Chip Design and Manufacturing Cost under Different Process Nodes: Data Source from IBS [2].

Chip Design and Manufacturing Cost under Different Process Nodes: Data Source from IBS [2].

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As a heterogeneous integration technology, the chiplet-based design technology integrates multiple heterogeneous dies of diverse functional circuit blocks into a single chip by using advanced packaging technology, which is a promising way to tackle the failure of Moore’s law and Dennard scaling. Currently, as process nodes move forward, dramaticall...

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... to the survey from the International Business Strategy Corporation (IBS), the increase of design cost for each generation technology has exceeded 50% after 22 nm process, including EDA, design verification, IP core, tape-out, and so forth. For instance, the total design cost of 7 nm process is about 300 million dollars, and that of 3 nm process is expected to increase 5 times up to 1.5 billion dollars [2], as depicted in Figure 1. Thus, the difficulties for implementing a high-performance chip upgrade based on process improvement are increasing and the price-performance ratio is increasing. ...

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... However, as we keep pushing the boundaries of technology scaling, we encounter multiple challenges. Firstly, whenever we transition to a more advanced technology node, the nonrecurring cost due to physical design, verification, software, mask sets, and prototyping almost doubles [26]. As a result, designing a chip in an advanced technology node is only economically viable if the chip is manufactured in vast quantities. ...
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2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chiplet interconnect (ICI). Two major factors affecting the latency and throughput are the topology of links between chiplets and the chiplet placement. In this work, we present PlaceIT, a novel methodology to jointly optimize the ICI topology and the chiplet placement. While state-of-the-art methods optimize the chiplet placement for a predetermined ICI topology, or they select one topology out of a set of candidates, we generate a completely new topology for each placement. Our process of inferring placement-based ICI topologies connects chiplets that are in close proximity to each other, making it particularly attractive for chips with silicon bridges or passive silicon interposers with severely limited link lengths. We provide an open-source implementation of our method that optimizes the placement of homogeneously or heterogeneously shaped chiplets and the ICI topology connecting them for a user-defined mix of four different traffic types. We evaluate our methodology using synthetic traffic and traces, and we compare our results to a 2D mesh baseline. PlaceIT reduces the latency of synthetic L1-to-L2 and L2-to-memory traffic, the two most important types for cache coherency traffic, by up to 28% and 62%, respectively. It also achieve an average packet latency reduction of up to 18% on traffic traces. PlaceIT enables the construction of 2.5D stacked chips with low-latency ICIs.
... These links typically include high-speed transmitters (TXs), interconnects (transmission lines), and receivers (RXs), as illustrated in Figure 1 [6,7]. To accommodate the growing need for high-bandwidth and efficient communication, these links feature extensive density, with hundreds to thousands of signal pathways, and operate at high frequencies and data rates up to gigabits per second (Gbps), which has to address non-trivial signal integrity (SI) issues [6,8,9], such as crosstalk, signal attenuation, electromagnetic interference (EMI), . ...
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High-speed serial links are fundamental to energy-efficient and high-performance computing systems such as artificial intelligence, 5G mobile and automotive, enabling low-latency and high-bandwidth communication. Transmitters (TXs) within these links are key to signal quality, while their modeling presents challenges due to nonlinear behavior and dynamic interactions with links. In this paper, we propose LiTformer: a Transformer-based model for high-speed link TXs, with a non-sequential encoder and a Transformer decoder to incorporate link parameters and capture long-range dependencies of output signals. We employ a non-autoregressive mechanism in model training and inference for parallel prediction of the signal sequence. LiTformer achieves precise TX modeling considering link impacts including crosstalk from multiple links, and provides fast prediction for various long-sequence signals with high data rates. Experimental results show that LiTformer achieves 148-456×\times speedup for 2-link TXs and 404-944×\times speedup for 16-link with mean relative errors of 0.68-1.25%, supporting 4-bit signals at Gbps data rates of single-ended and differential TXs, as well as PAM4 TXs.
... To address this challenge, chip designers have turned towards heterogeneous integration (HI), adopting multi-chiplet packaging, also known as system-in-package (SiP) [1]. In HI, silicon dies (chiplets) are connected by a bridge of interconnects like silicon interposer layers, through-silicon vias (TSV), embedded multi-die interconnects (EMIB), etc. [2], [3] (see Figure 1). This approach allows multi-dimensional functionalities to be embedded in a single package, improving yields and accelerating time-to-market by leveraging existing chiplets from manufacturers or open markets. ...
... CSIP is ONLY required for chiplets that require activation keys or perform security operations at in-field for secure CHSM-chiplet communication.2 The CSIP micro-architecture depends on the functionalities required per each SiP architecture (CHSM-CSIP inter-functionality).Authorized licensed use limited to: University of Florida. ...
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... In the future, there is also a strong evolution likelihood towards scalable, modular, multi-chiplet system integration architecture dipicted in Fig. 1(a)-(b), inspired by [6], [7], [8], and [9]. The advantages of chiplet design primarily stem from the utilization of mature, standardized, ready-made hard IPs, enabling flexible combinations and comprehensive balances in terms of process node and system function [10]. Naturally, a flip-chip bonding technique, capable of supporting both HVM (high volume manufacturing) and superconducting demands, will become the key for commercially-beneficial chiplet system product. ...
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... Chiplet architectures [203], where multiple silicon dies are integrated into a single package, have gained significant traction in the chip design industry [204]. Chiplets come with a wide range of benefits, including modularity, reusability, flexibility, specialization, cost-efficiency and reduced time-to-market. ...
