Two-beam-current method for e-beam writing gray-scale masks and its application to high-resolution microstructures.
ABSTRACT A two-beam-current method is introduced for e-beam writing in the fabrication of gray-scale masks. Compared with the simpler single-current method, the two-beam-current method offers two important advantages: (a) it can achieve a much larger dynamic range for e-beam exposure; (b) the writing time for a gray-scale mask can be reduced when a large pattern is to be written. Here, the new method is first described in detail and its application to the fabrication of our new gray-scale mask is demonstrated. Then, the improved gray-scale masks were employed to fabricate large dynamic range, high-resolution micro-optical elements of less than a couple of micrometers depth, using deep ultraviolet lithography at 248 nm wavelength and an inductively coupled plasma reactive ion etching system.
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ABSTRACT: An experiment was performed on a new gray-scale mask material. The mask material is carbon based and has high attenuation in the deep ultraviolet spectral range. The experiment involves making a gray-scale mask for an axicon. Preliminary results show that gray-scale profiles of accurate transmittance functions can be fabricated. Potentially, the capability at deep ultraviolet wavelengths will allow the fabrication of high-resolution components. The high-attenuation characteristic will allow the production of microscale and mesoscale optics of more phase levels.Optics Letters 04/2004; 29(5):457-8. · 3.39 Impact Factor