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ABSTRACT: Hierarchical monitoring is presented on smart house platforms to provide scalability, dependability and energy efficiency. Hierarchical monitoring is a scalable and generic approach for optimization and diagnostic operations in distributed embedded systems. The paper studies the design of hierarchical monitoring on smart house platforms as an example of WPANs (wireless personal area networks). We present the functional partition of hierarchical agents in a smart house, and show that the architecture can be conveniently built upon the widely used Zigbee standard. We give a qualitative discussion of the design scalability and dependability compared to the centralized monitoring. In addition, we quantitatively compare the energy consumption of monitoring communication in hierarchical and centralized architectures, with the classic free space propagation model. The qualitative discussion and quantitative analysis demonstrate the scalability, dependability and energy efficiency of hierarchical monitoring in a domestic environment.
Communications in Information Science and Management Engineering. 09/2012; 2(5).
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International Journal of Environmental Protection. 08/2012; 2(8):23-27.
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ABSTRACT: This paper presents the prototype implementation of a Bio-Patch using fully integrated low-power System-on-Chip (SoC) sensor and paper-based inkjet printing technology. The SoC sensor is featured with programmable gain and bandwidth to accommodate a variety of bio-signals. It is fabricated in a 0.18-ìm standard CMOS technology, with a total power consumption of 20 ìW from a 1.2 V supply. Both the electrodes and interconnections are implemented by printing conductive nano-particle inks on a flexible photo paper substrate using inkjet printing technology. A Bio-Patch prototype is developed by integrating the SoC sensor, a soft battery, printed electrodes and interconnections on a photo paper substrate. The Bio-Patch can work alone or operate along with other patches to establish a wired network for synchronous multiple-channel bio-signals recording. The measurement results show that electrocardiogram and electromyogram are successfully measured in in-vivo tests using the implemented Bio-Patch prototype.
IEEE transactions on information technology in biomedicine: a publication of the IEEE Engineering in Medicine and Biology Society 06/2012; · 1.69 Impact Factor
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ABSTRACT: Printed antennas based on glass epoxy substrate have been developed. On the basis of required specifications and assigned frequencies, tip-truncated triangular printed antennas have been designed, analyzed, and fabricated. The performances of the antennas have been measured in terms of return loss, frequency of operation, bandwidth, and radiation pattern. Triangular microstrip antenna (TMSA) configuration consisting of copper as active radiating patch and glass epoxy as dielectric substrate has been screened out to achieve the essential characteristics and satisfying recommended low-cost antenna. The Method of Moment (MOM) analyzing techniques have been employed to realize the required specific properties, whereas optimized tip truncation technique and varying feed point location give rise to suitable LHCP or RHCP configuration of the printed antenna. The coaxial probe signal feed arrangement have been considered for this work. The proposed printed antennas are suitable for communication links between ships or buoys and satellites specially for navigation purpose.
International Journal of Antennas and Propagation 06/2012; · 0.47 Impact Factor
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01/2012; , ISBN: 978-953-307-884-7
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ABSTRACT: In this work cradle to grave life cycle assessment of printed electronics resources have been presented. An attempt has been made to investigate and evaluate the life cycle assessment and environmental impacts of printed electronics resources such as polymer substrate-printed RFID antenna. Life cycle inventory analysis for these resources has been carried out to quantify total systems'inputs and outputs that are relevant to the environmental impacts especially emissions to air, fresh water, industrial soil and sea water. The results show that printed electronics materials are considerably more environment friendly than materials needed for PCB electronics. We have obtained the mass of emissions in each life cycle stages which verify that technology wise printed antenna causes less harmful and hazardous impacts to the environment.
Elsevier Procedia Engineering. 01/2012;
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IEEE Trans. on CAD of Integrated Circuits and Systems. 01/2012; 31:146-159.
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PECCS 2011 - Proceedings of the 1st International Conference on Pervasive and Embedded Computing and Communication Systems, Vilamoura, Algarve, Portugal, 5-7 March, 2011; 01/2011
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Proceedings of the 35th Annual IEEE International Computer Software and Applications Conference, COMPSAC 2011, Munich, Germany, 18-22 July 2011; 01/2011
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Proceedings of the 6th International Workshop on Reconfigurable Communication-centric Systems-on-Chip, ReCoSoC 2011, Montpellier, France, 20-22 June, 2011; 01/2011
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Proceedings of the 6th International Workshop on Reconfigurable Communication-centric Systems-on-Chip, ReCoSoC 2011, Montpellier, France, 20-22 June, 2011; 01/2011
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Proceedings of the 9th International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2011, part of ESWeek '11 Seventh Embedded Systems Week, Taipei, Taiwan, 9-14 October, 2011; 01/2011
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2011 International Conference on Field-Programmable Technology, FPT 2011, New Delhi, India, December 12-14, 2011; 01/2011
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14th Euromicro Conference on Digital System Design, Architectures, Methods and Tools, DSD 2011, August 31 - September 2, 2011, Oulu, Finland; 01/2011
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2011 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2011, Vancouver, BC, Canada, October 3-5, 2011; 01/2011
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NOCS 2011, Fifth ACM/IEEE International Symposium on Networks-on-Chip, Pittsburgh, Pennsylvania, USA, May 1-4, 2011; 01/2011
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Proceedings of the 19th International Euromicro Conference on Parallel, Distributed and Network-based Processing, PDP 2011, Ayia Napa, Cyprus, 9-11 February 2011; 01/2011
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IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011, Kowloon, Hong Kong, China, October 3-5, 2011; 01/2011
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Microprocessors and Microsystems - Embedded Hardware Design. 01/2011; 35:643-655.
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14th Euromicro Conference on Digital System Design, Architectures, Methods and Tools, DSD 2011, August 31 - September 2, 2011, Oulu, Finland; 01/2011
