Publications (5)6.39 Total impact
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Article: Surfactant enhanced antiferromagnetic coupling in magnetron sputtered Cu/Co multilayers: A neutron reflectivity study
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ABSTRACT: In this work we studied Cu/Co multilayers prepared using dc-magnetron sputtering technique with Ag surfactant. It was found that Ag balances the difference in the surface free energy of Cu and Co and this results in removing the asymmetry in the interface roughness of Cu-on-Co and Co-on-Cu interfaces. As the interfaces become symmetric, we observe a significant enhancement in antiferromagnetic coupling and magneto resistance. Further, a correlation of spin-dependent scattering with the interface roughness is brought by comparing Cu/Co multilayer prepared using different deposition methods. It was found that as interface roughness increases spin-dependent scattering decreases.09/2012; -
Article: Surfactant induced symmetric and thermally stable interfaces in Cu/Co multilayers.
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ABSTRACT: In this work we studied Ag surfactant induced growth of Cu/Co multilayers. The Cu/Co multilayers were deposited using Ag surfactant by the ion beam sputtering technique. It was found that Ag surfactant balances the asymmetry between the surface free energies of Cu and Co. As a result, the Co-on-Cu and Cu-on-Co interfaces become sharp and symmetric and thereby improve the thermal stability of the multilayer. On the basis of obtained results, a mechanism leading to symmetric and stable interfaces in Cu/Co multilayers is discussed.Journal of Physics Condensed Matter 11/2011; 23(48):485003. · 2.55 Impact Factor -
Article: Surfactant mediated growth of Ti/Ni multilayers
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ABSTRACT: The surfactant mediated growth of Ti/Ni multilayers is studied. They were prepared using ion beam sputtering at different adatom energies. It was found that the interface roughness decreased significantly when the multilayers were sputtered with Ag as surfactant at an ion energy of 0.75 keV. On the other hand, when the ion energy was increased to 1 keV, it resulted in enhanced intermixing at the interfaces and no appreciable effect of Ag surfactant could be observed. On the basis of the obtained results, the influence of adatom energy on the surfactant mediated growth mechanism is discussed.Applied Physics Letters 04/2011; · 3.84 Impact Factor -
Article: Surfactant induced smooth and symmetric interfaces in Cu/Co multilayers
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ABSTRACT: In this work we studied Ag surfactant induced growth of Cu/Co multilayers. The Cu/Co multilayers were deposited using Ag surfactant by ion beam sputtering technique. It was found that Ag surfactant balances the asymmetry between the surface free energy of Cu and Co. As a result, the Co-on-Cu and Cu-on-Co interfaces become sharp and symmetric and thereby improve the thermal stability of the multilayer. On the basis of obtained results, a mechanism leading to symmetric and stable interfaces in Cu/Co multilayers is discussed.02/2011; -
Conference Proceeding: Effect of Ag as a surfactant on the thermal stability in Cu/Co multilayers
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ABSTRACT: In the present work we studied the effect of Ag as a surfactant in Cu/Co multilayers prepared by ion beam sputtering. Two identical samples of Cu/Co multilayers with 0.2 nm Ag on a Cu buffer layer and without this Ag layer were deposited on Si substrates. It is known that Cu has a lower free energy than Co, and therefore, the Cu/Co interfaces are not symmetric. Addition of Ag alters the kinetics and thermodynamics of the growth and triggers the layer by layer growth as Ag floats on the growing front balancing the surface free energy of Cu and Co. It was found that with addition of Ag surfactant the thermal stability of Cu/Co multilayer improves.POLARIZED NEUTRONS AND SYNCHROTRON X-RAYS FOR MAGNETISM CONFERENCE 2009; 01/2010
