The p-strain Si/i- heterojunctions prepared by a rapid thermal chemical vapor deposition system on an n-Si substrate with back preferentially etched were developed for fast IR detecting applications. The stress induced by the p-strain Si/i- heterojunction enhanced the carrier mobility in p-Si layer, while the preferentially etching of n-Si substrate accelerated the heat dissipating and the reduction of series resistance. As a result, the device achieved a better performance than that of the conventional one without the strain Si or the preferentially etched substrate. In addition, the effects of morphology and Ge composition in the i- thin film on the IR detecting performance were investigated in details.
IEEE Sensors Journal 01/2010; 10(8):1337-1341. DOI:10.1109/JSEN.2009.2039132 · 1.85 Impact Factor