESR) spectroscopies 25,26 . ...
... However, the manufacturing of transverse microsized MCPOs (µMCPOs) faces a number of technological challenges associated with the realization of small-scale electromagnetic coils capable of generating sufficiently strong magnetic fields in a small, confined volume of a few 1000 µm 3 . Recently developed self-assembling micro-origami technologies [18][19][20] offer means to realize microscale cylindrical architectures with integrated electronic functionalities such as wafer-scale integrated microscale capacitors 21 , sensors 18,22,23 , electromagnetic coils [24][25][26] , and microsystems 27 . Self-assembled micro-coils have been shown suitable for generating strong magnetic field in a small volume, as required in nuclear magnetic and electron spin resonance (NMR and ESR) spectroscopies 25,26 . ...
... Fabrication and yield of self-assembled coils. The fabrication of self-assembled micro-coils in µMCPO devices requires the synthesis and subsequent patterning of functional polymeric films [18][19][20]24 , namely the sacrificial layer (SL), the hydrogel (HG), and the polyimide (PI) layers on top of a pretreated 150 mm (6inch) wafer. Then a Ti-Cu-Ti layer (thickness ca. ...
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... Molecular, colloidal, and interfacial self-assemblies are examples of random self-assembly processes. Others, such as atomic and biological self-assemblies, have some degree of directionality [54,[94][95][96]. Colloidal self-assembly process can be modulated by external stimuli such as electric field, magnetic field, gravity, flow, and so on. ...
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... The fabrication strategy relies on a shapeable polymer stack, which has been reported previously (32,33). This material system is processed as a planar structure comprising ultrathin polymer layers and integrated electronic components and then self-assembles into microscopically thin "Swiss-roll" tubes. ...
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... Three-dimensional (3D) mesostructures formed with highperformance materials have enabled important applications in diverse emerging areas, such as micro-and nano-electromechanical systems (MEMS and NEMS) [1][2][3][4][5][6][7], soft robotics [8][9][10][11][12][13][14][15], flexible electronics [16][17][18][19][20][21][22][23][24][25] and metamaterials [26][27][28][29][30][31][32][33][34][35][36]. Diverse technologies are now available for the manufacture of sophisticated 3D mesostructures [16,[37][38][39][40][41][42][43][44][45][46][47][48][49][50]. Thereinto, a deterministic selfassembly approach guided by compressive buckling, as developed recently [51][52][53][54][55], has stimulated extensive interests, because of its versatile applicability to a broad range of length scales and excellent compatibility with mature planar fabrication technologies. ...
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Complex three-dimensional (3D) mesostructures in advanced functional materials are attracting increasing interest, due to their widespread applications. Mechanically-guided 3D assembly through compressive buckling provides deterministic routes to a rich diversity of 3D mesostructures and microelectronic devices, with feature sizes ranging from sub-microcale to millimeter-scale. Existing studies established inverse design methods that map the target 3D geometry onto an unknown 2D precursor, but mainly focusing on filamentary ribbon-type geometries. Although strategies relying on spatial thickness variation of 2D precursors have been reported to achieve inverse design of 3D surfaces, this could lead to a lack of compatibility with well-developed planar fabrication technologies. In the framework of buckling-guided 3D assembly, this paper presents a computational method based on topology optimization to solve the inverse design problem of 3D surfaces from 2D precursors with uniform thickness distributions. Specifically, curvy ribbon components were exploited to discretize nondevelopable target surfaces, and then optimized to ensure that the assembled 3D surface has the best match with the target geometry. Combined computational and experimental studies over a dozen of elaborate examples, encompassing both the caged and even general target surfaces, demonstrate the effectiveness and applicability of the proposed method.
... The process is easily controlled, self-assembled and works in a parallel fashion on lithographically defined structures on the wafer scale. (11,12) In previously prepared magnetic angular encoders (arrays of 180 structures) (10) based on the self-assembled rolled-up polymer platform the rolling yield and the diameter variation (variance of Gaussian distribution) have been determined to 95% and 12%, respectively. Contrary to non-organic strain-driven platforms, such as e.g. ...
