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ABSTRACT: A concept of miniaturized and arrayed electron beam system using vertical interconnection was proposed and fabrication with interconnection using metal reflow was performed. The interconnection of electron beam array is very important because all single columns should be controlled individually to obtain a uniformity of electron beam array. In addition, the interconnection area should be reduced to make the size of a single column smaller. Therefore, a vertical interconnection method was proposed and the schematic of vertically interconnected monolithic microcolumn is shown. The other advantages of this vertical interconnection method are controllable columns and removal of interference between columns (Han, 2005).
Microprocesses and Nanotechnology Conference, 2005 International; 11/2005
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ABSTRACT: This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of microchannels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules (MCMs). In the numerical analysis, a parametric study was carried out for the factors affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular microchannels. In the experimental study, the cooling performance of the micro heat exchanger was tested on the prototypes of stacked MCMs with different channel dimensions. The simulation result and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.
Microsystem Technologies 09/2005; 11(11):1176-1186. · 0.93 Impact Factor
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ABSTRACT: The authors have successfully demonstrated an alternative method for high yield packaging process, offering a morphological insensitive and wafer level process. It enables not only the encapsulation to be hermetic but also the vias to be electrically-interconnected simultaneously. The mushroom structure of cap wafer makes the seal-line of solder void-free and the assembly process easier in wafer-alignment, giving room for the mismatched-volume between solder and trench. The mushroom structure is formed by SF<sub>6</sub>-based isotropic Si etch and the solder of Sn is electroplated by thick photoresist lithography. The vias are successfully sealed with solders shaped like a dome at the top corner and electrically interconnected. A gross leak detection of pressurized dye-penetration shows that this scheme is morphologically insensitive compared with the "face-to-face" bonding method.
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on; 07/2005
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ABSTRACT: Transient isotachophoresis (TITP) of a highly saline solution has been achieved on a polydimethylsiloxane chip of 18 mm × 12 mm. The microchannel dimensions were 30 μm in width and 30 μm in depth. The injection plug length was varied from 12 to 28 mm to inject samples of large volume while the total channel length was fixed at 75 mm. Chloride ions abundant in the saline sample and N-tris(hydroxymethyl)methyl-3-aminopropanesulfonate ions in the background electrolyte were used respectively as the leading and terminating electrolytes for TITP of anionic analytes fluorescein and 2,7-dichlorofluorescein. Electrokinetic injection of a large volume sample and subsequent TITP process were performed with simple electric controls. Five hundred-fold improvement in 250 mM NaCl solution could be achieved in 2 min and the limit of detection (S/N = 3) was estimated as 3 pM in our home-made laser induced fluorescence setup with BGE of 95 mM TAPS and 73 mM TEA, and 0.05 vol.% FC-PN (pH 9.0). The real-time progress of TITP on a microchip was also visualized using a video microscope.
Sensors and Actuators B: Chemical.
