P. Heide

Electronic Components, Modules and Systems (EPCOS), München, Bavaria, Germany

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Publications (58)14.26 Total impact

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    ABSTRACT: A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art brand new 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for dual band WLAN and GPS, number of SMD components and metal case which provides mechanical protection and implements EMI shielding. A laminate substrate provides the interconnection and distribution of the signals and ground to various components and acts as the carrier to support the die and allow the die IOs to be distributed to the package IOs. Very compact SiP solution with dimensions of 9.5×11.9×1.2mm<sup>3</sup> forms a complete stand-alone multi functional wireless communication system.
    Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International; 07/2011
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    ABSTRACT: A flip chip single die WiFi FEM is developed using Bi-FET (HBT+E/D-PHEMT) technology for smart phone application. High thermal conductive copper-pillar bumps were developed for the flip chip process. This FEM flip chip die consists of a high-pass filter (HPF), a 2 GHz WiFi PA with on-chip regulator, PAON logic and detector circuit, and an SP3T. It showed good over-voltage and over-temperature performance when mounted on test LTCC module. Thermal modeling and design optimization kept junction temperatures comparable to wirebond versions of the design. A complete WiFi front-end LTCC module was developed using flip chip FEIC, integrated balun and SAW filter, with 3.2 mm × 3.2 mm size for Smart Phone Application.
    Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International; 06/2010
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    ABSTRACT: This paper describes a design of a surface acoustic wave (SAW) ladder-type bandpass filter (BPF) for 2.4-2.5 GHz ISM-band, based on the low temperature co-fired ceramic (LTCC) substrate, which can be used in 802.11b/g wireless LAN and Bluetooth applications. It obtains an excellent state-of-the-art performance in the ultra small package. The proposed architecture is based on a combination of SAW and low temperature co-fired ceramic (LTCC) technologies, where the multilayer LTCC substrate is used for integration of matching and passband-driving elements and for obtaining additional transmission zeros. It is comprised of three series and two parallel SAW resonators, realized on the LiTaO<sub>3</sub> piezoelectric substrate and connected accordingly to a ladder-type T-topology circuit design, and an additional resonator to obtain an attenuation at 2.57-2.62 GHz IMT-E (TDD) band. Two input/output matching inductors and three additional inductors, permitting to obtain a sufficient suppression level at 2.11-2.17 GHz UMTS (DL) band and harmonics, are completely integrated within ceramic. The described bandpass filter has ultra small dimensions of 1.1 × 1.4 × 0.9 mm, very low insertion losses of -1.5 dB max in the passband. This fully matched SAW bandpass filter has achieved excellent selectivity performance with the up-to-date smallest package size.
    Microwave Conference, 2009. APMC 2009. Asia Pacific; 01/2010
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    ABSTRACT: This paper describes the design of 2.4-2.5GHz bandpass ladder-type SAW filter and methods to improve its characteristics. The structure of the filter is based on modified π-type topology with external matching inductors. The piezoelectric crystal (LiTaO3) is placed on the low temperature co-fired ceramic (LTCC) substrate while all external elements are completely integrated into LTCC. Input sections of the filter with their characteristics were considered in detail what allowed to reduce the degradation of the filter characteristics due to increasing of its bandwidth. An effective way to create a transmission zero by introduction of magnetic coupling between input and output matching coils is presented in the paper.
    01/2010;
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    ABSTRACT: This paper reports on the design of a very compact dual-band highly-integrated front-end module for size-critical wireless applications supporting IEEE 802.11a/b/g standards. The module consists of two novel high-rejection lumped-element diplexers which are connected to one common antenna via single-pole-double-through (SPDT) switch. The novelty of the realized diplexers consists in a new conjugate-matching method which allows to design very compact diplexers without additional matching networks. The LTCC integrated diplexers are placed between two ground planes ensuring high electromagnetic compatibility which allows using them as building blocks of the highly-integrated wireless LAN (WLAN) front-end module. The physical dimensions of the complete module are 3.0 times 3.0 times 0.95 mm. Up to date this is a smallest LTCC-based switch-diplexer FEM published so far.
