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ABSTRACT: This paper presents the design of serial chip-to-chip communication at 20 Gbps including modeling and correlation for PCBs (Printed Circuit Boards) with FR4 substrate materials. The entire channel under investigation includes two packages, a 21-layer ceramic and a 12-layer organic, and a 22-layer PCB. A probing station, microprobes and a VNA are used to measure the entire channel S-parameters and the measurement is correlated to the simulation up to 20 GHz. Extended study for the channel with low loss PCB substrate material is simulated. Time-domain eye comparisons for the FR4 channel, low loss channel, and the FR4 channel with equalization are given. A general design rule as well as new technologies for the high-speed channel design at 20 Gbps and beyond are discussed and given in the conclusion.
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on; 08/2010
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ABSTRACT: In this paper, the analysis of the signal integrity and the power integrity (PI) performance of different types of electromagnetic bandgap structures (EBGs) in presence of differential (DIFF) striplines is proposed. Four different configurations of 2-D embedded EBG layers are analyzed. A test vehicle consisting in a 12-layer printed circuit board in standard FR4 material is built, and the measured results (validated by means of 3-D electromagnetic simulations) are used to estimate the signal quality in terms of the transmission parameter S<sub>21</sub>, time-domain reflectometry, and eye pattern at the terminations. The PI is, instead, analyzed by means of the noise coefficient from the source to different positions along the planes (S<sub>21</sub>). Results confirm the reliability of 2-D EBGs for noise mitigation and the enhancement in the signal quality when DIFF signals are used.
IEEE Transactions on Electromagnetic Compatibility 06/2010; · 1.18 Impact Factor
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ABSTRACT: The ground surface perturbation lattice (GSPL) structure is proposed to suppress parallel-plate noises by embedding metal crystals into power/ground planes. The design idea is similar to the photonic crystal power/ground layer (PCPL), consisted in high permittivity dielectric material rods embedded between power and ground layer. In contrast to the PCPL structure, the GSPL can be fabricated without employing high cost material and by using standard PCB/package manufacturing process; therefore it is more suitable for real world applications. In this study, it is discussed how the parameters of the GSPL structure influence the bandgap and how to design the GSPL in order to replace PCPL.
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on; 05/2010
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ABSTRACT: This paper investigates the suppression of unwanted noise in high speed power buses by the adoption of photonic crystal power/ground layer (PCPL) structure. The performance of PCPL with different densities of high dielectric rods is analyzed in terms of S-parameters and electric field distribution. An attempt is made in order to relate geometrical properties (like rods' density and filling ratio) to the shift of the central frequency of the band gaps a well as bandwidth. The simulated results are validated by means of comparison with measured data.
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on; 09/2009
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ABSTRACT: The present paper investigates the sensitivity of the transmission properties of a simple stripline model to the copper surface roughness. Different profiles are modeled and analyzed by means of three dimensional full wave numerical simulations. Hammerstad and Jensen analytical formulation is demonstrated to be valid only for a specific profile of surface roughness. A visual basic macro is implemented in order to model random distribution of surface roughness profiles. Numerical results show in this case similar performance of the stripline model.
Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on; 10/2008
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ABSTRACT: In this work the analysis of the signal and the power integrity performances of two different types of EBG structures in presence of single ended and differential striplines is proposed. The two EBG patterns have square patches and double L or meandered branches. The signal quality is measured in terms of the transmission parameter S<sub>21</sub> and the eye pattern at the terminations; the power integrity is instead analyzed by means of the noise coefficient from the source to different positions along the planes.
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on; 06/2008
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A.C. Scogna
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ABSTRACT: This paper describes the parallel-plate waveguide (PPW) noise mitigation by means of shorting vias and/or Virtual Island. The proposed method is already know in literature, nevertheless important considerations are here addressed: 1) the same noise mitigation level proposed in [S. Nam et. al., IEEE Trans. on Microwave Theory and Technique (2005)] can be achieved by using only shorting vias, 2) the noise mitigation is strictly related to the number of shorting vias, the position and the distance from the signal via, 3) -60 dB noise suppression is obtained when array of shorting vias is used. The mitigation level is investigated both in time domain and frequency domain. Different configurations are studied and the impact of power plane with etched slots due to Virtual Islands on the signal integrity is also analyzed by evaluating TDR and insertion loss of a single-ended microstripline passing from top to bottom layer by means of a through via.
