D. Erickson

Publications of D. Erickson

• Stochastic Modular Robotic Systems: A Study of Fluidic Assembly Strategies

  Authors: M.T. Tolley, M. Kalontarov, J. Neubert, D. Erickson, H. Lipson

  Robotics, IEEE Transactions on. 07/2010;

  Modular robotic systems typically assemble using deterministic processes where modules are directly placed into their target position. By contrast, stochastic modular robots take advantage of ambientModular robotic systems typically assemble using deterministic processes where modules are directly placed into their target position. By contrast, stochastic modular robots take advantage of ambient environmental energy for the transportation and delivery of robot components to target locations, thus offering potential scalability. The inability to precisely predict component availability and assembly rates is a key challenge for planning in such environments. Here, we describe a computationally efficient simulator to model a modular robotic system that assembles in a stochastic fluid environment. This simulator allows us to address the challenge of planning for stochastic assembly by testing a series of potential strategies. We first calibrate the simulator using both high-fidelity computational fluid-dynamics simulations and physical experiments. We then use this simulator to study the effects of various system parameters and assembly strategies on the speed and accuracy of assembly of topologically different target structures.

• A robotic module for stochastic fluidic assembly of 3D self-reconfiguring structures

  Authors: J. Neubert, A.P. Cantwell, S. Constantin, M. Kalontarov, D. Erickson, H. Lipson

  Robotics and Automation (ICRA), 2010 IEEE International Conference on; 06/2010

  Stochastic self-reconfiguring robots are modular robots that possess the ability to autonomously change the arrangement of their modules and do so through the use of non-deterministic processes. WeStochastic self-reconfiguring robots are modular robots that possess the ability to autonomously change the arrangement of their modules and do so through the use of non-deterministic processes. We present a concept for a robotic system in which the stochastic behavior of turbulent flow in a chamber is used during assembly and disassembly operations. The thermorheological properties of Pluronic^® are used to implement flow routing for controlling the assembly process. This is the first use of thermorheological valving in three dimensions. A novel reversible module connection mechanism using a low melting point alloy which is soldered in a fluid environment is presented. Together with our approach to self-alignment, these are the innovations required to allow scalable self-directed assembly in three dimensions.

• A robotic module for stochastic fluidic assembly of 3D self-reconfiguring structures

  Authors: J. Neubert, A.P. Cantwell, S. Constantin, M. Kalontarov, D. Erickson, H. Lipson

  IEEE International Conference on Robotics and Automation (ICRA), Anchorage, AK, USA; 01/2010

  Stochastic self-reconfiguring robots are modular robots that possess the ability to autonomously change the arrangement of their modules and do so through the use of non-deterministic processes. WeStochastic self-reconfiguring robots are modular robots that possess the ability to autonomously change the arrangement of their modules and do so through the use of non-deterministic processes. We present a concept for a robotic system in which the stochastic behavior of turbulent flow in a chamber is used during assembly and disassembly operations. The thermorheological properties of Pluronic® are used to implement flow routing for controlling the assembly process. This is the first use of thermorheological valving in three dimensions. A novel reversible module connection mechanism using a low melting point alloy which is soldered in a fluid environment is presented. Together with our approach to self-alignment, these are the innovations required to allow scalable self-directed assembly in three dimensions.

• Interfacing methods for fluidically-assembled microcomponents

  Authors: M.T. Tolley, A. Baisch, M. Krishnan, D. Erickson, H. Lipson

  Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on; 02/2008

  Here we present the design and implementation of electrical and mechanical interfaces for fluidically-assembled planar MEMS. We discuss the design and fabrication of systems of passive mechanicalHere we present the design and implementation of electrical and mechanical interfaces for fluidically-assembled planar MEMS. We discuss the design and fabrication of systems of passive mechanical latches to bond microcomponents together and of electrical layers capable of establishing electrical connections with each other. We evaluate the ability of components with these interfaces to bond together within a microfluidic channel and to establish electrical circuits when assembled. This work supports the development of a novel microassembly strategy that bridges the gap between bottom-up self-assembly and top-down direct-manipulation technique. The ultimate goal of this research is the development of MEMS devices capable of the on-demand self-assembly, repair, and reconfiguration.