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SEM images of the two subsequently processed samples with the entire row including the defective µpillars exposed through MIP processing. (a) This sample was polished to just before the first µpillar row. The MIP process exposed the first row sufficiently but did not uncover the second. (b) A sample where the first µpillar row was mechanically polished into. The MIP process was able to expose the second row into the sample.

SEM images of the two subsequently processed samples with the entire row including the defective µpillars exposed through MIP processing. (a) This sample was polished to just before the first µpillar row. The MIP process exposed the first row sufficiently but did not uncover the second. (b) A sample where the first µpillar row was mechanically polished into. The MIP process was able to expose the second row into the sample.

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Figure 7: Tilted environmental SEM images of µbumps after MIP...
Figure 8: SEM images of the two subsequently processed samples with the...
Figure 11: Optical images of pre and post MIP processing focusing on...
Benefits of using a CF4-Free Microwave Induced Plasma (MIP) Spot Etch Process to Remove Underfill and Analyze 2.5D Modules
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  • Dec 2020
Advanced packages such as 2.5D will continue to grow in demand as performance increases are needed in various applications. Failure analysis must adapt to the changes in the interfaces, materials and structures being developed and now utilized. Traditional techniques and tools used for selectively removing materials to isolate and analyze defects n...
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