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ABSTRACT: A 3-D graphics SoC, with a multi-layer advanced microcontroller bus architecture (AMBA) system, full pipelined hardware 3-D graphics accelerator, and clock/power management is proposed as a 49-mm<sup>2</sup> die for 180-nm CMOS technology. This system-on-chip (SoC) minimizes power consumption with a clock/power management unit according to its operation mode and applications. The 3-D graphics accelerator has a full pipelined architecture which improves full 3-D graphics performance to 8M polygons/s and consumes 108 mW at 100 MHz and 1.8 V. The LCD bypass mode and power-down mode consume 4.32 mW and 180 uW, respectively. The 3-D graphics accelerator also supports stereoscopic 3-D function with an alternative left-right drawing method and achieves a 59% improvement in 3DG performance compared to previous work.
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 09/2011; · 1.22 Impact Factor
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IEEE Trans. VLSI Syst. 01/2011; 19:1490-1495.
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[show abstract]
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ABSTRACT: A 3-D graphics SoC, with a multi-layer advanced micro-controller bus architecture (AMBA) system, full pipelined hardware 3-D graphics accelerator, and clock/power management is proposed as a 49-mm die for 180-nm CMOS technology. This system-on-chip (SoC) minimizes power consumption with a clock/power management unit according to its operation mode and applications. The 3-D graphics accelerator has a full pipelined architecture which improves full 3-D graphics performance to 8M polygons/s and consumes 108 mW at 100 MHz and 1.8 V. The LCD bypass mode and power-down mode consume 4.32 mW and 180 uW, respectively. The 3-D graphics accelerator also supports stereoscopic 3-D function with an alternative left-right drawing method and achieves a 59% improvement in 3DG performance compared to previous work. Index Terms—3-D graphics (3DG) accelerator, 3-D display, 3DG system-on-chip (SoC), geometric engine, rendering engine.
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 01/1490; 19. · 1.22 Impact Factor