F. Zimmer

KTH Royal Institute of Technology, Stockholm, Stockholm, Sweden

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Publications (4)2.1 Total impact

  • Article: One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration
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    ABSTRACT: In this paper, we demonstrate the first high-resolution spatial-light-modulator chip with 1 million tilting micromirrors made of monocrystalline silicon on analog high-voltage complementary metal-oxide-semiconductor driving electronics. This device, as result of a feasibility study, shows good optical and excellent mechanical properties. The micromirrors exhibit excellent surface properties, with a surface roughness below 1-nm root mean square. Actuated micromirrors show no imprinting behavior and operate drift free. Very large-scale heterogeneous integration was used to fabricate the micromirror arrays. The detailed fabrication process is presented in this paper, together with a characterization of the SLM devices. Large arrays of individually controllable micromirrors are the enabling component in high-perfomance mask-writing systems and promising for high throughput deep-ultraviolet maskless lithography systems. The adoption of new materials with enhanced characteristics is critical in meeting the challenging demands with regard to surface quality and operation stability in the future. Very large-scale heterogeneous integration may enable virtually any solid-state material to be integrated together with CMOS electronics.
    Journal of Microelectromechanical Systems 07/2011; · 2.10 Impact Factor
  • Source
    Conference Proceeding: Hidden-hinge micro-mirror arrays made by heterogeneous integration of two mono-crystalline silicon layers
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    ABSTRACT: In this paper we present wafer-level heterogeneous integrated hidden-hinge micro-mirror arrays for adaptive optics applications. The micro-mirrors are made of mono-crystalline silicon and fabricated by two cycles of adhesive wafer bonding on fan-out substrates with addressing electrodes. The fabrication scheme allows the down-scaling of the micro-mirrors in size, the up-scaling of the array size and the implementation of additional material layers. Furthermore, large distances of the micro-mirrors to the electrodes can be achieved and hence a large deflection of the mirrors is possible. The micro-mirrors exhibit excellent deflection stability; no drift or hysteresis can be observed.
    Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on; 02/2011
  • Source
    Conference Proceeding: Very large scale heterogeneous system integration for 1-megapixel mono-crystalline silicon micro-mirror array on CMOS driving electronics
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    ABSTRACT: In this paper we demonstrate the first high mirror-count 1-level spatial light modulator (SLM) chip with 1 million tilting micro-mirrors made of mono-crystalline silicon on analogue, high-voltage CMOS driving electronics. The device from a feasibility study shows good optical and excellent mechanical properties. The micro-mirrors exhibit excellent surface properties with a surface roughness below 1 nm RMS, actuated micro-mirrors show no imprinting behavior and operate drift-free. Very large scale heterogeneous system integration was used to fabricate the micro-mirror array; the process is presented in this paper together with a characterization of the fabricated device.
    Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on; 02/2011
  • Source
    Conference Proceeding: CMOS-Integrable Piston-Type Micro-Mirror Array for Adaptive Optics Made of Mono-Crystalline Silicon using 3-D Integration
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    ABSTRACT: This paper presents a novel CMOS-compatible fabrication process and evaluations of a micro mirror array (MMA) made of mono-crystalline silicon (m-Si) for adaptive optic (AO) applications. The m-Si mirror layer is transfer bonded from a silicon-on-insulator (SOI) donor wafer with adhesive wafer bonding towards an intermediate patterned polymer spacer layer and clamped with metal plating. We present a CMOS compatible, bond alignment-free fabrication scheme offering the potential for high air gap distances between substrate and mirrors and we show first measurements of the fabricated mirrors.
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on; 03/2009

Institutions

  • 2011
    • KTH Royal Institute of Technology
      • School of Electrical Engineering (EE)
      Stockholm, Stockholm, Sweden