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ABSTRACT: With more and more high power high brightness LEDs adopted in general lighting applications, the state-of-the-art packages cannot meet the requirement of thermal management. Over-heating of an LED will cause premature failure because the efficiency, the spectrum, the reliability and the life of solid state lighting devices strongly depend on successful thermal management. Therefore, the requirement for improving the performance and the reliability poses a significant challenge for novel cooling solutions including applications of heat sinks with active cooling methods and high thermal performance materials. Conventional mechanical fans are not preferred in LED devices due to its high energy consumption, short life and high noise. In this study, cooling fixtures with piezoelectric units are designed to be integrated with high power LED modules. The cooling effect of high performance TIM and piezoelectric units are investigated using numerical modeling method.
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference; 08/2011