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ABSTRACT: The packaging of a medical imaging or therapeutic ultrasound transducer should provide protective insulation while maintaining high performance. For a capacitive micromachined ultrasonic transducer (CMUT), an ideal encapsulation coating would therefore require a limited and predictable change on the static operation point and the dynamic performance, while insulating the high dc and dc actuation voltages from the environment. To fulfill these requirements, viscoelastic materials, such as polydimethylsiloxane (PDMS), were investigated for an encapsulation material. In addition, PDMS, with a glass-transition temperature below room temperature, provides a low Young's modulus that preserves the static behavior; at higher frequencies for ultrasonic operation, this material becomes stiffer and acoustically matches to water. In this paper, we demonstrate the modeling and implementation of the viscoelastic polymer as the encapsulation material. We introduce a finite element model (FEM) that addresses viscoelasticity. This enables us to correctly calculate both the static operation point and the dynamic behavior of the CMUT. CMUTs designed for medical imaging and therapeutic ultrasound were fabricated and encapsulated. Static and dynamic measurements were used to verify the FEM and show excellent agreement. This paper will help in the design process for optimizing the static and the dynamic behavior of viscoelastic-polymer-coated CMUTs.
Journal of Microelectromechanical Systems 01/2011; · 2.10 Impact Factor
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ABSTRACT: The packaging of a medical imaging or therapeutic ultrasound transducer should provide protective insulation while maintaining high performance. For a capacitive micromachined ultrasonic transducer (CMUT), an ideal encapsulation coating would therefore require a limited and predictable change on the static operation point and the dynamic performance, while insulating the high dc and dc actuation voltages from the environment. To fulfill these requirements, viscoelastic materials, such as polydimethylsiloxane (PDMS), were investigated for an encapsulation material. In addition, PDMS, with a glass-transition temperature below room temperature, provides a low Young's modulus that preserves the static behavior; at higher frequencies for ultrasonic operation, this material becomes stiffer and acoustically matches to water. In this paper, we demonstrate the modeling and implementation of the viscoelastic polymer as the encapsulation material. We introduce a finite element model (FEM) that addresses viscoelasticity. This enables us to correctly calculate both the static operation point and the dynamic behavior of the CMUT. CMUTs designed for medical imaging and therapeutic ultrasound were fabricated and encapsulated. Static and dynamic measurements were used to verify the FEM and show excellent agreement. This paper will help in the design process for optimizing the static and the dynamic behavior of viscoelastic-polymer-coated CMUTs.
Journal of Microelectromechanical Systems 12/2010; 19(6):1341-1351. · 2.10 Impact Factor
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ABSTRACT: In this work, we demonstrate 3-D photoacoustic imaging of optically absorbing targets embedded as deep as 5 cm inside a highly scattering background medium using a 2-D capacitive micromachined ultrasonic transducer (CMUT) array with a center frequency of 5.5 MHz. 3-D volumetric images and 2-D maximum intensity projection images are presented to show the objects imaged at different depths. Due to the close proximity of the CMUT to the integrated frontend circuits, the CMUT array imaging system has a low noise floor. This makes the CMUT a promising technology for deep tissue photoacoustic imaging.
Proceedings of the IEEE Ultrasonics Symposium 10/2010; 2010:375-377.
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ABSTRACT: The successful packaging and electronics integration of large 2D array devices with small pitch-sizes, such as fully populated 2D ultrasonic transducer arrays, require a flexible, simple, and reliable integration approach. One example for such electronics integration is based on through silicon vias (TSVs) with under-bump metallization (UBM) stack for solder bumping. In this paper, we demonstrate such an approach by successfully integrating a fully populated 2D ultrasonic transducer array. Our integration is based on a previously reported TSV technology (trench-frame technology), based on trench-isolated interconnects with supporting frame. We successfully combined the trench-frame technology with a simple UBM preparation technique - electro plating or chemical plating techniques with passivation layers for UBM pad definition are not required. Our results show high shear strength (26.5 g) of the UBM, which is essential for successful flip-chip bonding. The yield of the interconnections is 100% with excellent solder-ball-height uniformity (¿ = 0.9 ¿m). As demonstrated in this paper, this allows for a large-scale assembly of a tiled array by using an interposer. A design guideline for finer element-pitch design was developed suggesting that fusion bonding strength and the length of pillars are the main design parameters.
