Hemorrhagic shock with delayed retroperitoneal hemorrhage after deployment of an inferior vena cava filter: report of a case.
ABSTRACT Although inferior vena cava (IVC) filter placement has demonstrated an excellent therapeutic efficacy in preventing pulmonary embolism, several filter-related complications have been reported. Among them, retroperitoneal hemorrhage due to IVC perforation is one of the most serious complications. We report herein a female patient who underwent TrapEase IVC filter placement with anticoagulation and thrombolytic therapy for treatment of pulmonary embolism, and later demonstrated hemorrhagic shock 5 days after filter placement. The patient's blood pressure stabilized after the anticoagulant therapy was stopped and she received a blood transfusion. We should therefore carefully observe patients after IVC filter placement, particularly those receiving simultaneous anticoagulation therapy.
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ABSTRACT: The increasing speed of advanced chip technologies has greatly challenged the interconnection methods and processes in order to achieve enhanced capability. We have successfully fabricated the solder bump and it's reflowing process for flip-chip bonding interconnection technique instead of conventional wire bonding for high speed devices. The lead (Pb: 350°C) and the Indium (In: 157°C) were used for solder bump and deposited by using thermal evaporation. The thickness of the deposited metal for solder bump was in the range of 5~6 μm thickness. Specially, to increase the accuracy and the reliability of the flip-chip bonding Technique, 3 layer thick photoresist about 30 μm was used to control the deposition area for solder bump. It was also used for the lift-off process of excess deposited metal for solder bump. The height of solder bump through the reflowing process was controlled in the range of 10~40 μm according to the deposited area and shape. Also, the deposited area and shape was one of the most important parameters for solder bump fabrication. In addition, it was found that an oxidized surface layer effects on the increased melting temperature of deposited metal for solder bump. In this process, the reflowing temperature of PB/In (60:40 wt%) solder bumps was 230±5°CCircuits and Systems, 1996., IEEE Asia Pacific Conference on; 12/1996
- Journal of vascular and interventional radiology: JVIR 09/2009; 20(8):1102-4. · 1.81 Impact Factor
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ABSTRACT: The introduction of removable inferior vena cava filters (IVCF) has created new options for the prevention of pulmonary embolisms in surgical trauma patients. We have observed increasing use in trauma patients. A retrospective analysis was carried out of 49 trauma patients out of 85 who received IVCFs at our level 1 trauma centre in 2008. The indications for IVCF placement were multiple trauma in 33 patients, severe head injury in 13 and spinal injury in 3 patients. Of the patients 34 underwent successful removal, 11 (22%) patients had had no retrieval attempt by December 2009 and attempts at removal were unsuccessful in 3 patients. The mean age of the patients was 33.3 years. In 2008 the vast majority of IVCFs were inserted for prophylaxis in trauma patients. To increase the number of retrieved IVCFs, responsibility for the removal should be clarified in every hospital. The indications, advantages, safety and also the design of IVCFs are still under debate. A randomized controlled trial is needed to determine the appropriate use and indications for this potentially useful device in trauma patients.Der Unfallchirurg 09/2010; 113(9):764-9. · 0.64 Impact Factor