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International; 07/2009
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    ABSTRACT: This paper presents a dual-band (2 and 3 GHz) and a single-band (2 GHz) highly-integrated WiMAX System-in-Package module based on LTCC (Low Temperature Cofired Ceramics). They comprise of complete passive and active RF frontend plus the RFIC for up- and down-conversion to the base band. Both modules support 1times2 (1 transmit, 2 receive paths) MIMO operability. The top level measurements of the SiPs show full performance and thus fully validate the LTCC integration approach.
    Radio and Wireless Symposium, 2009. RWS '09. IEEE; 02/2009
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    ABSTRACT: This paper reports on the design of a very compact dual-band highly-integrated front-end module for size-critical wireless applications supporting IEEE 802.11a/b/g standards. The module consists of two novel high-rejection lumped-element diplexers which are connected to one common antenna via single-pole-double-through (SPDT) switch. The novelty of the realized diplexers consists in a new conjugate-matching method which allows to design very compact diplexers without additional matching networks. The LTCC integrated diplexers are placed between two ground planes ensuring high electromagnetic compatibility which allows using them as building blocks of the highly-integrated wireless LAN (WLAN) front-end module. The physical dimensions of the complete module are 3.0 times 3.0 times 0.95 mm. Up to date this is a smallest LTCC-based switch-diplexer FEM published so far.
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International; 01/2009
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    ABSTRACT: In this paper a new approach for miniaturizing multilayer LTCC designs (Low Temperature Co-Fired Ceramics is proposed. Using the stacking options inside LTCC more consequently, a new very compact high-rejection balanced bandpass filter for WirelessLAN (based on IEEE 802.11a standard) is realized. The demonstrated filter performance is a very promising. With only 2.7 dB insertion loss in the band of interest and excellent out-of-band attenuation it occupies area less than 1.8 mm<sup>2</sup>. Compared to designs with the same dielectric constant this downsizes by factor of two the required area without degrading the performance. The correlation between measurement and simulation results is a very good.
    Microwave Conference, 2008. EuMC 2008. 38th European; 12/2008
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    ABSTRACT: A very compact dual-band LTCC module supporting WiMAX IEEE 802.16e-2005 and Wi-Fi IEEE 802.11 a/b/g standards is presented. The frontend module (FEM) integrates in less than 50 mm<sup>2</sup> all required passive and active functions for 1 times 2 (1 transmit, 2 receive paths) MIMO operability. The FEM package has SMT compatible footprint and is 1.4 mm high. Full FEM measurements results show good performance and fully validate the passive integration approach.
    Microwave Symposium Digest, 2008 IEEE MTT-S International; 07/2008
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    ABSTRACT: This paper reports on a design of a balanced filter based on a new lumped LC type balun. The realization disadvantages of conventional LC baluns integrated in a front-end module have been discussed and a new low profile lumped-element balun has been proposed. The balanced filter is realized as a combination of a second order band pass filter and the novel LC balun with an additional low-pass circuit. The proposed layout has been realized using multilayer low temperature co-fired ceramic (LTCC) technology. The resulting structure exhibits excellent electrical performance, immunity to manufacturing tolerances and compactness. The realized low profile balanced filter is placed between two ground planes ensuring high electromagnetic compatibility which allows using this balanced filter as a building block of highly integrated WiMAX front-end modules.
    Microwave Symposium Digest, 2008 IEEE MTT-S International; 07/2008
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    ABSTRACT: This paper presents a highly integrated WiMax system-in-package (SiP) based on LTCC technology (low temperature co-fired ceramics). It comprises the complete passive and active RF frontend plus the transceiver RFIC for up- and down-conversion to base band. The overall size of such a smart package strongly depends on the applied technology and level of integration (multiband/multimode). The benefits on size reduction coming from advanced integration and assembly technologies are discussed and a very compact LTCC SiP with less than 50 mm<sup>2</sup> size and SMT-compatible footprint is demonstrated. Top level measurements show full performance and thus fully validate the LTCC integration approach.
