Figure 1 - available via license: CC BY
Content may be subject to copyright.
Graph of functions χ(t) – eq. (1) for the liquid temperature of 400°C in Cu–Sn system and various values of K o = (0,3 ÷ 1,2) . 10 -5 s –1 for planar dissolution
Source publication
Problems of reactive diffusion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt is presented for the case of planar dissolution. The main intention was to study experimentally the copper dissolution in melts of various solder al...
Similar publications
An intermetallic layer (IML) between the solder alloy and the soldered surface affects the mechanical and electrical performance of the resulting joints. Numerous studies have explored the possibilities of influencing the IML to achieve more reliable interconnections. However, the type and composition of the used flux, crucial for the proper creati...
Citations
... With the development of electronics manufacturing and welding technology, it has been an inevitable trend that leadfree solder substitutes the lead-containing alloy (Li 2005;Katsuaki 2001;Drápala et al. 2013). Sn-based alloy is a new type of brazing materials due to its excellent performance (Lai et al. 2003;Suzuki et al. 2005;Sebo et al. 2013). ...
The effects of Bi addition on the properties of Sn-3.0Ag-0.5Cu molten alloy on Cu substrates are discussed using wettability and interface microstructure analysis. The changes of the contact angles between Sn-3.0Ag-0.5Cu-xBi and Cu substrates with the spreading time are described by Dezellus model. It indicates that the spreading process is governed by the interfacial reaction during the dwelling time. The interface microstructure is observed to clarify the effects of reactions on the spreading behavior. It is found that Cu6Sn5 is formed adjacent to the solder and Cu3Sn appears over the substrate with Bi added at 613K, indicating that Bi exists between the intermetallics and the addition of Bi can hinder the diffusion of copper towards the interior of the solder. Therefore the existence of Bi decreases the agglomeration of Cu-Sn grains. The growth of intermetallics is thus limited and the shape of intermetallics transforms from scallop to zigzag consequently. However, the segregation phenomenon appears when the additive amount of Bi is more than 5.5mass %, which could lead to the occurrence of fracture and degrade the performance of Sn-3.0Ag-0.5Cu-xBi alloy. The results of the present study provide basic physical and chemical data for the application of lead-free solder in the future microgravity space environment.
... For their manufacturing, because of demands for high physio-chemical properties and surface quality, investment casting technology is applied. It is essential to observe a rigorous technological regime at every stage of the process, beginning with using high quality wax mixtures, ceramic materials, stock materials, melting procedures, copper refining and casting [15][16][17][18][19][20]. This technology is used to manufacture turbine blades (Figure 3a), surgical instruments, endoprosthetics, artistic casts (Figure 3b), and also casts made from alloys with special properties. ...
This paper presents research results in the field of casting technology of copper and copper alloys using the invest-ment casting technology, both from historical as well as modern technology perspective. The analysis of exemplary elements of the old casting moulds is included, as well as the Bronze Age casts. The chemical content of various copper alloys was determined and the application of lost wax method was confirmed in the Bronze Age workshop. At present, investment casting method is used for manufacturing high-quality casts, especially products for power engineering that is why it demands respecting very rigorous technological requirements. The casts were character-ised based on microstructure research, chemical composition and conductivity in relation to oxygen content.
... A difficult technology of the above-mentioned materials requires further research aimed at implementing new solutions that would result in their increased quality. [9][10][11][12] A lot of attention is paid to the problems of shaping structures of the Cu-Cr, Cu-Cr-Zr, Cu-Ni-Si, Cu-Ni-Cr alloy types, among others. Within the research framework, macro-and microstructure of the alloys was analysed, as well as their intermetallic phases and properties of the chosen alloys. ...
o l u m e 1 4 , I s s u e 2 / 2 0 1 4 , 7 9 -8 4 7 9 Abstract The work presents experiment results from the area of copper casting technology and chosen examples of alloyed copper. At present, copper casting technology is applied in many branches of industrial manufacturing, especially in the sector of construction, communications, arms and power engineering. Alloyed copper, containing slight additions of different elements and having special physio-chemical properties, is used in a special range of applications. Copper technology and alloyed copper analyses have been presented, these materials being used for cast manufacturing for power engineering. The quality of casts has been assessed, based on their microstructure analysis, chemical content and the cast properties. During the research, special deoxidizing and modifying agents were applied for copper and chosen examples of alloyed copper; also exemplary samples were tested with the help of metallographic analysis, electrical conductivity and gaseous impurities research.
The paper presents the analysis of technology of copper and alloyed copper destined for power engineering casts. The casts quality was assessed based on microstructure, chemical content analysis and strength properties tests. Characteristic deoxidising (Logas, Cup) and modifying (ODM2, Kupmod2) formulas were used for the copper where high electrical conductivity was required. Chosen examples of alloyed copper with varied Cr and Zr content were studied, and the optimal heat treatment parameters were tested for a chosen chromium copper content, based on the criterion of hardness and electrical conductivity tests. Searching for materials with high wear resistance, the in-fluence of variable silicone content on the properties of CuNiSi alloy was researched.