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The functionality of a ferroic device is intimately coupled to the configuration of domains, domain boundaries, and the possibility for tailoring them. Exemplified with a ferromagnetic system, we present a novel approach which allows the creation of new, metastable multidomain patterns with tailored wall configurations through a self-assembled geometrical transformation. By preparing a magnetic layer system on a polymeric platform including swelling layer, a repeated self-assembled rolling into a multiwinding tubular structure and unrolling of the functional membrane is obtained. When polarizing the rolled-up 3D structure in a simple homogeneous magnetic field, the imprinted configuration translates into a regularly arranged multidomain configuration once the tubular structure is unwound. The process is linked to the employed magnetic anisotropy with respect to the surface normal, and the geometrical transformation connects the angular with the lateral degrees of freedom. This combination offers unparalleled possibilities for designing new magnetic or other ferroic micropatterns.
... Glancing angle deposition (GLAD) is a conventional technique for fabrication of individual nanohelices [ Fig. 1(a)], 22 an array of sculpted 3D objects such as helices, posts, and chevrons. 23 Strain-engineering technologies 3,4 allow to develop novel materials, including a variety of rolled-up and wrinkled magnetic nanomembranes 2 such as microhelix coil structures, 24 Swiss rolls, 25 and complex micro-origami structures. 26 Different chemical synthesis techniques include self-assembly, combinations of 3D templates usage with electroless and atomic layer deposition, and electroplating; this allows to fabricate core-shell nanowires, 27 multilayered nanotubes, 28 core/shell nanoparticles, 29 and hollow nanoparticles. ...
... 152 To the moment, most of magnetically responsive flexible materials are magnetosensitive elastomers. [3][4][5]150 Their magnetic properties are determined by the nonlocal magnetostatic interaction, providing a relatively large scale of the geometrical deformations. Novel candidates for nanorobotics are organic and molecule-based magnets. ...
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... In the last decade, however, we have seen a tremendous progress in the area of soft electronics. For soft electronics all components are fabricated on the flexible substrates that can be wrapped, folded, twisted, or bent [1][2][3][4]. This allows to adjust the shape of the resultant devices and to use them in a demanding environment, i.e., where space is limited in size or curved. ...
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In this paper we describe characterization of semi-metallic bismuth thin films. We prepared bismuth thin films by a deposition of bismuth through thermal evaporation onto flexible Kapton substrates and annealing at temperatures close to the melting point of Bi. We studied the morphology and transport properties of these films. Immediately after the deposition we observed competition between vanishing of the grain boundaries and elastic strain energy, which stabilized at larger thicknesses leading to the grain size of 140 nm. This effect was accompanied by a continuous decrease of resistivity which, however, was larger than for the bulk bismuth. The film annealing at temperatures close to the melting point of Bi led to a 300% increase of magnetoresistance at room temperature and in the magnetic field of 7 T. The in situ resistance measurements allowed us to determine the permissible temperature at which the annealing does not cause the loss of film continuity.
... Whereas producing 3D systems by stacking 2D systems through planar microfabrication is intuitive, this strategy is relatively incompetent in reducing the footprint area because this target relies on demanding jobs of miniaturization of every electronic component and advances in electric circuit design [9][10][11][12]. Alternatively, shapeable materials allow for self-driven spatial rearrangement of 2D devices into 3D devices [13,14]. The manufacture of electronic components and design of electric circuit is based on the efficient planar microfabrication, while a self-assembly process reshapes the 2D system into a 3D object, which simultaneously achieves a complex system and satisfies the requirement of minimal footprint area. ...
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Skin mountable electronic devices are in a high-speed development at the crossroads of materials science, electronics, and computer science. Sophisticated functions, such as sensing, actuating, and computing, are integrated into a soft electronic device that can be firmly mounted to any place of human body. These advanced electronic devices are capable of yielding abilities for us whenever they are needed and even expanding our abilities beyond their natural limitations. Despite the great promise of skin mounted electronic devices, they still lack satisfactory power supplies that are safe and continuous. This Perspective discusses the prospects of the development of energy storage devices for the next generation skin mountable electronic devices based on their unique requirements on flexibility and miniaturized size.