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Publications (2)0 Total impact

  • C.R. Crowell, C.-C. Shih, V.C. Tyree
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    ABSTRACT: The authors consider the prime issues that should be raised when one considers the design of a test system and the procedure to be involved in the test. An extended TEARS (Thermal Energy Accounts for the Resistance of the System) analysis yields end-to-end temperature profiles of an N-fold iterated SWEAT (Standard Wafer-level Electromigration Acceleration Test) structure. The results give guidelines for the choice of voltage probe locations and current injection line lengths and also permit relating measurements on SWEAT structures with different numbers of elemental units and different geometry. Asymmetries in the first and last units correlate with the observed spatial distribution of failures. Criteria for much more rapid convergence and more accurate control of sample stress are presented.< >
    Reliability Physics Symposium, 1991, 29th Annual Proceedings., International; 05/1991
  • C.R. Crowell, C.C. Shih, V. Tyree
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    ABSTRACT: Standard wafer-level electromigration acceleration test (SWEAT) structures show a critical current for imminent thermal runaway for good metal films even within a linear resistance-versus-power relationship. Consideration of heat sinking and lateral thermal conduction along the metal gives a better knowledge of the origin of this critical current. This permits greater speed and stability of control in testing Joule-heated electromigration (SWEAT) structures, as well as improved understanding of the temperature profile associated with a given fractional resistance change during the accelerated life testing.< >
    Reliability Physics Symposium, 1990. 28th Annual Proceedings., International; 04/1990