Nanoscale memory devices.
ABSTRACT This article reviews the current status and future prospects for the use of nanomaterials and devices in memory technology. First, the status and continuing scaling trends of the flash memory are discussed. Then, a detailed discussion on technologies trying to replace flash in the near-term is provided. This includes phase change random access memory, Fe random access memory and magnetic random access memory. The long-term nanotechnology prospects for memory devices include carbon-nanotube-based memory, molecular electronics and memristors based on resistive materials such as TiO(2).
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ABSTRACT: Phase change random access memory (PCRAM) devices are usually constructed using tellurium based compounds, but efforts to seek other materials providing desirable memory characteristics have continued. We have fabricated PCRAM devices using Ga-doped In2O3 nanowires with three different Ga compositions (Ga/(In+Ga) atomic ratio: 2.1%, 11.5% and 13.0%), and investigated their phase switching properties. The nanowires (∼40 nm in diameter) can be repeatedly switched between crystalline and amorphous phases, and Ga concentration-dependent memory switching behavior in the nanowires was observed with ultra-fast set/reset rates of 80 ns/20 ns, which are faster than for other competitive phase change materials. The observations of fast set/reset rates and two distinct states with a difference in resistance of two to three orders of magnitude appear promising for nonvolatile information storage. Moreover, we found that increasing the Ga concentration can reduce the power consumption and resistance drift; however, too high a level of Ga doping may cause difficulty in achieving the phase transition.Nanotechnology 01/2014; 25(5):055205. · 3.84 Impact Factor
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ABSTRACT: Electroforming of metal-insulator-metal (MIM) diodes is a non-destructive dielectric breakdown process that changes the diode from its initial high resistance state (HRS) to a low resistance state (LRS). After electroforming, resistance switching memories (RSMs) use voltages to switch from HRS to LRS and back. Many MIM combinations are proposed for use in RSMs. In many cases conduction in the LRS is nearly temperature independent at low temperatures; an Ohmic contact with a barrier to electron injection of ∼0 eV results from electroforming. Electroforming of Al-Al2O3-Ag diodes with amorphous anodic Al2O3 thicknesses between 12 and 41 nm has been studied. Two anodizing electrolytes have been used; 0.1 M ammonium pentaborate (bor-H2O) and a solution of 0.1 M of ammonium pentaborate per liter of ethylene glycol (bor-gly). Polarization of Al2O3 and negative charge in Al2O3 are much larger when Al2O3 is formed in bor-H2O solution than when Al is anodized in bor-gly solution. Electroforming of Al-Al2O3-Ag diodes results in an Ohmic contact at the Al-Al2O3 interface, voltage-controlled negative resistance (VCNR) in the current-voltage (I–V) characteristics, electroluminescence (EL), and electron emission into vacuum (EM) from filamentary conducting channels. Two distinct modes of electroforming occur for Al-Al2O3-Ag diodes. α-forming occurs for 2.5 V ≲ VS ≲ 5 V, where VS is the applied voltage. It is characterized by an abrupt current jump with the simultaneous appearance of EL and EM. β-forming occurs for VS ≳ 7 V. I–V curves, EL, and EM develop gradually and are smaller than for α-forming. Electroforming occurs more readily for diodes with Al2O3 formed in bor-H2O that have greater defect densities. Fully developed I-V curves have similar VCNR, EL, and EM after α-forming or β-forming. A model is proposed in which excited states of F-centers, oxygen vacancies in amorphous anodic Al2O3, form defect conduction bands. Electroforming that results in an Ohmic contact requires injection of positive charge at the Al-Al2O3 interface. α-forming is the result of ionization of F-center recombination centers with energies that are close to the Al Fermi level. Hole injection by high-field ionization of valence band states of Al2O3 causes β-forming.Journal of Applied Physics 03/2012; 111(6). · 2.21 Impact Factor
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ABSTRACT: We report a modeling study of a conceptual nonvolatile memory cell based on inorganic molecular metal–oxide clusters as a storage media embedded in the gate dielectric of a MOSFET. For the purpose of this paper, we developed a multiscale simulation framework that enables the evaluation of variability in the programming window of a flash cell with sub-20-nm gate length. Furthermore, we studied the threshold voltage variability due to random dopant fluctuations and fluctuations in the distribution of the molecular clusters in the cell. The simulation framework and the general conclusions of our work are transferrable to flash cells based on alternative molecules used for a storage media.IEEE Transactions on Electron Devices 06/2014; 61(6):2019-2026. · 2.06 Impact Factor