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on; 02/2010
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Srikant Vaithilingam,
Te-Jen Ma,
Yukio Furukawa,
Ira O Wygant, Xuefeng Zhuang,
Adam De La Zerda,
Omer Oralkan,
Aya Kamaya,
Sanjiv S Gambhir,
R Brooke Jeffrey,
Butrus T Khuri-Yakub
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ABSTRACT: In this paper, we describe using a 2-D array of capacitive micromachined ultrasonic transducers (CMUTs) to perform 3-D photoacoustic and acoustic imaging. A tunable optical parametric oscillator laser system that generates nanosecond laser pulses was used to induce the photoacoustic signals. To demonstrate the feasibility of the system, 2 different phantoms were imaged. The first phantom consisted of alternating black and transparent fishing lines of 180 mum and 150 mum diameter, respectively. The second phantom comprised polyethylene tubes, embedded in chicken breast tissue, filled with liquids such as the dye indocyanine green, pig blood, and a mixture of the 2. The tubes were embedded at a depth of 0.8 cm inside the tissue and were at an overall distance of 1.8 cm from the CMUT array. Two-dimensional cross-sectional slices and 3-D volume rendered images of pulse-echo data as well as photoacoustic data are presented. The profile and beamwidths of the fishing line are analyzed and compared with a numerical simulation carried out using the Field II ultrasound simulation software. We investigated using a large aperture (64 x 64 element array) to perform photoacoustic and acoustic imaging by mechanically scanning a smaller CMUT array (16 x 16 elements). Two-dimensional transducer arrays overcome many of the limitations of a mechanically scanned system and enable volumetric imaging. Advantages of CMUT technology for photoacoustic imaging include the ease of integration with electronics, ability to fabricate large, fully populated 2-D arrays with arbitrary geometries, wide-bandwidth arrays and high-frequency arrays. A CMUT based photoacoustic system is proposed as a viable alternative to a piezoelectric transducer based photoacoustic systems.
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 11/2009; 56(11):2411-9. · 1.80 Impact Factor
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ABSTRACT: A large area reconfigurable imaging array for research purposes is being developed with co-integrated cMUTs and control electronics. The goal is a 2.5cm 2D tileable module with >16,000 transducer sub-elements spaced at a pitch of 185um in X and Y dimensions. As a prototype demonstration of some of the goals of this effort, a multi-row linear array using cMUTs and external multiplexing electronics was designed and fabricated. In this paper the challenges of trenched cMUT attach to a laminate interposer as part of a tileable module will be discussed. The architecture of the tileable module build-up for manufacturability, reliability, acoustic planarity, and reduced spacing between tiles and cMUT chips will also be addressed. Finally, a first prototype will be shown and experimental acoustic results with the new cMUT-based probe will be presented.
Ultrasonics Symposium (IUS), 2009 IEEE International; 10/2009
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ABSTRACT: Capacitive micromachined ultrasonic transducers (CMUTs) featuring piston-shaped membranes (piston CMUTs) were developed to improve device performance in terms of transmission efficiency, reception sensitivity, and fractional bandwidth (FBW). A piston CMUT has a relatively flat active moving surface whose membrane motion is closer to ideal piston-type motion compared with a CMUT with uniformly thick membranes (classical CMUT). Piston CMUTs with a more uniform surface displacement profile can achieve high output pressure with a relatively small electrode separation. The improved device capacitance and gap uniformity also enhance detection sensitivity. By adding a center mass to the membrane, a large ratio of second-order resonant frequency to first-order resonant frequency was achieved. This improved the FBW. Piston CMUTs featuring membranes of different geometric shapes were designed and fabricated using wafer bonding. Fabricating piston CMUTs is a more complex process than fabricating CMUTs with uniformly thick membranes. However, no yield loss was observed. These devices achieved ~100% improvement in transduction performance (transmission and reception) over classical CMUTs. For CMUTs with square and rectangular membranes, the FBW increased from ~110% to ~150% and from ~140% to ~175%, respectively, compared with classical CMUTs. The new devices produced a maximum output pressure exceeding 1 MPa at the transducer surface. Performance optimization using geometric membrane shape configurations was the same in both piston CMUTs and classical CMUTs.
