Byoung Hwa Lee

Publications (2)0 Total impact

• Source

  Available from: emc-center.org

  Conference Proceeding: Inductance calculations for advanced packaging in high-performance computing

  Hocheol Kwak, K. Haixin, T. Hubing, Byoung Hwa Lee
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  ABSTRACT: Effective decoupling is crucial for the optimum performance of the power distribution network in an electronic system. As component packaging technologies evolve enabling tighter integration and faster operation of electronic systems, it is important to develop better decoupling strategies. This paper describes several new or proposed packaging structures and evaluates the connection inductance associated with possible decoupling capacitor locations. As expected, connections made on the chip tend to have a lower inductance than connections made on the package; and connections made on the package tend to have a lower inductance than connections made to the board. This illustrates the importance of providing decoupling capacitance as close to the chip as possible in order to maximize the effective bandwidth of the power distribution network.
  Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on; 09/2008
• Source

  Available from: clemson.edu

  Conference Proceeding: Plate Orientation Effect on the Inductance of Multi-Layer Ceramic Capacitors

  Hocheol Kwak, Haixin Ke, Byoung Hwa Lee, T. Hubing
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  ABSTRACT: Various multi-layer ceramic capacitor (MLCC) geometries with horizontally and vertically oriented plates are modeled to determine the equivalent series inductance. It shows that the plate stack location and dimensions (independent of plate orientation) are the most significant factors affecting the inductance.
  Electrical Performance of Electronic Packaging, 2007 IEEE; 11/2007