-
[show abstract]
[hide abstract]
ABSTRACT: The electric thermal network analogy method is widely used to
study thermal behavior of electronic components. This analogy usually
leads to a large resistance-capacitance (RC) network. Conventional
simulation techniques of these networks require substantial
computational resources. This paper presents a new solution technique
based on a recently developed asymptotic waveform evaluation (AWE)
concept which has been successfully used for transient simulation of
large electrical networks. Application of AWE to time dependent thermal
analysis of printed circuit boards often results in two orders of
magnitude speed-up over current iterative techniques, yet retaining
comparable accuracy
IEEE Transactions on Components Packaging and Manufacturing Technology Part A 01/1996;
-
[show abstract]
[hide abstract]
ABSTRACT: This paper presents a new approach for nonlinear transient thermal
analysis of electronic systems, taking into account the temperature
dependency of the convective heat transfer coefficient. The proposed
method is based on using implicit integration techniques to solve the
differential equations representing the heat transfer process. Compared
to standard iterative relaxation methods, the proposed solution
algorithm results in faster convergence rate and improved computational
efficiency
Electronic Components and Technology Conference, 1995. Proceedings., 45th; 06/1995
-
[show abstract]
[hide abstract]
ABSTRACT: Electrical analogy to thermal networks is widely used to study thermal behavior of electronic components. For solution of Poison heat equation, this analogy usually leads to a large resistance-capacitance (RC) network. Conventional simulation techniques when applied to these networks require substantial computational resources. This paper presents new solution technique based on a recently developed Asymptotic Waveform Evaluation (AWE) concept which has been successfully used for simulation of large electrical networks. Applying AWE to thermal analysis of printed circuit boards results in two orders of magnitude speed-up with respect to current iterative techniques with comparable accuracy
Semiconductor Thermal Measurement and Management Symposium, 1995. SEMI-THERM XI., Eleventh Annual IEEE; 03/1995
-
[show abstract]
[hide abstract]
ABSTRACT: Development of highly integrated and denser semiconductor module
configurations with greater power consumption rates make thermal design
increasingly important. In this paper a new solution method for
transient thermal analysis of electronic systems is described. The
method is based on combining finite element technique and efficient
moment-matching technique originally developed in the circuit simulation
area for solving large set of linear differential equations. Finite
element modeling in space/time domain of a complete electronic system
usually results in a large set of ordinary differential equations which
can be solved using various time stepping algorithms. However,
efficiency of conventional algorithms is limited by their computational
cost and stability criteria. In this paper, application of the
moment-matching technique to solve thermal finite element equations is
presented. Several examples are considered to illustrate the
methodology. A good agreement between the results obtained using
conventional iterative techniques and the proposed method has been
found. In addition, applying moment-matching technique results in one to
two orders of magnitude speed-up compared to conventional iterative
techniques
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on;
