H. Chung
National Defense University, Taiwan, Taoyuan City, Taiwan, Taiwan

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Publications (3)0 Total impact

  • Source
    Conference Proceeding: A reliability test on PBGA packaging through piezoresistive stress sensor
    C.H. Liu, H. Chung, D.W. Yang, K.F. Tseng, B.J. Lwo
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    ABSTRACT: Plastic packaging is the mainstream on microelectronic packaging technology at present. As the continuous requirements for smaller but higher density products, failure and reliability issues on MEMS/MOEMS packaging because of the hygroscopic swelling mismatch stress become more and more serious. To this end, this paper presented the stress monitoring methodologies as well as the reliability tests on a typical PBGA (Plastic Ball-Grid-Array) packaging due to hygroscopic effects through the measurements with the piezoresistive stress sensors. It is concluded from the experiments in this work that the hygroscopic mismatch stress is significant for the packaging, and the Weibull reliability model is suitable for the PBGA packaging. In addition, piezoresistive sensors were proven useful for monitoring the stress on the chip inside the packaging structure.
    Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on; 05/2009
  • Conference Proceeding: On the study of MOSFET micro-sensors for electronic packaging
    M.I. Yang, Y.C. Chao, K.-F. Tseng, H. Chung, C.P. Tang, B.-J. Lwo
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    ABSTRACT: The purpose of this paper is to study the MOSFET stress sensor behaviors and to develop the related measurement methodology. With the newly developed technology, the piezoresistance coefficients of the MOSFET were extracted, and the strain and temperature effect induced MOSFET characteristics were obtained. The results of this study can be used to adjust the chip structure in a packaging so that the optimal packaging technology and material can be chosen, and accuracies of the numerical analysis can be verified through experimental data with the new technology studied in this paper.
    Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on; 12/2007
  • Source
    Article: A Reliability Test on PBGA Packaging Through Piezoresistive Stress Sensor
    C.-H. Liu, H. Chung, D.-W. Yang, K.-F. Tseng, B.-J. Lwo
    [show abstract] [hide abstract]
    ABSTRACT: Plastic packaging is the mainstream on microelectronic packaging technology at present. As the continuous requirements for smaller but higher density products, failure and reliability issues on MEMS/MOEMS packaging because of the hygroscopic swelling mismatch stress become more and more serious. To this end, this paper presented the stress monitoring methodologies as well as the reliability tests on a typical PBGA (Plastic Ball-Grid-Array) packaging due to hygroscopic effects through the measurements with the piezoresistive stress sensors. It is concluded from the experiments in this work that the hygroscopic mismatch stress is significant for the packaging, and the Weibull reliability model is suitable for the PBGA packaging. In addition, piezoresistive sensors were proven useful for monitoring the stress on the chip inside the packaging structure.

Institutions

  • 2007
    • National Defense University, Taiwan
      Taoyuan City, Taiwan, Taiwan
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