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ABSTRACT: The paper shows a near field scanning method to characterize chips that leads to the prediction of the coupling phenomena on the electronic board and to the evaluation of the radiated emission at one meter. A theoretical model is first given for simple circuits. An estimation of the scalar and vector potentials is found with the EM scan. Using these results, we calculate the near and far emissions. Comparisons with experimental results are given. As a conclusion, we propose a simple model describing chip radiated emission and we show a real case use
Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on; 06/2003
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7th International Workshop on Electromagnetic compatibility of Integrated circuits (EMC COMPO 09).
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ABSTRACT: Component models that predict functional failure are necessary for predicting the immunity of systems to electromagnetic interference (EMI). A method to extract these models using measurements on integrated circuits (ICs) already exists. This measurement method for ICs with single-ended connections is extended, to include ICs with differential connections. The LM2902 op-amp is measured and modeled as a first case study.
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20th EMC.
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IEICE Transactions on Communications.
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7th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO 09).
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An Industry-Compliant Immunity Modeling Technique for Integrated Circuits.