P. Ma

Publications (2)2.85 Total impact

• Article: Characterization of Copper Electromigration Dependence on Selective Chemical Vapor Deposited Cobalt Capping Layer Thickness

  C.-C. Yang, F. Baumann, P. Wang, S. Lee, P. Ma, J. AuBuchon, D. Edelstein
  [show abstract] [hide abstract]
  ABSTRACT: Co films with various thicknesses were selectively deposited as Cu capping layers by chemical-vapor-deposition technique. Selectivity of the Co deposition between Cu and dielectric surfaces was improved by raising the deposition pressure. Degree of electromigration (EM) resistance enhancement was observed to be dependent on the deposited Co thickness. Compared to the no-Co control, significant EM lifetime enhancement was observed when the Co cap is thicker than 6 nm.
  IEEE Electron Device Letters 05/2011; · 2.85 Impact Factor
• Conference Proceeding: CVD Co and its application to Cu damascene interconnections

  T. Nogami, J. Maniscalco, A. Madan, P. Flaitz, P. DeHaven, C. Parks, L. Tai, B.S. Lawrence, R. Davis, R. Murphy, [......], B.-Y. Kim, T. Bolom, V. Ryan, P. Ma, J. Ren, J. Aubuchon, J. Fine, P. Kozlowski, T. Spooner, D. Edelstein
  [show abstract] [hide abstract]
  ABSTRACT: Fundamental material interactions as pertinent to nano-scale copper interconnects were studied for CVD Co with a variety of micro-analytical techniques. Native Co oxide grew rapidly within a few hours (XPS). Incorporation of oxygen and carbon in the CVD Co films (by AES and SIMS) depended on underlying materials, such as Ta, TaN, or Ru. Copper film texture (by XRD) and agglomeration resistance (by AFM) showed correlations with amounts of in-film oxygen/carbon. Cobalt diffused through copper at normal processing temperatures (by SIMS). CVD Co demonstrated diffusion barrier performance to Cu (by Triangular Voltage Sweep, TVS), but not to O₂. CVD Co was applied to 32 nm/22 nm damascene Cu interconnect fabrication in a scheme defined by the material studies. Lower post-CMP defect density and longer electromigration lifetimes were obtained.
  Interconnect Technology Conference (IITC), 2010 International; 07/2010