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ABSTRACT: In this present work simulation models were obtained in order to develop tools for early stages of design of a new strain gauge by numerical modeling. The strain deformation was extracted by FEM simulation. Moreover, a correlation with experimental results was established in order to understand the efficiency of FEM results. It was observed that the finite element method is an adequate methodology to evaluate the strain-stress behavior of printed strain gauge in flexible structure. Moreover, the printed strain gauge found to be a suitable technology to be applied in flexible boards. Therefore, it could be applied as a direct method to measure strain deformation in flexible printed boards (FPCBs). It was also observed that, in an early product design stage, the FEM could be applied to simulate printed strain gauge during mechanical strain tests.
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th; 01/2010