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Knowledge graphs (KGs) have achieved significant attention in recent years, particularly in the area of the Semantic Web as well as gaining popularity in other application domains such as data mining and search engines. Simultaneously, there has been enormous progress in the development of different types of heterogeneous hardware, impacting the way KGs are processed. The aim of this paper is to provide a systematic literature review of knowledge graph hardware acceleration. For this, we present a classification of the primary areas in knowledge graph technology that harnesses different hardware units for accelerating certain knowledge graph functionalities. We then extensively describe respective works, focusing on how KG related schemes harness modern hardware accelerators. Based on our review, we identify various research gaps and future exploratory directions that are anticipated to be of significant value both for academics and industry practitioners.
... Several surveys have already focused on some key technologies and fundamental modules of chipletbased design. Studies in [13,14] have provided a comprehensive overview of chiplet-based designs from a packaging perspective. Similarly, in [14][15][16], the interconnect interfaces of chiplets have been summarized, with a focus mainly on the physical layer. ...
... Studies in [13,14] have provided a comprehensive overview of chiplet-based designs from a packaging perspective. Similarly, in [14][15][16], the interconnect interfaces of chiplets have been summarized, with a focus mainly on the physical layer. However, further investigation that can provide guidance for system architecture design is desired in addition. ...
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Chiplet-based design, which breaks a system into multiple smaller dice (or “chiplets”) and reassembles them into a new system chip through advanced packaging, has received extensive attention in the post Moore’s law era due to its advantages in terms of cost, performance, and agility. However, significant challenges arise in this implementation approach, including the mapping of functional components onto chiplets, co-optimization of package and architecture, handling the increased latency of communication across functions in different dies, the uncertainty problems of fragment communication subsystems, such as maintaining deadlock-free when independently designed chiplets are combined. Despite various design approaches that attempt to address these challenges, surveying these approaches one-after-another is not the most helpful way to offer a comparative viewpoint. Accordingly, in this paper, we present a more comprehensive and systematic strategy to survey the various approaches. First, we divide them into chiplet-based system architecture design and interconnection design, and further classify them based on different architectures and building blocks of interconnection. Then, we analyze and cross-compare each classification separately, and in addition, we present a topical discussion on the evolution of memory architectures, design automation, and other relevant topics in chiplet-based designs. Finally, some discussions on important topics are presented, emphasizing future needs and challenges in this rapidly evolving field.
... The scaling down of the microchip has somewhat reached its limits [1]. New technology [2,3], new materials [4,5] and new architecture [6][7][8] are under investigation for the same or better performance benefits. The thermally grown SiO2 offers several key advantages in microelectronics device processing including thermodynamically and electrically stable high quality interface state density as well as better electric insulation properties [9]. ...
Chapter
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... This technology involves multi-material integration, diverse process combinations, multifunctional integration, and high integration levels. 8 The use of heterogeneous integration processes in MMIC manufacturing optimizes circuit performance by selecting materials and processes specifically tailored for individual functions, integrating multiple functions and performance levels on a single chip. This approach significantly reduces system size, lowers power consumption, improves overall performance, enhances system reliability, simplifies the manufacturing process by combining various process steps, increases efficiency, and potentially reduces manufacturing costs. ...
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... With the rapid advancements in cloud computing, artificial intelligence, big data, and other related technologies, there have been emerging trends in the development of architecture for integrated circuits. They have put forward new requirements in terms of functionality, performance and cost [3,16,17]. To this, the chiplet design approach was developed to fulfill the demands of these emerging applications and to address yield and performance issues. ...
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The implementation of turn restrictions represents a critical research challenge in chiplet-based systems, with the objective of achieving deadlock-free communication. Nevertheless, existing methodologies encounter difficulties in terms of computational complexity, which impedes the design process. Moreover, as the scale of the problem increases, the cost of addressing it becomes increasingly untenable. In this paper, we introduce the efficient turn restrictions setting (ETRS) method to reduce the computational cost of implementing turn restrictions for boundary routers in chiplet-based systems. In stage 1, we present a symmetry-based preprocessing algorithm (SBPA). SBPA exploits the symmetry inherent in chiplet topologies by generating multiple sets of identical modes, ensuring that scenarios with the same objective function value are calculated only once per iteration. In stage 2, a heuristic selection algorithm (HSA) for turn restrictions based on NSGA-II is proposed as a means of searching for approximately optimal solutions and of solving the problem quickly. In stage 3, different filtering criteria are introduced to evaluate the Pareto fronts of HSA for making decisions on the placement of boundary routers and their turn restrictions. Evaluation results reveal that the proposed ETRS method surpasses existing solutions in terms of computation efficiency. Moreover, it delivers satisfactory optimal objective values.
... The emerging concept of heterogeneous integration (HI) is introducing chiplets as an alternative technology to replace traditional System on Chip (SoC) in order to pursue higher operating speed and easier procedure for design and validation [1]. The advanced packaging techniques of chiplets are integrating the power distribution network (PDN) and the signal delivery network (SDN) into a compact system. ...