T. Lessio

Publications (4)0 Total impact

• Source

  Available from: unina.it

  Conference Proceeding: Efficient evaluation of the frequency-dependent impedance matrix of full-package structures

  A.G. Chiariello, A. Girardi, C. Iorio, R. Izzi, T. Lessio, A. Maffucci, S. Ventre
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  ABSTRACT: The paper deals with the problem of the efficient extraction of the impedance matrix for a complex full-package structure. This result applies to ranges from DC to frequencies for which the skin effect is pronounced but the radiation and other full-wave effects are still negligible. The model identifies the impedance matrix by enforcing a physically consistent behavior to the resistance and reactance of the package in the low and high frequency limits. The identification is made by using only 5 frequency samples of the impedance matrix, which could be either given by measurements or numerical simulations. In this paper we have used a commercial 3D electromagnetic code (FastHenry) to provide the 5 starting points and the reference values to validate the procedure. Benchmark tests and case-studies are carried out, confirming the accuracy of the model.
  Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on; 06/2010
• Source

  Available from: I.s. Stievano

  Conference Proceeding: Characterization and modeling of the power delivery networks of memory chips

  I.S. Stievano, I.A. Maio, L. Rigazio, F.G. Canavero, R. Izzi, A. Girardi, T. Lessio, A. Conci, T. Cunha, H. Teixeira, J.C. Pedro
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  ABSTRACT: This paper focuses on the power delivery characterization of high-speed IC memories by means of on-chip measurements. A systematic analysis of the measurement setup, of the effects of chip biasing and of the use of the measured responses to develop models defined by simplified circuit equivalents is given. All the results collected in the paper are based on real measurements carried out on a commercial 90 nm flash memory.
  Signal Propagation on Interconnects, 2009. SPI '09. IEEE Workshop on; 06/2009
• Article: Modeling of IC power supply and I/O ports from measurements

  I. S. Stievano, L. Rigazio, I. A. Maio, A. Girardi, R. Izzi, F. Vitale, T. Lessio
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  ABSTRACT: This paper addresses the generation of behavioral models of digital ICs for signal and power integrity simulations. The proposed models are obtained by external port measurements and by the combined application of specialized state-of-the-art modeling techniques. The proposed approach is demonstrated on the I/O buffers and the core power supply ports of a commercial 90 nm flash memory.
  01/2009;
• Source

  Available from: Christophe Gaquière

  Conference Proceeding: MOCHA, MOdelling and CHAracterization for SiP -Signal and Power Integrity Analysis

  A. Girardi, A. Conci, R. Izzi, T. Lessio, F.G. Canavero, I.S. Stievano, H. Dudek, D. Hardisty, M. Tarantini, M. Dieudonne, J. van Hese, T.R. Cunha, J.C. Pedro, C. Gaquiere, N. Vellas
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  ABSTRACT: This paper describes the research activity that is being carried out in the MOCHA project, a cooperative R&D effort at the European scale. The aim of the project is to develop reliable modelling and simulation solutions for SiP design verification.
  Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on; 06/2008