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ABSTRACT: In this paper, an alternative test method for MEMS convective accelerometers is presented. It is first demonstrated that device sensitivity can be determined without the use of physical test stimuli by simple electrical measurements. Using a previously developed behavioral model that allows efficient Monte-Carlo simulations, we have established a good correlation between electrical test parameters and device sensitivity. Proposed test method is finally evaluated for different strategies that privilege yield, fault coverage or test efficiency.
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011; 04/2011
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ABSTRACT: In this paper, we investigate the impact of packaging on the behavior of MEMS convective accelerometers. The objective is to identify the influence of package dimensions on system performances to develop in a close future a compact model that integrates those influences. Experiments are based on FEM simulations and results are discussed with respect to the package height, the package shape and the depth of the bottom cavity.
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on; 06/2010
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ABSTRACT: This paper presents a strategy for synthesizing analog cascaded filters with optimal test point insertion. The strategy is based on the implementation of a selective divide-and-conquer approach that permits to ensure high fault detection capabilities while limiting DFT penalties and reducing test time. The proposed solution relies on the evaluation of the filter testability at the different inputs and outputs of the cascaded blocks in order to add DFT only when this testability is not sufficient. Efficient testability evaluation is provided through high-level fault modeling and simulation.
Journal of Electronic Testing 01/2005; 21(1):9-16. · 0.47 Impact Factor
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C. Jeffrey,
N. Dumas,
Z. Xu,
F. Mailly, F. Azaïs,
P. Nouet,
R.J.T. Bunyan,
D.O. King,
H. Mathias,
J.P. Gilles,
A.M.D. Richardson
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ABSTRACT: A novel on-line monitoring technique for integrated MEMS is presented based on injection of an electrical test stimulus into the bias structure through both superposition or modulation. The techniques “bias superposition and bias modulation” both support integrated structural test that targets both production test and on-line condition monitoring through generation of dependability metric. It can in some cases be used to provide the raw data for on-line calibration and compensation. The techniques are demonstrated on three integrated MEMS structures from the field of consumer electronics, aerospace and environmental sensing and have been successfully applied to a thick film conductance sensor.
Sensors and Actuators A: Physical.
