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ABSTRACT: On-chip inductance modeling of VLSI interconnects is presented
which captures 3D geometry from layout design and process technology
information. Analytical formulae are derived for quick and accurate
inductance estimation which can be used in circuit simulations and whole
chip extraction screening process. Circuit simulations show critical
global wire inductive effects as well as power and ground inductive
noise
Custom Integrated Circuits Conference, 2000. CICC. Proceedings of the IEEE 2000; 02/2000