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 02/2009; 56(1):136-45. · 1.80 Impact Factor
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ABSTRACT: This paper reports on wafer-bonded, fully populated 2-D capacitive micromachined ultrasonic transducer (CMUT) arrays. To date, no successful through-wafer via fabrication technique has been demonstrated that is compatible with the wafer-bonding method of making CMUT arrays. As an alternative to through-wafer vias, trench isolation with a supporting frame is incorporated into the 2-D arrays to provide through-wafer electrical connections. The CMUT arrays are built on a silicon-on-insulator (SOI) wafer, and all electrical connections to the array elements are brought to the back side of the wafer through the highly conductive silicon substrate. Neighboring array elements are separated by trenches on both the device layer and the bulk silicon. A mesh frame structure, providing mechanical support, is embedded between silicon pillars, which electrically connect to individual elements. We successfully fabricated a 16 x 16-element 2-D CMUT array using wafer bonding with a yield of 100%. Across the array, the pulse-echo amplitude distribution is uniform (rho = 6.6% of the mean amplitude). In one design, we measured a center frequency of 7.6 MHz, a peak-to-peak output pressure of 2.9 MPa at the transducer surface, and a 3-dB fractional bandwidth of 95%. Volumetric ultrasound imaging was demonstrated by chip-to-chip bonding one of the fabricated 2-D arrays to a custom-designed integrated circuit (IC). This study shows that through-wafer trench-isolation with a supporting frame is a viable solution for providing electrical interconnects to CMUT elements and that 2-D arrays fabricated using waferbonding deliver good performance.
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 02/2009; 56(1):182-92. · 1.80 Impact Factor
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[show abstract]
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ABSTRACT: Capacitive micromachined ultrasonic transducers (CMUTs) featuring piston-shaped membranes (piston CMUTs) were developed to improve device performance in terms of transmission efficiency, reception sensitivity, and fractional bandwidth (FBW). A piston CMUT has a relatively flat active moving surface whose membrane motion is closer to ideal piston-type motion compared with a CMUT with uniformly thick membranes (classical CMUT). Piston CMUTs with a more uniform surface displacement profile can achieve high output pressure with a relatively small electrode separation. The improved device capacitance and gap uniformity also enhance detection sensitivity. By adding a center mass to the membrane, a large ratio of second-order resonant frequency to first-order resonant frequency was achieved. This improved the FBW. Piston CMUTs featuring membranes of different geometric shapes were designed and fabricated using wafer bonding. Fabricating piston CMUTs is a more complex process than fabricating CMUTs with uniformly thick membranes. However, no yield loss was observed. These devices achieved ~100% improvement in transduction performance (transmission and reception) over classical CMUTs. For CMUTs with square and rectangular membranes, the FBW increased from ~110% to ~150% and from ~140% to ~175%, respectively, compared with classical CMUTs. The new devices produced a maximum output pressure exceeding 1 MPa at the transducer surface. Performance optimization using geometric membrane shape configurations was the same in both piston CMUTs and classical CMUTs.
IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control 02/2009; · 1.69 Impact Factor
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ABSTRACT: This paper reports on wafer-bonded, fully populated 2-D capacitive micromachined ultrasonic transducer (CMUT) arrays. To date, no successful through-wafer via fabrication technique has been demonstrated that is compatible with the wafer-bonding method of making CMUT arrays. As an alternative to through-wafer vias, trench isolation with a supporting frame is incorporated into the 2-D arrays to provide through-wafer electrical connections. The CMUT arrays are built on a silicon-on-insulator (SOI) wafer, and all electrical connections to the array elements are brought to the back side of the wafer through the highly conductive silicon substrate. Neighboring array elements are separated by trenches on both the device layer and the bulk silicon. A mesh frame structure, providing mechanical support, is embedded between silicon pillars, which electrically connect to individual elements. We successfully fabricated a 16 times 16-element 2-D CMUT array using wafer bonding with a yield of 100%. Across the array, the pulse-echo amplitude distribution is uniform (sigma = 6.6% of the mean amplitude). In one design, we measured a center frequency of 7.6 MHz, a peak-to-peak output pressure of 2.9 MPa at the transducer surface, and a 3-dB fractional bandwidth of 95%. Volumetric ultrasound imaging was demonstrated by chip-to-chip bonding one of the fabricated 2-D arrays to a custom-designed integrated circuit (IC). This study shows that through-wafer trench-isolation with a supporting frame is a viable solution for providing electrical interconnects to CMUT elements and that 2-D arrays fabricated using wafer-bonding deliver good performance.
IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control 02/2009; · 1.69 Impact Factor
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ABSTRACT: Increasing fill factor is one design approach used to increase average output displacement, output pressure, and sensitivity of capacitive micromachined ultrasonic transducers (CMUTs). For rectangular cells, the cell-to-cell spacing and the aspect ratio determine the fill factor. In this paper, we explore the effects of these parameters on performance, in particular the nonuniformity of collapse voltage between neighboring cells and presence of higher order modes in air or immersed operation. We used a white light interferometer to measure nonuniformity in deflection between neighboring cells. We found that reducing the cell-to-cell spacing could cause bending of the center support post, which amplifies nonuniformities in collapse voltage to 18.4% between neighboring cells. Using a 2-D finite element model (FEM), we found that for our designs, increasing the support post width to 1.67 times the membrane thickness alleviated the post bending problem. Using impedance and interferometer measurements to observe the effects of aspect ratio on higher order modes, we found that the (1,3) modal frequency approached the (1,1) modal frequency as the aspect ratio of the rectangles increased. In air operation, under continuous wave (CW) excitation at the center frequency, the rectangular cells behaved in the (1,1) mode. In immersion, because of dispersive guided modes, these cells operated in a higher order mode when excited with a CW signal at the center frequency. This contributed to a loss of output pressure; for this reason our rectangular design was unsuitable for CW operation in immersion.
