Xiaoxing Wang

Publications (2)2.27 Total impact

• Article: (Bi1/2Na1/2)TiO3–Ba(Cu1/2W1/2)O3 Lead‐Free Piezoelectric Ceramics

  Xiaoxing Wang, Helen Lai‐Wa Chan, Chung‐Loong Choy
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  ABSTRACT: (Bi1/2Na1/2)TiO3 with 0–6 mol% Ba(Cu1/2W1/2)O3 (BNT-BCW), a new member of the BNT-based group, has been prepared following the conventional mixed oxide route. The compacted bodies were sintered at 1130°C for 2 h to get dense ceramics. The addition of BCW into BNT ceramics facilitated the poling process because of a reduction in leakage current. 0.995BNT·0.005BCW ceramics exhibit a relatively high piezoelectric constant (d33= 80 × 10−12 C/N) and a relatively low dielectric loss (tan δ= 1.5%). Increased amount of BCW was found to increase the dielectric constant and loss of BNT-BCW ceramics and to suppress the grain growth. During sintering, some BCW diffuses into the lattice of BNT to form a solid solution and some remains on the grain boundaries.
  Journal of the American Ceramic Society 12/2004; 86(10):1809 - 1811. · 2.27 Impact Factor
• Article: Piezoelectric and dielectric properties of CeO2-added (Bi0.5Na0.5)0.94Ba0.06TiO3 lead-free ceramics

  Xiaoxing Wang, Helen Lai-Wa Chan, Chung-loong Choy
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  ABSTRACT: The electrical properties of (Bi0.5Na0.5)0.94Ba0.06TiO3 ceramics have been improved greatly by adding some CeO2. At room temperature, the sample containing 0.4 wt% CeO2 shows a stronger ferroelectricity and a quite good performance: relatively large remanent polarization Pr=37.7 μC/cm2, relatively high coercive field Ec=37.1 kV/cm, high piezoelectric constant (d33=152 pC/N), high coupling factor (Kp=34%), enhanced dielectric constant (εr=652) and low dissipation factor (tgδ=1.2%) at 1 kHz. X-ray diffraction shows that CeO2 diffuses into the lattice of (Bi1/2Na1/2)TiO3 to form a solid solution during sintering, but does not change co-existence of tetragonal and rhombohedral phases in (Bi1/2Na1/2)TiO3-BaTiO3 during sintering. Meanwhile, scanning electron microscope observation indicates that a small amount of CeO2 affects the microstructure.
  Solid State Communications.