Sequential fabrication processes of the proposed MPI film.

Source publication

3D section view of the proposed Ant-DA module in terms of the (a) front...

Structural representation of the prepared MPI film.

Graphical representation of the simulated antenna of the proposed design.

(a)–(h) Step-by-step overview of the fabrication process of the Ant-DA...

Chip-embedded antenna-in-package module using modified polyimide (MPI) low-loss materials for millimeter-wave application

Article

Full-text available

May 2023

Jaewoo Song
Se-Hoon Park
Hyun-jin Nam
Muhammad Naqi

In advanced millimeter-wave packaging technology, signal loss is considered the main problem, which can be resolved using low-loss circuits for minimizing transmission losses. Herein, the radio frequency integrated circuit (RF-IC), an active element, and the antenna are assembled in one package form to realize such a low-loss circuit by utilizing t...