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 10/2008; 55(9):2053-65. · 1.80 Impact Factor
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ABSTRACT: Flexible transducer arrays are desired to wrap around catheter tips for side-looking intravascular ultrasound imaging. We present a technique for constructing flexible capacitive micromachined ultrasonic transducer (CMUT) arrays by forming polymer-filled deep trenches in a silicon substrate. First, we etch deep trenches between the bottom electrodes of CMUT elements on a prime silicon wafer using deep reactive ion etching. Second, we fusion-bond a silicon-on-insulator (SOI) wafer to the prime silicon wafer. Once the silicon handle and buried oxide layers are removed from the back side of the SOI wafer, the remaining thin silicon device layer acts as a movable membrane and top electrode. Third, we fill the deep trenches with polydimethylsiloxane, and thin the wafer down from the back side. The 16 by 16 flexible 2-D arrays presented in this paper have a trench width that varies between 6 and 20 ; the trench depth is 150 ; the membrane thickness is 1.83 ; and the final substrate thickness is 150 . We demonstrate the flexibility of the substrate by wrapping it around a needle tip with a radius of 450 (less than catheter size of 3 French). Measurements in air validate the functionality of the arrays. The 250- by 250- transducer elements have a capacitance of 2.29 to 2.67 pF, and a resonant frequency of 5.0 to 4.3 MHz, for dc bias voltages ranging from 70 to 100 V.
Journal of Microelectromechanical Systems 05/2008; · 2.10 Impact Factor
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ABSTRACT: In this paper, an improved design of a capacitive micromachined ultrasonic transducer (CMUT) is presented. The design improvement aims to address the reliability issues of a CMUT and to extend the device operation beyond the contact (collapse) voltage. The major design novelty is the isolation posts in the vacuum cavities of the CMUT cells instead of full-coverage insulation layers in conventional CMUTs. This eliminates the contact voltage drifting due to charging caused by the insulation layer, and enables repeatable CMUT operation in the post-contact regime. Ultrasonic tests of the CMUTs with isolation posts (PostCMUTs) in air (electrical input impedance and capacitance vs. bias voltage) and immersion (transmission and reception) indicate acoustic performance similar to that obtained from conventional CMUTs while no undesired side effects of this new design is observed.
Ultrasonics 04/2008; 48(1):74-81. · 1.84 Impact Factor
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ABSTRACT: For three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and the small element size. To compactly connect the transducer array with electronics, we flip-chip bond a 2D 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array to a custom-designed integrated circuit (IC). Through-wafer interconnects are used to connect the CMUT elements on the top side of the array with flip-chip bond pads on the back side. The IC provides a 25-V pulser and a transimpedance preamplifier to each element of the array. For each of three characterized devices, the element yield is excellent (99 to 100% of the elements are functional). Center frequencies range from 2.6 MHz to 5.1 MHz. For pulse echo operation, the average - 6-dB fractional bandwidth is as high as 125%. Transmit pressures normalized to the face of the transducer are as high as 339 kPa and input-referred receiver noise is typically 1.2 to 2.1 mPa/pHz. The flip-chip bonded devices were used to acquire 3D synthetic aperture images of a wire-target phantom. Combining the transducer array and IC, as shown in this paper, allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.
IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control 03/2008; 55(2):327-42. · 1.69 Impact Factor
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ABSTRACT: For three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and the small element size. To compactly connect the transducer array with electronics, we flip-chip bond a 2D 16 times 16-element capacitive micromachined ultrasonic transducer (CMUT) array to a custom-designed integrated circuit (IC). Through-wafer interconnects are used to connect the CMUT elements on the top side of the array with flip-chip bond pads on the back side. The IC provides a 25-V pulser and a transimpedance preamplifier to each element of the array. For each of three characterized devices, the element yield is excellent (99 to 100% of the elements are functional). Center frequencies range from 2.6 MHz to 5.1 MHz. For pulse-echo operation, the average -6-dB fractional bandwidth is as high as 125%. Transmit pressures normalized to the face of the transducer are as high as 339 kPa and input-referred receiver noise is typically 1.2 to 2.1 rnPa/ radicHz. The flip-chip bonded devices were used to acquire 3D synthetic aperture images of a wire-target phantom. Combining the transducer array and IC, as shown in this paper, allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.
IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control 03/2008; · 1.69 Impact Factor
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ABSTRACT: The cost and complexity of medical ultrasound imaging systems can be reduced by integrating the transducer array with an integrated circuit (IC). By incorporating some of the system's front-end electronics into an IC, bulky cables and costly system electronics can be eliminated. Here we present an IC for 3D intracavital imaging that requires few electrical connections but uses a large fraction of a 16times16-element 2D transducer array to transmit focused ultrasound. To simplify the receive and data acquisition electronics, only the 32 elements along the array diagonals are used as receivers. The IC provides a preamplifier for each receiving element. Each of the 224 transmitting elements is provided an 8-bit shift register, a comparator, and a 25-V pulser. To transmit, a global counter is incremented from 1 to 224; each pulser fires when its stored register value is equal to the global count value. Electrical testing of the fabricated IC shows that it works as designed. The IC was flip-chip bonded to a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. A two-dimensional image of a wire target phantom was acquired.
Ultrasonics Symposium, 2007. IEEE; 11/2007
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ABSTRACT: The gap-height directly affects the static operation point of the CMUT which in turn affects the receive sensitivity and the total possible output pressure. In this paper we report on the characterization of fabrication related gap-height variations in CMUTs. The CMUTs under investigation using the sacrificial release process were found to have lower collapse voltage, smaller maximal membrane deflection and missing pull-in behavior as compared to theory. The in-cavity deposition was examined by SEM and the surface topography on the bottom side of the gap by AFM. The AFM measurements were evaluated for devices with and without in-cavity-deposition as well as devices fabricated with doped polysilicon film or doped bulk silicon for the bottom electrode. A methodology to determine the contribution of each layer in the fabrication process to surface roughness is presented. Our results show that surface roughness reduces the actual gap-height, and the polysilicon layer is the main contributor.
Ultrasonics Symposium, 2007. IEEE; 11/2007
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ABSTRACT: We report on the characterization and imaging results of trench-isolated CMUT arrays with a supporting frame. The CMUT arrays are built on a silicon-on-insulator (SOI) wafer using direct wafer-to-wafer fusion bonding technique. Electrical contacts to individual elements are brought to the back side of the wafer by highly conductive silicon pillars. Mechanical support for array elements is provided by a silicon frame structure. 1D and 2D arrays with 250-mum element pitch were fabricated and tested in air and in immersion. Rectangular membranes are used, which feature two distinctive pull-in (collapse) points in both air and immersion tests. The double collapsing membranes enable an operating frequency ranging from 1.9 MHz in conventional mode to 58 MHz in second collapse mode on the same device. After flip-chip bonding the 2D arrays to custom-designed integrated circuits (IC), volumetric imaging was demonstrated.
Ultrasonics Symposium, 2007. IEEE; 11/2007
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ABSTRACT: This paper presents a method to provide electrical connection to a 2D capacitive micromachined ultrasonic transducer (CMUT) array. The interconnects are processed after the CMUTs are fabricated on the front side of a silicon wafer. Connections to array elements are made from the back side of the substrate via highly conductive silicon pillars that result from a deep reactive ion etching (DRIE) process. Flip-chip bonding is used to integrate the CMUT array with an integrated circuit (IC) that comprises the front-end circuits for the transducer and provides mechanical support for the trench-isolated array elements. Design, fabrication process and characterization results are presented. The advantages when compared to other through-wafer interconnect techniques are discussed.
Sensors and Actuators A Physical 08/2007; 138(1):221-229. · 1.80 Impact Factor
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ABSTRACT: This paper reports on a method to fabricate flexible one-dimensional (1D) and two-dimensional (2D) micromachined transducer arrays that are electrically connected to flip-chip bond pads on the back side of the array. In our case, the transducers are capacitive micromachined ultrasonic transducers (CMUT) intended for medical ultrasound imaging. For ultrasound imaging, flexible arrays conform to the body part being imaged. Flexible arrays are also desired for certain catheter and fixed-focus array geometries. Electrical connection to bond pads on the back side of the array is provided for flip-chip bonding to an integrated circuit or flexible PCB. The arrays are made flexible by etching through-wafer trenches and filling the trenches with polydimethylsiloxane (PDMS). The flexibility of the substrate is demonstrated by wrapping it around a needle tip with a radius of 650 mum (French catheter size of 4).
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on; 02/2007
