I. Doerr,
Lih-Tyng Hwang,
G. Sommer,
H. Oppermann,
L. Li,
M. Petras, S. Korf,
F. Sahli,
T. Myers,
M. Miller,
W. John
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ABSTRACT: Skyrocketing growth in the cellular personal communications
services (PCS) sector has fueled the needs for higher density, more
functionality, and greater performance on both handset and base
stations. Third generation wireless standards, which require hardware
upgrades, loom on the horizon. RF component suppliers are scrambling to
find solutions at the IC, package, and PCB levels to meet these
challenges. RF module packaging is considered as one of the low cost
solutions for the future wireless products. One of the critical design
needs for RF interconnects is to understand the electrical performance
of wire bond (the RF interconnect of choice) at and above frequency of
interest, and to determine the performance limit for the wire bond
chip-to-substrate interconnect. The availability of design kit or
library would result in a substantial reduction in design cycle times.
Using wire bond as example, this paper illustrates the developmental
stages that turn electromagnetic characteristics of a physical structure
into a design library. Fullwave simulation using Ansoft HFSS and compact
models extraction using optimization tool for wire bond are shown,
followed by in-depth discussions of wire bond parameterized models.
Validation of parameterized model by measurement is presented
Electronic Components and Technology Conference, 2001. Proceedings., 51st; 02/2001
