Hemorrhagic shock with delayed retroperitoneal hemorrhage after deployment of an inferior vena cava filter: Report of a case
Division of Vascular Surgery, Hamamatsu University School of Medicine, 1-20-1 Handayama, Hamamatsu, Shizuoka, 431-3192, Japan.Surgery Today (Impact Factor: 1.53). 02/2007; 37(7):618-21. DOI: 10.1007/s00595-006-3450-z
Although inferior vena cava (IVC) filter placement has demonstrated an excellent therapeutic efficacy in preventing pulmonary embolism, several filter-related complications have been reported. Among them, retroperitoneal hemorrhage due to IVC perforation is one of the most serious complications. We report herein a female patient who underwent TrapEase IVC filter placement with anticoagulation and thrombolytic therapy for treatment of pulmonary embolism, and later demonstrated hemorrhagic shock 5 days after filter placement. The patient's blood pressure stabilized after the anticoagulant therapy was stopped and she received a blood transfusion. We should therefore carefully observe patients after IVC filter placement, particularly those receiving simultaneous anticoagulation therapy.
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ABSTRACT: The increasing speed of advanced chip technologies has greatly challenged the interconnection methods and processes in order to achieve enhanced capability. We have successfully fabricated the solder bump and it's reflowing process for flip-chip bonding interconnection technique instead of conventional wire bonding for high speed devices. The lead (Pb: 350°C) and the Indium (In: 157°C) were used for solder bump and deposited by using thermal evaporation. The thickness of the deposited metal for solder bump was in the range of 5~6 μm thickness. Specially, to increase the accuracy and the reliability of the flip-chip bonding Technique, 3 layer thick photoresist about 30 μm was used to control the deposition area for solder bump. It was also used for the lift-off process of excess deposited metal for solder bump. The height of solder bump through the reflowing process was controlled in the range of 10~40 μm according to the deposited area and shape. Also, the deposited area and shape was one of the most important parameters for solder bump fabrication. In addition, it was found that an oxidized surface layer effects on the increased melting temperature of deposited metal for solder bump. In this process, the reflowing temperature of PB/In (60:40 wt%) solder bumps was 230±5°CCircuits and Systems, 1996., IEEE Asia Pacific Conference on; 12/1996
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