K Kim

Publications (5)0 Total impact

• Source

  Available from: Sanghyun Hwang

  Conference Proceeding: Silicon Integrated Circuits Incorporating Antennas

  K.K. O, K. Kim, B. Floyd, J. Mehta, H. Yoon, C.-M. Hung, D. Bravo, T. Dickson, X. Guo, R. Li, [......], J.-J. Lin, Y. Su, C. Cao, M.-H. Hwang, Y.-P. Ding, Z. Li, S.-H. Hwang, H. Wu, S. Sankaran, N. Zhang
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  ABSTRACT: The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip interconnection, and implementation of true single chip radios, beacons, radars, RFID tags and others, as well as contact-less high frequency testing
  Custom Integrated Circuits Conference, 2006. CICC '06. IEEE; 10/2006
• Source

  Available from: Sanghyun Hwang

  Conference Proceeding: The feasibility of on-chip interconnection using antennas

  K.K. O, K. Kim, B. Floyd, J. Mehta, H. Yoon, C.-M. Hung, D. Bravo, T. Dickson, X. Guo, R. Li, [......], A. Sugavanam, J.-J. Lin, S. Yu, C. Cao, M.-H. Hwang, Y.-R. Ding, S.-H. Hwang, H. Wu, N. Zhang, J.E. Brewer
  [show abstract] [hide abstract]
  ABSTRACT: The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. Besides, on-chip interconnection, this technology can potentially be applied for implementation of true single chip radio and radar, interchip communication systems, RFID tags and others.
  Computer-Aided Design, 2005. ICCAD-2005. IEEE/ACM International Conference on; 12/2005
• Source

  Available from: ncsu.edu

  Conference Proceeding: Wireless communications using integrated antennas

  K.K. O, K. Kim, B. Floyd, J. Mehta, H. Yoon, C.-M. Hung, D. Bravo, T. Dickson, X. Guo, R. Li, [......], W. Bomstad, J. Branch, D.-J. Yang, J. Bohorquez, L. Gao, A. Sugavanam, J.-J. Lin, J. Chen, F. Martin, J. Brewer
  [show abstract] [hide abstract]
  ABSTRACT: The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction between transmitted and received signals and nearby circuits appear to be manageable. This technology can potentially be applied for implementation of a true single chip radio, on-chip and inter-chip communication systems, RFID tags, and others.
  Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International; 07/2003
• Conference Proceeding: Wireless interconnection in a CMOS IC with integrated antennas

  B. Floyd, K. Kim, O. Kenneth
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  ABSTRACT: Improved RF capability and projected increase in die size for CMOS circuits lead to the concept of wireless communications within and between chips. A potential application is wireless clock distribution, proposed as an alternative interconnect system capable of distributing high frequency clock signals at the speed of light using microwaves. The wireless clock distribution system consists of a clock transmitter, located on or off chip, broadcasting a microwave global clock signal at frequencies greater than 15 GHz, and a grid of integrated clock receivers. The global clock signal is received using an integrated dipole antenna. The signal is then amplified using a low-noise amplifier (LNA), frequency divided down to the local clock frequency, buffered, and distributed to provide local clock signals. This IC operating at 7.4 GHz, which integrates antennas and necessary receiver circuits in 0.25 μm CMOS with five metal layers on p-substrates, is a first step towards realizing such a system
  Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International; 02/2000
• Conference Proceeding: Characteristics of integrated dipole antennas on bulk, SOI, and SOS substrates for wireless communication

  K. Kim, K.K. O
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  ABSTRACT: Integrated antennas were fabricated on bulk, SOI, and SOS substrates, and characterized. A measurement set-up was developed for integrated antenna characterization. The measurements confirm power transmission through radiation and show reasonable gains at high frequencies (>15 GHz). Antenna input impedances were extracted and modeled to aid receiver and transmitter circuit design. The measurements suggest that radio communication within and between ICs using antennas may be feasible
  Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International; 07/1998