    Microwaves, Communications, Antennas and Electronic Systems, 2008. COMCAS 2008. IEEE International Conference on; 06/2008
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    ABSTRACT: This paper presents a high performance filter for wireless LAN applications in mobile phones. Excellent out-of- band attenuation performance in combination with low insertion loss is achieved by a combination of a SAW filter with high attenuation close to passband with a simple low-loss LTCC filter. The achieved performance makes it possible to use such filter in highly-integrated WLAN front-end modules.
    Microwave Conference, 2007. European; 11/2007
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    ABSTRACT: This paper reports on the design of a balanced filter based on a new transformer type balun. The disadvantages and performance drawbacks of simple second order transformer are discussed and new third order balun structure is proposed. The new structure is realized as broadside coupled lines vertically stacked using multilayer low temperature co-fired ceramic (LTCC) technology. The resulting structure exhibits excellent electrical performance, immunity to manufacturing tolerances and compactness, which allows using this balanced filter as a building block of highly integrated WLAN front-end modules.
    Microwave Conference, 2007. European; 11/2007
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    ABSTRACT: This paper presents a new very small low temperature co-fired ceramic (LTCC) diplexer based on a dual-band bandpass filter for wireless LAN (IEEE 802.11 a/b/g) application. The diplexer and the dual-band filter design have been realized and demonstrated in this article. Measurement results agree quite well with simulation. The new type of such diplexer significantly reduces the number of components and the size of dual-band WLAN frontend modules.
    Microwave Symposium, 2007. IEEE/MTT-S International; 07/2007
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    ABSTRACT: This paper investigates the design and evaluation of low temperature co-fired ceramic (LTCC) heatsinks in frontend modules (FEMs) with integrated power amplifiers (PAs) for wireless-LAN IEEE 802.11 applications. The thermal resistance of this heatsink is measured using two chip thermistors and the accuracy of the proposed measurement method is determined. This method is experimentally validated by the high temperature operating life (HTOL) test, and reliability data is extracted for an EPCOS WLAN FEM with integrated PA, which is currently in mass production
    European Microwave Integrated Circuits Conference, 2006. The 1st; 10/2006
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    ABSTRACT: This paper reports on miniaturized lumped-distributed balun for balanced filtering applications. Detailed analysis of suppression performance of the lumped-distributed balun is introduced. Different types of baluns and their interconnection in series with filter were considered. Baluns have been implemented using LTCC technology and experimentally validated.
    Microwave Conference, 2005 European; 11/2005
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    ABSTRACT: In the present work, a design procedure for multiplexer development has been described. This procedure allows to reduce development time by using of some local optimizations instead of one global. LTCC (low-temperature co-fired ceramic) triplexer for WiMax (IEEE 802.16e) applications, designed in accordance with described procedure, has been presented. The measured results agree well with the simulation.
    Microwave Conference, 2005 European; 11/2005
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    ABSTRACT: This paper reports on the design of a novel LC balun based on a replacement circuit of right-handed (RH) and left-handed transmission lines in combination. This approach gives a very simple balun structure with excellent broadband performance. The balun is designed for WLAN applications in the 5 GHz ISM band. Concept of the balun, simulation, realisation and measurement results are presented.
    Microwave Conference, 2005 European; 11/2005
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    ABSTRACT: This paper presents novel highly-integrated LTCC diplexers for dual-band wireless-LAN (IEEE 802.11 a/b/g) applications. Two diplexer versions with integrated high-rejection filters have been realized and optimized for the receive and for the transmit mode. The measured results demonstrate excellent performance. The realized reference board demonstrates, that the number of components in a dual-band WLAN front-end design can be reduced by a factor of three, due to this new approach.
    Microwave Symposium Digest, 2005 IEEE MTT-S International; 07/2005
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    ABSTRACT: This work presents ultra small frontend modules (FEMs) for wireless-LAN. Based on LTCC technology, two different fully-integrated FEMs have been built. The first one is a 2.4 GHz FEM for 802.11 b/g. The second is a fully-featured dual-band (2.4 and 5 GHz) FEM for 802.11 a/b/g. The measurements demonstrate superior performance of the modules compared to current discrete solutions. According to the authors' knowledge, the new FEMs are the highest-integrated and smallest-size WLAN frontend circuits reported so far.
    Radio and Wireless Conference, 2004 IEEE; 10/2004