Publications (1)0 Total impact
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ABSTRACT: It is believed that below the 65 nm node although conventional bulk CMOS can be scaled, it will be without appreciable performance
gains. To continue the scaling of Si CMOS in the sub-65 nm regime, innovative device structures and new materials have to
be created in order to continue the historic progress in information processing and transmission. One such promising channel
material is Ge due to its higher source injection velocity. However, the lack of a sufficiently stable gate dielectric and
prior knowledge of doping Ge challenged the demonstration of a MOSFET device. In this chapter, we review various advanced
Ge MOS device technologies on nanoscale gate stack, shallow junction, and low thermal budget integration process, which together
have enabled functional metal-gated Ge MOSFETs with high-κ dielectric for the first time.
12/2007: pages 293-313;
Institutions
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2007
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Stanford University
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Department of Electrical Engineering
Stanford,
CA,
USA