A. Leinse

Publications (3)2.78 Total impact

• Source

  Available from: Jens Bolten

  Conference Proceeding: The ICT-BOOM project: Photonic routing on a silicon-on-insulator hybrid platform

  C. Stamatiadis, L. Stampoulidis, K. Vyrsokinos, I. Lazarou, L. Zimmermann, K. Voigt, L. Moerl, J. Kreissl, B. Sedighi, Z. Sheng, [......], M. Karl, T. Wahlbrink, J. Bolten, A. Leinse, R. Heidemann, F. Gomez-Agis, H.J.S. Dorren, A. Pagano, E. Riccardi, H. Avramopoulos
  [show abstract] [hide abstract]
  ABSTRACT: BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.
  Optical Network Design and Modeling (ONDM), 2011 15th International Conference on; 03/2011
• Conference Proceeding: 4 x 40 Gb/s all-optical wavelength conversion using SOAs and integrated arrays of ring resonators and DIs

  C. Stamatiadis, I. Lazarou, L. Stampoulidis, K. Vyrsokinos, B. Schrenk, A. Leinse, R. Heideman, C. Bruinink, E. Klein, H. Avramopoulos
  [show abstract] [hide abstract]
  ABSTRACT: We present 4×40Gb/s all-optical wavelength conversion employing SOAs fiber-interconnected with integrated arrays of tunable Si₃N₄-SiO₂ micro-ring resonators and delay interferometers. We demonstrate chirp filtering and polarity inversion on-chip.
  Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2011 and the National Fiber Optic Engineers ConferenceOptical Fiber Communication Conference and Exposition (OFC/NFOEC), 2011 and the National Fiber Optic Engineers Conference; 01/2011
• Article: Fabrication and Experimental Demonstration of a Four-Channel x 40 Gb/s TriPleX All-Optical Wavelength Conversion Platform

  C. Stamatiadis, K. Vyrsokinos, L. Stampoulidis, I. Lazarou, B. Schrenk, A. Leinse, R. Heideman, C. Bruinink, E. J. Klein, H. Avramopoulos
  [show abstract] [hide abstract]
  ABSTRACT: We present a scalable circuit that performs multichannel, all-optical wavelength conversion employing semiconductor optical amplifiers (SOAs) and a densely integrated TriPleX photonic chip. The TriPleX device performs chirp filtering and signal polarity inversion with on-chip signal processing. The chip includes a total number of 40 arrays of Si₃N₄-SiO₂ microring resonators, delay interferometers and heating elements. The total footprint of each array is 2.19 mm² and the power consumption per integrated heater is below 80 mW. We have interconnected the TriPleX chip with SOAs and we demonstrate experimentally 4 × 40 Gb/s, parallel and wavelength tunable wavelength conversion with power penalties of less than 3 dB.
  Journal of Lightwave Technology 01/2011; 29(12):1886-1891. · 2.78 Impact Factor