-
[show abstract]
[hide abstract]
ABSTRACT: We present an antenna array design at 60 GHz on low-temperature co-fired ceramic (LTCC) with a microstrip to coplanar waveguide (CPW) transition. The design consists of aperture-coupled microstrip patch antennas on LTCC Heraeus HL2000 with small embedded air holes to synthesize a lower dielectric substrate. The arrays are excited through a microstrip-line feed network with quarter-wave matching via a microstrip to CPW transition. The transition is designed so that the antenna can be measured with the patch facing upwards while reducing the effect of the probe station. An open cavity is made to ensure the microstrip-line is also placed away from the probe station plate. Good agreement between simulated and measured return loss with simulated gain of 14dB is achieved.
Microwave Conference, 2009. APMC 2009. Asia Pacific; 01/2010
-
[show abstract]
[hide abstract]
ABSTRACT: Miniaturized multilayer ultrawideband monopole antennas on low temperature co-fired ceramic are presented. The antennas each compose of a radiator, ground plane, and transmission line on various layers. For testing purposes, a top layer feed strip is connected by a feed via to the embedded middle layer transmission line. The overall width of the antenna is reduced by folding both the radiator and ground plane. Additional metal patches connected by thru vias are used to fold both the radiator and ground plane, so as to maintain sufficiently long current paths. The impedance and radiation performances are studied and compared for the monopole antennas with single ground plane, double ground planes, and folded ground plane plus folded radiator.
IEEE Transactions on Antennas and Propagation 01/2010; · 2.15 Impact Factor
-
[show abstract]
[hide abstract]
ABSTRACT: This paper discloses the design optimization of embedded electromagnetic bandgap (EBG) structures for noise suppression in power/ground plane applications. We have established the design rules for EBG using finite-element based parametric analysis and extraction of the equivalent circuit models for EBG. The concept can be applied to achieve desired operating frequencies and dimensions, by tuning values of EBG elements. This study mainly focused on design of a miniaturized EBG, with frequency range of 2 GHz to 10 GHz and overall substrate dimension of 20 mm times 20 mm. Several parameters have been studied in EBG design including via diameter, via length, patch dimension and dielectric constant of material. Equivalent circuit analysis is used to analyze design parameters. By leveraging on liquid crystal polymer (LCP) with a dielectric constant of 2.9, an ultra-thin EBG implementation is achieved. With our approach, the volumetric efficiency, defined as the -30 dB bandwidth per substrate volume, ranges from 0.046 to 0.181 GHz per mm<sup>3</sup>, more than 10 times better than conventional topologies.
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th; 01/2009
-
[show abstract]
[hide abstract]
ABSTRACT: Recently, the timing control of high-frequency signals is strongly demanded due to the high integration density in three-dimensional (3D) LTCC-based SiP applications. Therefore, to control the skew or timing delay, new 3D delay lines will be proposed. For frailty of the signal via, we adopt the concept of coaxial line and proposed an advanced signal via structure with quasi coaxial ground (QCOX-GND) vias. We will show the simulated results using EM and circuit simulator.
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th; 06/2008
-
[show abstract]
[hide abstract]
ABSTRACT: Advancement in semiconductor technologies including CMOS and SiGe is enabling the commercialisation of devices that have increased switching speed, reduced power supply and increased circuit complexity. Proliferation of high-speed systems in both digital and mixed-signal applications is also driving the need for advanced noise suppression techniques. This paper describes a novel approach of using miniaturized electromagnetic bandgap structures. By leveraging on low shrinkage composite ceramics technology to increase the dielectric loading of the EBG structures, we have achieved significant improvement in the bandwidth and start frequency of more than 30% and 90%, respectively, when compared with conventional approaches.
Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on; 06/2008
-
[show abstract]
[hide abstract]
ABSTRACT: The potential of SSL (solid-state lighting) is boundless, and SSL is the future of light. However with the heat flux increasing rapidly with high-power LEDs, thermal management is critically important for the light quality and lighting reliability in the power LED lighting system. By leveraging our low temperature co-fired ceramic (LTCC) technology, we have designed and fabricated an LTCC-based power SSL engine which consists of arrays of 36 LEDs with a total power of 36 watts and a on-chip power density of 100 W/cm<sup>2</sup>. The thermal performance evaluation and experimental validation of the light engine were carried out. Based on the thermal simulation and experimentation, we can conclude that the correlation between the experimental and simulation results is very good. The junction-board thermal resistance is 0.52degC/W for the power SSL module with an array of 36 LEDs.