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on; 08/2007
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A.C. Scogna
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ABSTRACT: Aim of this paper is to describe the simultaneous switching noise (SSN) mitigation by means of a novel electromagnetic band gap (EBG) structure with triangle patches and hexagonal array. The proposed EBG structure allows achieving -40 dB stop band within the frequency range 6.5-9 GHz. Parametric analysis including the radius effect of the metal plated vias, the via length and the distance between the patches is performed by means of full wave simulations, based on the Finite Integration Technique. The impact of the proposed design on the signal integrity is also investigated both in time domain (eye-diagrams and TDR) and frequency domain (S-parameters). Finally dispersion diagrams of the singular unit EBG cell are analyzed by means of eigenmode solver and periodic boundary conditions.
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on; 08/2007
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ABSTRACT: The high speed digital processing in modern electronic products has made more difficult the achievement of conformity about limits emissions. To verify the requirements of standards on these emissions the use of a metallic enclosure is often necessary: in this way the power radiated by the system is reduced. In this paper the radiated emissions and the shielding performance of a metallic rack with shielding springs are studied both by dedicated experiments and by simulations. An internal source represented by a loaded monopole antenna is used to investigate the radiated emissions at 3 meters from the box. A simplified model of the antenna is proposed in the numerical model and a good agreement over a frequency range up to 1 GHz is achieved between measured results and simulated results. Shielding Effectiveness is finally evaluated by means of two different kinds of source: 1) near field (internal source) and 2) far field (plane wave source).
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on; 08/2007
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ABSTRACT: The present paper investigates the sensitivity of on wafer interconnect to the Si CMOS process parameters. In particular the tapered (trapezoid) etching and the conductor surface profile (Rrms) of copper foils are numerically analyzed in order to quantify their effect on the electrical performance of a stripline structure. Line impedance, insertion loss and time signal attenuation are evaluated by means of three dimensional (3D) electromagnetic (EM) simulations. Hammerstad and Jensen analytical model is implemented and results are compared with those coming from the full 3D EM simulation model. Good agreement in the frequency range 0- 50 GHz is observed.
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on; 08/2007
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ABSTRACT: Aim of this paper is to describe the simultaneous switching noise (SSN) mitigation by means of a novel electromagnetic band gap (EBG) structure with double L metal patches and two connected branches. The proposed EBG achieves -40 dB of stop band over two distinctive frequencies range: 1 GHz - 4.3 GHz and 5.8 GHz - 8 GHz respectively. The impact of the proposed design on the signal integrity of a single-ended trace passing from the top layer to the bottom layer by means of two via transition is investigated in time domain by calculating eye-diagrams and time domain reflectometry (TDR). A partial EBG model is finally proposed to provide a better performance in term of signal quality while keeping the noise suppression level of the full EBG model.
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th; 07/2007
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ABSTRACT: The present paper investigates the power supply noise in multilayered IC packages and analyzes the effect of shorting vias. A full wave code, based on the Finite Integration Technique (FIT), is used for the numerical simulations and it is validated by means of measurements. Furthermore two different solvers are employed to verify the accuracy of the proposed model: time domain and frequency domain. Some results are addressed: 1) the use of shorting vias allows achieving more than 50% noise suppression and 2) the mitigation level is related to the distance of the shorting vias from the signal via. The signal integrity on a signal propagating from the top layer to the bottom layer of the considered IC package is studied by means of Scattering parameters (S-parameters) and time domain reflectometry (TDR). In particular it is found that the TDR evaluated for the model with closer shorting vias results in a larger impedance variation.
