Publications (2)1.45 Total impact
-
Article: High-speed electrical testing of multichip ceramic modules
[show abstract] [hide abstract]
ABSTRACT: This paper reports on the successful application of very-high-performance robotics in the electrical testing of multichip modules using only two probes, breaking with the old traditional array of probes as the primary test method. Complete production line tools include two high-speed Hummingbird® probing robots and precise x-y tables to carry them and a fast, accurate opens-shorts test. To ensure fast probe placement without damaging the part under test requires real-time control hardware and software to operate with extreme precision, flexibility, and programmability to accommodate any part. Finally, because a module can have nearly 100,000 points to be probed, computing an optimal path for the two probes to take for full testing of a part can greatly reduce test time.Ibm Journal of Research and Development 08/2005; · 0.72 Impact Factor -
Article: Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects
[show abstract] [hide abstract]
ABSTRACT: Nonlinear electrical conduction effects arising from local heating provide a means for detecting the presence of latent defects that are at risk of becoming open electronic circuits under stress. A special choice of ac drive current results in a dc intermodulation signal produced by nonlinear conduction, and offers several practical advantages over previous techniques involving ac harmonics. A key feature is the use of digital signal processing to provide speed, accuracy, and flexibility of measurement. A manufacturing screening system involving an automated prober integrated with the defect-detection tool is used to test high-performance glass-ceramic substrate interconnects used in advanced microelectronic packaging.Ibm Journal of Research and Development 08/2005; · 0.72 Impact Factor