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th; 01/2008
-
[show abstract]
[hide abstract]
ABSTRACT: This paper reports on our latest development in mask-less patterning of conductors on LTCC (Low Temperature Co- fired Ceramic ) by integrating inkjet printing with electroless plating process. The objective of this process integration is to realize reliable, high aspect interconnections and passives on LTCC substrates. Due to the intrinsic properties of the inkjet printable ink, the printed ink typically forms thin film. Hence the resistance of the traces is much higher than conventional bulk metal traces. In this study, we aim to alleviate these limitations by integrating the inkjet printing process with electroless plating process. Co-fired LTCC was used as the substrate, and silver nano-particle colloidal solution was used as printing ink. Conductive lines were inkjet printed on LTCC substrates, followed by curing in conventional oven. Thickness of the conductive traces was successfully plated up to 76 mum. The optimization of inkjet printing process, surface study of inkjet printed seed layer and process integration are presented with details.
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th; 01/2008
-
[show abstract]
[hide abstract]
ABSTRACT: In this paper we propose to integrate two antennas in an IC package that carries the 60-GHz radio chip sets. The antennas realized in this manner are simply called as AiP (antenna-in-package). AiP are radically different as compared with the integrated and chip antenna solutions. The AiP solution offers the possibility to combine antennas with a highly integrated 60-GHz radio into a compact standard surface mounted device. As a result, the system-level board space and the system-level manufacturing can be further reduced and facilitated, respectively.
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th; 01/2008
-
[show abstract]
[hide abstract]
ABSTRACT: The heating element with different configurations has been designed and fabricated by the screen printing approach using the conductive silver ink XZ250 with resistivity of 30 muOmegaldrcm. Thermal and electrical performances of screen printed heating element were evaluated at different electrical input power and certain ambient temperature. The printed heater can heat up temperature 85degC at input power 2.3 W for the configuration of substrate dimension 45 mm x30 mm x0.775 mm. This technique can be applied in micro PCR, micro chemical reactor and microfluidic devices.
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th; 01/2008
-
[show abstract]
[hide abstract]
ABSTRACT: We experimentally investigate the isolation effect of the noise coupling in X/Ku-band transceiver SiP fabricated on low-temperature co-fired-ceramic (LTCC) multilayer substrate, using a double-stacked electromagnetic bandgap (DS-EBG) structure. The fabricated transceiver SiP is composed of Ku- band transmitter and X/Ku-band receiver. To prevent the simultaneous switching noise coupling from digital circuits, a DS-EBG structure was designed and implemented to the transceiver SiP. The effect of DS-EBG, which gives 30 dB stopband over X/Ku-band ranges, was demonstrated through frequency and time domain measurement.
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on; 08/2007
-
[show abstract]
[hide abstract]
ABSTRACT: We propose a novel electromagnetic bandgap (EBG) structure with a significantly extended noise isolation bandwidth, called a double-stacked EBG (DS-EBG) structure, fabricated on a low-temperature co-fired ceramic (LTCC) multilayer substrate. The DS-EBG structure was devised for wideband suppression of simultaneous switching noise (SSN) coupling in system-in-package (SiP) applications. Our design approach was enabled by combining two EBG layers embedded between the power and ground planes. The two EBG layers had different bandgaps from using different cell sizes. Enhanced wideband suppression of the SSN coupling was validated using a 11.4-GHz noise stop bandwidth with 30-dB isolation in time and frequency domain measurements up to 20GHz
IEEE Microwave and Wireless Components Letters 10/2006; · 1.72 Impact Factor
-
[show abstract]
[hide abstract]
ABSTRACT: As multiple chips are being integrated into a single package with increased operating frequency, switching noise coupling on power buses has become an important design issue. To reduce the noise coupling, a split power bus structure has been generally used in package substrates having multilayered power and ground planes. Consequently, there is an increasing need for an efficient method to analyze a split power bus in a multilayered package. This paper introduces a hybrid analytical modeling method for characterizing a split power bus in a multilayered package. The proposed method uses a resonant cavity model combined with a segmentation method. Furthermore, a port assignment technique and an associated calculation method for the equivalent circuit model parameter of the split gap are proposed. The proposed port assignment technique and the analytical equation make it possible to analyze a split power bus, especially in a multilayered package. To verify the proposed method, multilayered test packages are fabricated and tested by means of frequency-domain measurements. In addition, an optimal power bus design method was successfully demonstrated for suppressing noise coupling between chips on a single package. Finally, the proposed method and optimal power bus design method was verified using a series of frequency-domain and time-domain measurements
IEEE Transactions on Electromagnetic Compatibility 03/2006; · 1.18 Impact Factor
-
[show abstract]
[hide abstract]
ABSTRACT: Low temperature cofired ceramic technology (LTCC) is a substrate platform that provides true 3D integration whilst satisfying very high frequency performance requirements with good thermal characteristics. This paper describes the modeling and characterization of multilayer capacitor integration for rf applications
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th; 01/2006
-
[show abstract]
[hide abstract]
ABSTRACT: Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad ranging applications including filtering, tuning and power decoupling. This paper presents the performance characterization of two low temperature processes that are compatible with organic substrates. RF characterization up to 10 GHz was performed to extract the impedance profile, effective capacitance and capacitance density parameters.