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on; 06/2007
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ABSTRACT: Aim of this paper is the validation in both frequency and time domain of the procedure to extract fully H-Spice compatible equivalent circuits of structures on printed circuit boards. The procedure is initiated by standard measurement of scattering parameters between 40 MHz to 20 GH. After the extraction of the equivalent circuit, the computed scattering parameters are compared with those measured. The same equivalent circuit is also used for transient analysis in order to compare TDR measurement and eye-pattern to a pseudo-random bit sequence with those coming from the simulations
Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on; 09/2005
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ABSTRACT: As digital circuits became faster and more power is involved, direct coupling in multilayer printed circuit boards (PCBs) among power (PWR) planes becomes a major concern for signal integrity (SI) and electromagnetic interference (EMI). Aim of this paper is to show how an electromagnetic wave can propagate between planes and therefore induce noise on the signals crossing the planes' pairs through vias eventually radiate from the edge of the board. More specifically our study focuses on the analysis of the noise which propagates from a power plane to another power plane due to their proximity, named cross-simultaneous switching noise (X-SSN). This effect can be mitigated by a careful analysis of the location of PWR and ground (GND) planes in the board stack-up which avoid the contiguity of two PWR planes. A test board is built and measurements are performed. These measurements are also compared with three dimensional numerical results.
Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on; 09/2005
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ABSTRACT: This paper is concerned with the usability of the feature selective validation (FSV) method for comparing validation data. It addresses how it can help in the validation process and how the resulting validation data can be interpreted. It does this by considering two different case studies. The first considers two approaches to modeling electric fields in an equipment rack, and the second compares a Spice model for coupled circuit boards with a reference full wave model. The paper concludes that while the single value summary metrics are helpful to give an overall level of agreement, the detailed point-by-point information is very helpful when considering how to improve the models or measurements involved.
Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on; 09/2005
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ABSTRACT: This paper uses a de-embedding procedure, based on measured and numerically computed S-parameters, to obtain the characterization of portions of a structure difficult to obtain by direct measurements. The results are validated by measurements and independent calculations.
IEEE Transactions on Advanced Packaging 12/2004; · 1.12 Impact Factor
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ABSTRACT: The paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation.
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on; 09/2004
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ABSTRACT: Signal integrity is concerned with such design issues as signal distortions caused by the effects of unmatched impedances, designed-in or parasitic capacitance/inductance and current return paths. It is of increasing importance because of the widespread use of high-speed digital circuitry and it is, therefore, a natural ally to EMC engineering. Circuit simulators, such as SPICE are widely used to analyze circuit performance, with significant success. More interest is being generated in mixed circuit/field models and full wave simulators in order to extend the applicability of signal integrity investigations. Like more established EMC studies, the validation of numerical models for this purpose is an issue to be addressed. This is particularly important, as the models may be required to compare complex valued data as opposed to only magnitude (or single valued data) as in the case of electric network characterization or equivalent circuit extraction. This paper considers how the feature selective validation (FSV) scheme can be applied to quantifying complex valued data.
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on; 09/2004
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ABSTRACT: In order to validate, by means of measurement, some existing equivalent circuit models for the bulk current injection (BCI) test, a procedure is proposed to develop a proper circuit model for the injection clamp and the obtained circuit is introduced into the global one representing the overall cable. A suitable experimental set-up has been built and used. The measured induced voltages at the terminations of shielded coaxial cables are compared with those computed by the equivalent circuit. Upper and lower bounds are quantified in order to assess the order of accuracy of the predicted results.
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on; 09/2004
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ABSTRACT: By means of an equivalent SPICE circuit of a two-parallel-wires shielded cable (twinax), the effects on the induced voltages at the cable's terminations during a bulk current injection are studied for different shield's grounding, different cable's asymmetries or unbalancing and different lengths of the cable. The analysis is carried out both in frequency and time domain.
IEEE Transactions on Electromagnetic Compatibility 06/2004; · 1.18 Impact Factor
