M. Ogihara,
H. Fujiwara,
M. Mutoh,
T. Suzuki,
T. Igari,
T. Sagimori, H. Kurokawa,
T. Kaneto,
H. Furuta,
I. Abiko,
M. Sakuta
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ABSTRACT: A 600 dots per inch LED array chip integrated with Si drivers using a three-dimensional epitaxial thin-film bonding has been developed. Performance tests showed high emitted light power (47 μW at an LED current of 1 mA) with smaller variations (±7%), and long lifetime. Test results provide good enough characteristics to use the LED array chip in a high-printing-speed LED printer printhead.
Electronics Letters 08/2006; · 0.96 Impact Factor