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th; 01/2006
-
[show abstract]
[hide abstract]
ABSTRACT: This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency (RF) transceiver. The microstrip patch antenna is fed by packaging interconnect components such as bond wires, signal traces, and vias in a ground-signal-ground (G-S-G) configuration from the carried chip. The circuit model that consists of RLC lumped elements of both microstrip patch antenna and feeding interconnect components has been developed with an emphasis on verifying existing or deriving analytical formulas. The RLC values of the microstrip patch antenna are calculated with our improvements to existing computer-aided design formulas, while the RLC values of the feeding interconnect components are calculated with more efforts. In particular the C values related to the vias and signal traces require to be calculated numerically and they are calculated here with the method of moments and the conformal mapping method, respectively. The circuit model is validated with numerical simulations (High Frequency Structure Simulator) and network analyzer measurements.
IEEE Transactions on Antennas and Propagation 01/2006; · 2.15 Impact Factor
-
[show abstract]
[hide abstract]
ABSTRACT: This paper describes an integrated-circuit package antenna (ICPA) designed and fabricated using low-temperature cofired ceramic (LTCC) technology for wireless transceivers. The ICPA features a shorting via for frequency-band selection. The measured results show that the prototype ICPA with a size of 17 × 17 × 2 mm3 operates at 5.37 GHz when the via is shorted to ground and at 5.67 GHz when the via is opened. The radiation patterns of the ICPA for both cases are similar to those of a conventional microstrip patch antenna on a small ground plane. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 44: 439–441, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20660
Microwave and Optical Technology Letters 01/2005; 44(5):439 - 441. · 0.62 Impact Factor
-
[show abstract]
[hide abstract]
ABSTRACT: This work presents the circuit modelling methodology of a generic feeding network for highly integrated RF transceiver modules. The feeding network consists of module or package interconnects including bond wires, signal traces and vias. Analytical and numerical modelling techniques are applied to calculate the circuit parameters. This circuit modelling approach is also compared with full-wave 3D electromagnetic simulations.
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th; 01/2005
-
[show abstract]
[hide abstract]
ABSTRACT: In order to satisfy module miniaturization requirements for next-generation products, an advanced substrate integration platform is highly desirable. In recent years, intensive research has been carried out on integrating actives and passives within the common substrate platform, to achieve system integration within a module. Low temperature cofired ceramic (LTCC) technology is a substrate platform that provides true 3D integration, whilst satisfying very high frequency performance requirements, with superior thermal performance. This paper will address key manufacturing aspects and associated impact on high-frequency performance. A solution space analysis was employed to identify the key parameters encompassing trace width and gap. Robust manufacturing design rules were developed along with performance validation techniques
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th; 01/2005
-
[show abstract]
[hide abstract]
ABSTRACT: This paper describes a module based system integration using LTCC technology to realize a compact integrated antenna module. This approach enables the adoption of "best-of-breed" CMOS, SiGe and GaAs technologies for RF transceiver, power amplifier and antenna switch components. Key advantages of this module integration approach include integration of embedded passives, BGA or SMT assembly compatibility, co-design of RF components, wire-bond or flip-chip silicon interconnection and compact footprint. The integrated antenna module targeted for WLAN applications was realized using multi-layer LTCC fabrication technology. The module size is 17 × 17 × 2 mm<sup>3</sup>, and can be seamlessly integrated with any planar antenna configuration. In addition to providing RF integration and improved system performance, this platform also enables improved thermal performance required for high power wireless applications whilst achieving a compact footprint for "plug and play" applications in portable mobile communication products.
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th; 01/2005
-
[show abstract]
[hide abstract]
ABSTRACT: An embedded capacitor for noise suppression on a power bus is analyzed and compared with a discrete capacitor by full wave simulation from 40 MHz to 5 GHz. In this paper, the design methodology of the power bus is demonstrated by analyzing self and transfer impedance characteristic of the embedded capacitor.
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on; 09/2004
